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ZEISS Versa Microscopes 將如何幫助你的研究

在亞微米解析度下使用非破壞性3D X-ray成像探索更多訊息

極為多功能的ZEISS Versa 3D X射線顯微鏡（XRM）為廣泛的材料和工作環境提供卓越的3D影像品質和數據

Versa XRM採用基於同步加速器級光學和革命性的RaaD™ (Resolution at a Distance) 技術的雙級放大，即使在大的工作距離下也能實現高解析度，這相對於傳統的微型計算機斷層掃描來說是一個巨大的改進。非破壞性成像保留並擴展了寶貴樣本的使用，使4D和定點研究成為可能

擴展存取、生產力和性能 - ZEISS Versa 630
廣泛的能力範圍 - ZEISS Versa 620
更迅速的亞維米成像 - ZEISS Versa 610
使用的靈活度及便利性 - ZEISS XVersa 510

    
          ZEISS Versa XRM 突破性的成像
        
    查看ZEISS Versa 3D X-ray顯微鏡的亮點：非破壞性成像、更高的解析度與更高的生產力

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Versa 套組內容

1. .3D成像系統：您的指南，了解最廣泛的光學切片、電子顯微鏡和 X-ray 顯微鏡技術選擇。
2. Versa 510 : 亞微米 X-ray 成像：即使在大的工作距離下也能保持高解析度。
3. Versa 620 : 用於更快速的次微米成像的 X-ray 顯微鏡，適用於完整樣本。
4. 衍射對比斷層掃描：解鎖實驗室 X-ray 顯微鏡中的結晶學信息。
5. 了解實驗室中的 X-ray 斷層掃描，使用ZEISS 3D X-ray 顯微鏡。
6. 使用 X-ray 顯微鏡對硅陽極體積變化進行4D研究，適用於鈕扣電池。
7. 通過孔隙尺度分析來理解油氣儲層行為。
8. 了解地球科學中塑造宇宙最小尺度的基本過程。

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使每個Versa平台更強大的特點

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Watch this video and gain insights into the workflow guided by SmartShield.

SmartShield
輕鬆保護您的樣本以優化實驗裝置

SmartShield是一種可以保護您的樣本和顯微鏡的解決方案。這個自動碰撞避免系統在Scout-and-Scan控制系統中運行。它使您能夠比以往更自信地操作Versa。通過單擊一個按鈕，SmartShield會基於您樣本的尺寸創建一個數位保護層

使用SmartShield，您將獲得以下好處：

●簡化的樣本設置，提高操作效率。
●對於新手和高級用戶都提供更優越的使用體驗。
●保護您寶貴的樣本和您的投資。
●無妥協的掃描質量。
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Advanced Reconstruction Toolbox
Your Easy Access to the Latest Reconstruction Technology

先進的重建工具箱（ART）是一個創新平台，通過它，您可以持續訪問ZEISS的最新重建技術，以豐富您的研究並提高您的ZEISS Xradia 3D XRM的投資回報

ZEISS的這些獨特提供利用了人工智能以及對 X-ray 物理和客戶應用的深刻理解，以新穎而創新的方式解決了一些最困難的成像挑戰。這些可選模塊是基於工作站的解決方案，提供了易存取和使用的功能。

ART 模組包含:

DeepScout: DeepScout：由基於AI的深度學習技術支持，以高解析重建大體積數據。DeepScout實現了高生產量的大視野高解析度圖像。
DeepRecon Pro: DeepRecon Pro：對於重複和非重複工作流程，提高了高達10倍的生產力。DeepRecon Pro相比標準重建提供了卓越的圖像質量。
Materials Aware Reconstruction Solution (MARS): Metal artifact reduction made easy. MARS reduces multi-material artifacts, e.g., metal implants in bone and tissue, or solder balls on semiconductor packages.
PhaseEvolve: 用於低中密度樣本/高解析成像應用的增強圖像對比度。通過去除相位差條紋，改善分割效果
OptiRecon: 針對您的內部斷層掃描，可選擇以4倍至10倍的改進生產量，以獲得可接受的圖像質量，或以與標準（FDK）重建相同通量水平的改進圖像質量。

ART 模組的三種方便組合

AI Supercharger: DeepScout and DeepRecon Pro
Artifact Reduction package: PhaseEvolve and Material Aware Reconstruction Solution (MARS)
Recon package: OptiRecon and DeepRecon Pro

More about Advanced Reconstruction Toolbox
Contrast-Optimized Detector System

ZEISS X-ray microscopes (XRM) feature an innovative contrast-optimized detector system with multiple objectives at different magnifications. Each objective features optimized scintillators that deliver the highest absorption contrast details.

