
Electronics
Emerging Microscopy Solutions for Electronic Packaging & Materials
Parallel advances in FIB-SEM and 3D X-ray have radically changed microscopy sample preparation and analysis. This opens new capabilities for semiconductor research, development and failure analysis.
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Transform Your Sample Prep and Site-specific Analysis with Efficient Workflows

How can we help you? Contact us to speak directly with a ZEISS representative about the specific needs of your facility.