ZEISS Crossbeam 750 FIB-SEM

Crossbeam 750 introduces a new Gemini 4 objective lens that enhances imaging performance and stability during milling. Combined with HDR Mill + SEM, it delivers live, high-resolution visibility, bringing buried features and delicate interfaces into view as they are exposed. This real-time insight allows users to confidently control endpoints, protect critical structures, and achieve precise sub-20 nm lamella preparation without the need for rework.

Crossbeam 750 enables deterministic lamella preparation by combining the Gemini 4 field-free objective lens with continuous SEM imaging during milling. High-resolution imaging lets users monitor interfaces in real-time, precisely align milling planes, and make fine adjustments before critical material is removed. With HDR Mill + SEM, buried features remain clearly visible throughout thinning —supporting confident endpoint control and repeatable sub-20 nm lamella preparation for advanced semiconductor structures such as fins, vias, and gate stacks.

ZEISS ZEN core EM software seamlessly integrates acquisition, control, and analysis for the most demanding Crossbeam 750 workflows. ZEN simplifies automated recipes, batch execution, and synchronized SEM/FIB operations. For downstream analysis, ZEISS arivis supports scalable, the ZEISS arivis suite extends capabilities within scalable, AI-driven image analysis. arivis Pro enables flexible multi-dimensional visualization and segmentation pipelines; arivis Hub accelerates and batches high-volume processing; and arivis Cloud provides cloud-based AI model training to automate and scale advanced analysis without coding. Together, these tools enhance nanofabrication, large-area imaging, and correlative workflows with reproducible, top-quality results.