Known for their ability to achieve Resolution at a Distance (RaaD™), ZEISS Xradia Versa platforms allow high resolution imaging of a wide array of sample types and sizes over a long range of length scales.

With the 40X-Prime objective (blue), exclusive to ZEISS Xradia 630 Versa, the system achieves unparalleled resolution performance of 450-500 nm across the full range of energy, from 30 kV to 160 kV, delivering RaaD 2.0 to unlock entirely new application capabilities for researchers.
Wide Field Mode

Wide Field Mode (WFM) can be used to image across an extended lateral field of view. The wide lateral field of view can provide 3x larger 3D volume for large samples, or give a higher voxel density for a standard field of view. All Xradia Versa systems are capable of WFM with the 0.4x objective. In combination with Vertical Stitching, WFM enables you to image larger samples at exceptional resolution.

Versa 630

ZEISS Versa 630 3D expands the horizon of what researchers are able to achieve with their X-ray microscope. The system delivers breakthrough resolution performance, takes accessibility to the next level with an intuitive user experience, and accelerates productivity with faster time-to-results.
RaaD 2.0 high resolution across energies

Reimagined, redesigned user experience

100X throughput boost with game-changing AI
Versa 620

ZEISS Versa 620 unlocks new degrees of versatility for your research with non-destructive imaging at maximum flexibility to accelerate your research. Move from exploration to discovery in a seamless workflow. 600-family technical specs with a wider range of imaging options.
Automated, programmable filter changer

High aspect ratio tomography

Dual scan contrast visualization
Versa 610

ZEISS Versa 610 extends the limits of your exploration with innovative source and optics technology. Higher X-ray flux delivers faster tomography scans with industry-leading resolution and contrast.
500-nanometer spatial resolution

40 nm minimum achievable voxel

25-watt fast activation sealed source
Xradia 510 Versa

Xradia 510 Versa breaks the one-micron resolution barrier for 3D imaging and in situ / 4D investigations. ZEISS Xradia 510 Versa makes synchrotron-caliber research even more practical for mid-sized imaging centers and industrial laboratories.
700-nanometer spatial resolution

70 nm achievable voxel

10-watt sealed transmission source
See highlights

Versa 630

ZEISS Versa 630, with higher energy capabilities of the exclusive 40X Prime objective, enables you to push the limits of submicron imaging like never before.
The system achieves unparalleled resolution performance of 450-500 nm across the full range of energy, from 30 kV to 160 kV, unlocking entirely new capabilities for your research. NavX guides users through automated workflows with intelligent system insights to deliver results easily and efficiently. AI-based DeepScout changes the game for understanding your sample with throughput boosts 100 times faster.

More information

Xradia 630 Versa

ZEISS Xradia 630 Versa, with higher energy capabilities of the exclusive 40X Prime objective, enables you to push the limits of submicron imaging like never before. The system achieves unparalleled resolution performance of 450-500 nm across the full range of energy, from 30 kV to 160 kV, unlocking entirely new capabilities for your research. NavX guides users through automated workflows with intelligent system insights to deliver results easily and efficiently. AI-based DeepScout changes the game for understanding your sample with throughput boosts 100 times faster.

Breakthrough Resolution Performance to Expand Your Research Horizons

The ZEISS 40X-Prime Objective

With more X-ray photons available on ZEISS Xradia 600-series Versa, you can now achieve even faster time to results for varied samples without compromising resolution. Unique to ZEISS Xradia 630 Versa is the 40X-Prime (40X-P) objective lens.

ZEISS Xradia 630 Versa XRM, with the higher energy capabilities of the exclusive 40X-Prime (40X-P) objective, enables you to push the limits of submicron imaging like never before. Known for their ability to achieve resolution at a Distance (RaaD™), ZEISS Xradia Versa platforms allow high resolution imaging of a wide array of sample types and sizes over a long range of length scales.

With 40X-P, the system achieves unparalleled resolution performance of 450-500 nm across the full range of source voltage, from 30 kV to 160 kV, defining RaaD 2.0. Unlocking entirely new application capabilities for researchers, the ZEISS 40X-P objective enables ZEISS Xradia 630 Versa to push industry standards of submicron imaging resolution.

NavX User Interface

The physics of X-ray imaging can be complex, so ZEISS XRM researchers studied user habits, dove into their challenges, and employed human-centered design (HCD) principles to enable even the newest user in a busy environment to be immediately productive. NavX™, the new user interface for ZEISS Xradia 630 Versa, guides users through automated workflows with intelligent system insights and delivers experimental results more easily and efficiently while also allowing experienced users to explore the full versatility of the platform.

NavX enables you to automate your workflow and provides guidance on the impact the parameters you've chosen will have on your setup. That guidance is directly embedded in the software, taking you through choices in a natural and familiar way.

Additionally, the NavX File Transfer Utility (FTU) takes the data that is being produced by the microscope and automatically transfers it to other locations so that users have their data where they need it, when they need it. These advancements make NavX much more capable for remote operation, advancing user productivity.

NavX intuitive navigation follows the evolution of the XRM user base and revolutionizes X-ray navigation and control with seamless and integrated workflows complementing the planning and execution of advanced correlative workflows..

Flat Panel Extension

The flat panel extension (FPX), standard on your ZEISS Xradia 630 Versa X-ray microscope, further increases the versatility of the system, directly supporting the Advanced Reconstruction Toolbox’s AI-based DeepScout for deep learning and neural network training. Leverage FPX to perform a low resolution, large field of view, "scout” scans, and identify interior regions for higher resolution “zoom” scans on a variety of different sample types. The Volume Scout workflow streamlines this process within NavX.

Non-destructive three-dimensional grain map of an Armco iron sample

LabDCT Pro for diffraction contrast tomography (DCT)

Unlocking Crystallographic Information

LabDCT Pro for diffraction contrast tomography (DCT), available exclusively on Xradia 620 Versa, enables non-destructive mapping of grain orientation and microstructure in 3D. Direct visualization of 3D crystallographic grain orientation opens up a new dimension in the characterization of polycrystalline materials like metal alloys, geomaterials, ceramics, or pharmaceuticals.

LabDCT Pro supports specimens with crystal structures from cubic symmetry to systems with lower symmetry such as monoclinic materials
Acquire high resolution crystallographic information using the dedicated 4X DCT objective. For even larger samples, use large area mapping and increase your throughput with the Flat Panel Extension (FPX).
Obtain comprehensive 3D microstructure analysis from larger representative volumes and wide-ranging sample geometries
Investigate microstructural evolution with 4D imaging experiments.
Combine 3D crystallographic information with 3D microstructural features.
Combine modalities to understand structure-property relationships.

A reconstruction of the grain microstructure of Armco Iron, acquired with LabDCT. The grains are colored by crystallographic orientation, and the reconstruction reveals the true grain shape. The background shows an example of a diffraction pattern that is collected during the LabDCT acquisition.

Versa 620

Boost the performance of your Versa 620 and 630 to explore more with their advanced capabilities. Enhance absorption contrast for low-Z or similar-Z materials with the Dual Scan Contrast Visualizer (DSCoVer). Unlock 3D crystallographic information with laboratory-based Diffraction Contrast Tomography (LabDCT). Improve scan speed and accuracy of large or irregular samples with advanced acquisition techniques such as High Aspect Ratio Tomography (HART).

_{A reconstruction of the grain microstructure of Armco Iron, acquired with LabDCT. The grains are colored by crystallographic orientation, and reconstruction reveals the true grain shape. The background shows an example of a diffraction pattern that is collected during the LabDCT acquisition.}

More information

ZEISS Xradia 620 Versa automated filter changer, filter wheel

Achieve New Degrees of Freedom

With more X-ray photons available on ZEISS Xradia 600-series Versa, you can now achieve even faster time to results for varied sample sizes without compromising resolution. Xradia 620 Versa offers additional unique features and imaging capabilities.

Improve scan speed and accuracy of large or irregular samples with advanced acquisition techniques such as High Aspect Ratio Tomography (HART)
Automated Filter Changer (AFC) enables seamless filter changing without manual intervention, and your selection can be programmed and recorded for each recipe
Unlock crystallographic information in your own lab with the optional LabDCT

A single energy scan shows that aluminum and silicon are virtually identical (left side), with very similar grayscale contrast.

DSCoVer exclusively available on ZEISS Xradia 620 Versa enables separation of the particles. 3D rendering shows Aluminum/green; Silicates/red

Gain an Edge in Contrast

Dual Scan Contrast Visualizer (DSCoVer), exclusive to Xradia 620 Versa, extends the detail captured in a single energy absorption image by combining information from tomographies taken at two different X-ray energies. DSCoVer takes advantage of how X-rays interact with matter based on effective atomic number and density. This provides you with a unique capability for distinguishing, for example, mineralogical differences within rocks as well as among difficult-to-discern materials such as silicon and aluminum.

From Xradia Context microCT, to Xradia 510/520 Versa, and now with the addition of Xradia 610/620 Versa, you can field-convert your system to the latest X-ray microscope products.

Investment Protection

As your imaging needs evolve, so should your instrument. Unlike traditional microCT systems, the ZEISS Xradia Versa family is built on an established ZEISS 3D X-ray microscope platform that is upgradeable, expandable and reliable, paving the way for future enhancements and protecting your investment. Select the system that is right for you today and expand as your needs require.

Protect your investment by upgrading your system at any time with the latest capabilities and innovations
Constant development means that you can add advanced capabilities such as in situ sample environments, unique imaging modalities, and productivity enhancing modules
Field conversion from basic systems up to most advanced systems in most instances

Non-destructive three-dimensional grain map of an Armco iron sample with illustrations of the various grain analysis that can be performed on a typical LabDCT Pro dataset.

LabDCT Pro for diffraction contrast tomography (DCT)

Unlocking Crystallographic Information

✔ LabDCT Pro supports specimens with crystal structures from cubic symmetry to systems with lower symmetry such as monoclinic materials
✔ Acquire high resolution crystallographic information using the dedicated 4X DCT objective. For even larger samples, use large area mapping and increase your throughput with the Flat Panel Extension (FPX).
✔ Obtain comprehensive 3D microstructure analysis from larger representative volumes and wide-ranging sample geometries
✔ Investigate microstructural evolution with 4D imaging experiments.
✔ Combine 3D crystallographic information with 3D microstructural features.
✔ Combine modalities to understand structure-property relationships.

Non-contact, non-destructive measurement of a smartphone camera lens module. — When investigating a smartphone camera lens module in the assembled state, the assessment of geometrical properties requires a non-contact, non-destructive measurement method to quantify relational parameters. MTX allows the accuracy-verified measurement of properties like thickness of annular wedges, centration interlock diameters, gaps between wedges, lens- tolens tilt, or apex heights and centration. These parameters are important for functional inspection and the enhancement of manufacturing designs and processes, to enable production of versatile cell phone cameras.

Metrology Extension

Adding Measurement Accuracy to X-ray Microscopy

With the Metrology Extension (MTX) you turn your Xradia 620 Versa into a verified measurement accuracy system far beyond the limits of conventional CT technology. This is essential for academic and industrial labs where miniaturization and integration of components drive a growing demand for high-resolution metrology. Benefit from high resolution X-ray imaging combined with high-precision metrology.

✔ Leading CT metrology accuracy: Calibrated with MTX, ZEISS Xradia Versa provides a market-leading maximum permissible error value of MPE_SD = (1.9 + L/100) μm for measurements in small-scale volumes, where L is the measured length in mm.
✔ Small volumes at high resolution: MTX enables measurements with high dimensional accuracy within small reconstructed volumes of 125 mm³.
✔ Simple calibration workflow: The MTX package provides an integrated user-guided calibration workflow.
✔ Once the calibration routine has been executed, you perform precise measurements and make the data available to standard metrology software for further processing.

Polymer with urethane backbone. Imaging after in situ experiments. Simulation of fluid flow demonstrates permeability.

Versa 510

Benefit from the two-stage magnification technique offered by ZEISS Versa to uniquely achieve RaaD, which enables you to effectively study the widest range of sample sizes. Intuitive Scout-and-Scan control software enables a broad range of user skillsets in your busy lab.

_{Polymer with urethane backbone. Imaging after}_{in situ}_{experiments. Simulation of fluid flow demonstrates permeability. Courtesy National Chemical Laboratory, India}

More information

This is a new cartoon schematic to illustrate the magnification concept in the Versa X-ray Microscope XRM. The microscope uses a combination of geometric and optical magnification to produce a high resolution image of the sample. In this schematic, several of the high resolution objectives can be seen, as well as the 0.4X macro lens in the background. This system produces RaaD: Resolution at a Distance.

A Class Above MicroCT

Extend scientific research beyond the limits of projection-based microCT systems at submicron resolution with ZEISS Xradia 510 Versa XRM. Traditional computed tomography relies on a single stage of geometric magnification and maintaining high resolution for larger samples is impossible due to the longer working distances required. ZEISS Xradia Versa XRM feature a unique two-stage process based on synchrotron caliber optics. Multilength-scale capabilities enable you to image the same sample across a wide range of magnifications. An added benefit: ZEISS Xradia 510 Versa is easy to use by everyone in your busy lab.

✔ Reduce dependence on geometric magnification and maintain submicron resolution even at large working distances
✔ Experience versatility for wide range of materials, including soft and low Z, with unique contrast solutions that overcome the limitations of traditional computed tomography
✔ Characterize the microstructure of materials in their native-like environments in situ and study the evolution of properties over time (4D)

True Spatial Resolution

ZEISS XRM systems are specified on true spatial resolution, the most meaningful measurement of your microscope’s performance. Spatial resolution refers to the minimum separation at which two features can be resolved by an imaging system. You would typically measure it by imaging a standardized resolution target with progressively smaller line-space pairs. Spatial resolution accounts for critical characteristics such as X-ray source spot size, detector resolution, magnification geometry, and vibrational, electrical and thermal stability.

✔ 0.7 μm true spatial resolution with a minimum achievable voxel size of 70 nm
✔ Energy-tuned detectors enable highest resolution across broad ranges of sample types and densities
✔ Source operates across the entire application space (30-160 kV) with a wide range of detectors, eliminating the need for manual hardware reconfigurations

Pear imaged with absorption contrast – no visibility of cell walls.

Pear imaged with phase contrast, showing details of cell walls in normal cells and stone cells (bottom).

Reveal Hidden Details

Your imaging requires superior contrast capabilities to reveal details necessary to accurately visualize and quantify features. ZEISS Xradia Versa systems deliver flexible, high contrast imaging for even your most challenging materials–low atomic number (low Z) materials, soft tissue, polymers, fossilized organisms encased in amber, and other materials of low contrast.

Our comprehensive approach employs proprietary enhanced absorption contrast detectors that provide you with superior contrast by maximizing collection of low energy photons while minimizing collection of contrast-reducing high energy photons
Tunable propagation phase contrast measures the refraction of X-ray photons at material transitions to allow you to visualize features displaying little or no contrast during absorption imaging

The Versatile Advantage of RaaD

The Versatile Advantage of RaaD

The two-stage magnification technique offered by ZEISS Xradia Versa uniquely achieves Resolution at a Distance, or RaaD, which enables you to effectively study the widest range of sample sizes, including those within in situ chambers.

Images are initially magnified via geometric projection as with conventional microCT. The projected image is cast onto a scintillator, converting X-rays to a visible light image which is then optically magnified by microscope optics before acquisition by a CCD detector.

Reducing dependence on geometric magnification enables ZEISS Xradia Versa solutions to maintain submicron spatial resolution down to 500 nm at large working distances.
Tensile testing of laser welded steel under increasing load.

Push the Limits of Scientific Advancement

ZEISS Xradia X-ray systems provide the industry's premier 3D imaging solution for the widest variety of  in situ  rigs, from high-pressure flow cells to tension, compression, and thermal stages. Moving beyond the three dimensions of space, leverage the non-destructive nature of X-ray investigation to extend your studies into the dimension of time with 4D experiments.

These studies require samples to be further away from the X-ray source to accommodate various types of  in situ  rigs. On traditional microCT systems, this significantly limits the resolution achievable for your samples. ZEISS XRM are uniquely equipped with dual-stage magnification architecture with RaaD technology that enable the highest resolution for  in situ  imaging.

ZEISS Xradia XRM platforms can accommodate a variety of  in situ  rigs, from high-pressure flow cells to tension, compression, and thermal stages, to user-customized designs. You can add the optional  in situ  Interface Kit to your ZEISS Xradia XRM, which includes a mechanical integration kit, a robust cabling guide, and other facilities (feed-throughs) along with recipe-based software that simplifies your control from within the  Versa Scout-and-Scan user interface. When your needs require pushing the resolution limits of your  in situ  experiments, convert your ZEISS Xradia microCT or XRM to an Xradia 620 Versa X-ray microscope and leverage RaaD technology for the maximum performance tomographic imaging of samples within  in situ  chambers or rigs.
Begin Your Multi-Scale, Multi-Modal, Multi-Dimensional Microscopy with Non-destructive 3D Imaging

Because of the non-destructive nature of X-rays and the versatile array of sample types and sizes they are able to image, correlative microscopy often begins with, or is enabled by, ZEISS Xradia Versa XRM.

Using the Scout-and-Zoom capability of Versa, you are able to clearly define your region of interest (ROI) before sacrificing your sample to premature cutting or other sample prep. Rapidly scout at low resolution with a large field of view, and then zoom to the ROI at higher resolution, whether using the range of Versa objectives (up to 40X), nanoscale Xradia Ultra XRM, or ZEISS light, electron, or FIB-SEM microscopes. This prevents premature sample destruction and allows for maximum workflow efficiency while combining full sample context with key sample information.

Additionally, the ability to perform interior tomography, or to clearly see inside your sample in 3D, further reduces the risk of losing sight of your ROI. Achieve greater efficiency by pinpointing a specific “address” to which to navigate for accurate and efficient next steps for interrogating your sample.

Finally, examine your sample under varying conditions and over time with in situ and 4D studies before performing further analysis — chemical, surface, etc.— with other ZEISS modalities.

Leverage the widest array of microscopy solutions available — exclusively from ZEISS — to perform multi-modal, multi-lengthscale, multi-dimensional analyses, by starting with non-destructive 3D X-ray microscopy.

Full correlative sample workflow for the project. Initial XRM scans highlight key areas for higher resolution imaging and target locations for thin section orientation within the volume. Subsequent 2D analysis includes electron and light microscopy, leading to correlation with in situ microanalytical data.

應用範例

工作中的ZEISS Versa

Sample courtesy of Kavan Hazeli, Mechanical and Aerospace Engineering, The University of Alabama, Huntsville
Additive manufactured lattice structure.

Additive manufactured lattice structure.
Sample courtesy of M.B. Østergaard, Dr. R.R. Petersen and Prof. Y. Yue (Aalborg University), and Dr. J. König (Jozef Stefan Institute)
Porous glass foam insulation imaged at multiple length scales.

Porous glass foam insulation imaged at multiple length scales.
Carbon fiber reinforced polymer composite.

Carbon fiber reinforced polymer composite.
Localized high resolution tomography and segmentation of multiple phases in concrete.

Localized high resolution tomography and segmentation of multiple phases in concrete.

Microscopy Solutions for Materials Science

Typical tasks and applications:

Characterize three-dimensional structure
Observe failure mechanisms, degradation phenomena, and internal defects
Investigate properties at multiple length scales
Quantify microstructural evolution
Perform in situ and 4D (time dependent) studies to understand the impact of heating, cooling, desiccation, wetting, tension, compression, imbibition, drainage and other simulated environmental studies
Understand the 3D structure of fibers as well as pores and pore pathways in paper
Observe the propagation of a crack inside your sample

Download the free whitepapers

The XRM micrograph of a blossom reveals its components in a new 3D view. Sepals (yellow) and petals (purple) can be distinguished.

The XRM micrograph of a blossom reveals its components in a new 3D view. Sepals (yellow) and petals (purple) can be distinguished.
Dragonfly, imaged in its native structure without any sample preparation and sectioning.

Dragonfly, imaged in its native structure without any sample preparation and sectioning.
Seeds are very solid and compact structures and their inside is difficult to image as a whole. The image shows the pre-shaped seed leaves which will contain the energy reservoir for the further growth of the plant.

Seeds are very solid and compact structures and their inside is difficult to image as a whole. The image shows the pre-shaped seed leaves which will contain the energy reservoir for the further growth of the plant.
Sample courtesy of Keith Duncan, Research Scientist, Donald Danforth Plant Science Center, St. Louis, MO
Embedded plant root in soil: the root can be recognized as a dominant structure within the soil which consists of grains of different sizes and shapes. Voxel size: 5.5 µm.

Embedded plant root in soil: the root can be recognized as a dominant structure within the soil which consists of grains of different sizes and shapes. Voxel size: 5.5 µm.

Applications in Life Sciences

Typical tasks and applications:

3D imaging of biological samples in their natural surroundings
Imaging of plant roots still embedded in their original soil without any special sample preparation
Imaging of fragile animal models and plants without any sample preparation and sectioning
Submicron imaging of solid structures like seeds as a whole

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Visualization of C4 bumps, TSVs, and Cu-pillar micro bumps in a 2.5D package, enabling high-resolution views from within the intact package, 1 µm/voxel.

Visualization of C4 bumps, TSVs, and Cu-pillar micro bumps in a 2.5D package, enabling high-resolution views from within the intact package, 1 µm/voxel.
Virtual cross section from the 2.5D package reveals solder cracks and voids in C4 bumps.

Virtual cross section from the 2.5D package reveals solder cracks and voids in C4 bumps.
DRAM package interconnect within a 10 mm x 7 mm x 1 mm package containing a 4-die stack. Solder extrusion is easily visualized in 3 dimensions, 0.8 µm/voxel.

DRAM package interconnect within a 10 mm x 7 mm x 1 mm package containing a 4-die stack. Solder extrusion is easily visualized in 3 dimensions, 0.8 µm/voxel.
Virtual cross section of micro bumps in a DRAM package. TSVs are 6 μm in diameter and micro bumps average 35 µm in diameter. Small solder voids of 2 μm are visible.

Virtual cross section of micro bumps in a DRAM package. TSVs are 6 μm in diameter and micro bumps average 35 µm in diameter. Small solder voids of 2 μm are visible.

Applications in Electronics & Semiconductor

Typical tasks and applications:

Perform structural and failure analysis for process development, yield improvement and construction analysis of advanced semiconductor packages, including 2.5/3D and fan-out packages
Analyze printed circuit boards for reverse engineering and hardware security
Non-destructively image across length scales from module to package to interconnect for submicron-resolution characterization of defects at speeds that can complement physical cross-sectioning
Enable better understanding of defect locations and distributions by viewing unlimited virtual cross-section and plan-view images from all desired angles

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Granulite facies metagabbro sample from the Lewisian complex that has been analyzed using Mineralogic 3D software for quantitative analysis of mineralogy, grain size, shape, and distributions, as well as mineral relationships, inclusion assemblages and more all prior to destructive sample preparation.

Granulite facies metagabbro sample from the Lewisian complex that has been analyzed using Mineralogic 3D software for quantitative analysis of mineralogy, grain size, shape, and distributions, as well as mineral relationships, inclusion assemblages and more all prior to destructive sample preparation.
Individual gold grain identified from population of ~26,000 pyrite grains.

Individual gold grain identified from population of ~26,000 pyrite grains.
Multiscale non-invasive characterization of sandstone core, showing high quality non-invasive interior tomography and integrated pore scale analytical investigation (showing pore separation).

Multiscale non-invasive characterization of sandstone core, showing high quality non-invasive interior tomography and integrated pore scale analytical investigation (showing pore separation).
Traditional absorption contrast image of disaggregated olivine.

Traditional absorption contrast image of disaggregated olivine.
Individual sub-crystals identified using LabDCT Pro on disaggregated olivine.

Individual sub-crystals identified using LabDCT Pro on disaggregated olivine.

Microscopy Solutions for Raw Materials

Typical tasks and applications:

Achieve automated mineralogy in 3D with little to no sample prep
Perform multiscale pore structure and fluid flow analysis, directly measure fluid flow using in situ flow equipment
Perform non-destructive scout scans and cut to ROI for buried structures in metamorphic rocks
Analyze grain orientations in steel and other metals

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Test part supplied by LZN and Liebherr
Surface roughness evaluation of an AM printed duct (Ti-6Al-4V); high resolution scan acquired at ~1.7 mm voxel over a ~3.4 mm area.

Surface roughness evaluation of an AM printed duct (Ti-6Al-4V); high resolution scan acquired at ~1.7 mm voxel over a ~3.4 mm area.
Imaging of different A205 AM powder qualities at 3.9 µm voxel resolution.

Imaging of different A205 AM powder qualities at 3.9 µm voxel resolution.
Sample courtesy of Timo Bernthaler, University of Aalen
Inner structure of an AM manufactured aluminum gear wheel; 3 µm voxel resolution imaging is used to see unmelted particles, high-Z inclusions, and small voids.

Inner structure of an AM manufactured aluminum gear wheel; 3 µm voxel resolution imaging is used to see unmelted particles, high-Z inclusions, and small voids.
Test part by LZN and Liebherr
ISO 25178 surface roughness evaluation of a Ti-6Al-4V test sample. Results are very similar between XRM and ZEISS Smartproof 5 confocal microscope.

ISO 25178 surface roughness evaluation of a Ti-6Al-4V test sample. Results are very similar between XRM and ZEISS Smartproof 5 confocal microscope.

Microscopy Solutions for Additive Manufacturing

Typical tasks and applications:

Detailed shape, size, and volume distribution analysis of particles in Additive Manufacturing (AM) powder bed to determine proper process parameters
High-resolution, non-destructive imaging for microstructural analysis of AM parts
3D imaging for comparison with the nominal CAD representation
Detection of unmelted particles, high-Z inclusions, and voids
Surface roughness analysis of inner structures that cannot be accessed by other methods

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Intact cylinder cell (160 kV) – welding burrs, metallic inclusions, folds and kinks in conductive layers.

Intact cylinder cell (160 kV) – welding burrs, metallic inclusions, folds and kinks in conductive layers.
Large pouch cell (120 kV) – failure analysis, swelling, wetting, electrolyte gas evolution.

Large pouch cell (120 kV) – failure analysis, swelling, wetting, electrolyte gas evolution.
Small pouch cell (80 kV) – in situ microstructure, aging effect at cathode grain level, separator layer.

Small pouch cell (80 kV) – in situ microstructure, aging effect at cathode grain level, separator layer.
Small pouch cell: 0.4x overview scan; 4x Resolution at a Distance; 20x RaaD.

Small pouch cell: 0.4x overview scan; 4x Resolution at a Distance; 20x RaaD.

Microscopy Solutions for Lithium Ion Batteries

Typical tasks and applications:

Recipe development and supply chain control: inspection of intact samples for effective supplier control, revealing changes in recipe or cost savings that may affect performance or longevity
Safety and quality inspection: Identification of debris, particle formation, burrs at the electrical contact or damage to the polymer separator
Lifetime and aging effect: Longitudinal studies of aging effects

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Accessories

Upgrade your microscope with additional accessories to enhance its capabilities

Autoloader

Maximize Your Instrument’s Utilization

Maximize use and minimize user intervention with the optional ZEISS Autoloader. Reduce the frequency of user interaction and increase productivity by enabling multiple jobs to run. Load up to 14 sample stations, which can support up to 70 samples, queue, and allow to run all day, or off-shift.

In Situ Interface Kit

Push the Limits of Scientific

ZEISS platforms can accommodate a variety of in situ rigs, from high-pressure flow cells to tension, compression, and thermal stages, to user-customized designs. Moving beyond the three dimensions of space, leverage the non-destructive nature of X-ray investigation to extend your studies into the dimension of time with 4D experiments.

Visualization and Analysis

ZEISS Recommends Dragonfly Pro

An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, SEM and helium ion microscopy. Available exclusively through ZEISS, ORS Dragonfly Pro offers an intuitive, complete, and customizable toolkit for visualization and analysis of large 3D grayscale data. Dragonfly Pro allows for navigation, annotation, creation of media files, including video production, of your 3D data. Perform image processing, segmentation, and object analysis to quantify your results.

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ZEISS Versa Microscopes 將如何幫助你的研究

ZEISS Versa XRM 突破性的成像

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Versa 套組內容

使每個Versa平台更強大的特點

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SmartShield

Third-party Content Blocked

Advanced Reconstruction Toolbox

Contrast-Optimized Detector System

Wide Field Mode

Versa 630

Versa 620

Versa 610

Xradia 510 Versa

Third-party Content Blocked

Versa 630

Third-party Content Blocked

Xradia 630 Versa

Breakthrough Resolution Performance to Expand Your Research Horizons

NavX User Interface

NavX User Interface

Flat Panel Extension

Non-destructive three-dimensional grain map of an Armco iron sample with illustrations of the various grain analysis that can be performed on a typical LabDCT Pro dataset.

LabDCT Pro for diffraction contrast tomography (DCT)

Versa 620

Achieve New Degrees of Freedom

Gain an Edge in Contrast

Investment Protection

LabDCT Pro for diffraction contrast tomography (DCT)

Metrology Extension

Versa 510

A Class Above MicroCT

True Spatial Resolution

Reveal Hidden Details

The Technology Behind Versa X-ray Microscopes

The Versatile Advantage of RaaD

Push the Limits of Scientific Advancement

Begin Your Multi-Scale, Multi-Modal, Multi-Dimensional Microscopy with Non-destructive 3D Imaging

應用範例

Microscopy Solutions for Materials Science

Applications in Life Sciences

Applications in Electronics & Semiconductor

Microscopy Solutions for Raw Materials

Microscopy Solutions for Additive Manufacturing

Microscopy Solutions for Lithium Ion Batteries

Accessories

Autoloader

In Situ Interface Kit

Visualization and Analysis

Download the free whitepapers & application brochure

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