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Front view of the ZEISS VersaXRM 730 X-ray microscope with integrated ZEN navx software workstation.
Ultimate performance 3D X-ray microscopy

ZEISS VersaXRM 730

Characterize the most demanding samples across scales with highest-resolution performance, maximum throughput, automation, and advanced X-ray microscopy capabilities.

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Complex samples require more than a single 3D image. They require structural context, targeted high-resolution characterization, and preservation of relationships across length scales. ZEISS VersaXRM 730 delivers ultimate performance for rigorous, multi-step imaging environments. Highest-resolution performance, Resolution at a Distance™ (RaaD™), guided 3D navigation, maximum throughput, automation, and advanced reconstruction help teams characterize difficult internal structures non-destructively while preserving the context needed for confident interpretation.

  • Resolve fine details in the most demanding samples

Highest-resolution VersaXRM performance supports detailed characterization of challenging materials, advanced assemblies, dense samples, and difficult-to-access regions of interest.

  • Maximize throughput across advanced imaging

Automation, recipe-based operation, and workflow flexibility help reduce manual intervention and support demanding, multi-sample studies.

  • Extend characterization with advanced techniques

Laboratory-based diffraction contrast tomography, high aspect ratio tomography, and advanced reconstruction expand the questions that can be addressed in 3D.

Ultimate performance for the most demanding XRM applications

ZEISS VersaXRM 730 combines highest-resolution performance with maximum throughput, automation, and flexibility for the widest range of samples and advanced imaging needs.

Interior of the ZEISS VersaXRM 730 showing automated imaging hardware, including the sample stage and integrated automation components.
Interior of the ZEISS VersaXRM 730 showing automated imaging hardware, including the sample stage and integrated automation components.

Integrated automation features—including the motorized filter wheel, Autoloader compatibility, and recipe-based operation—help reduce manual intervention while increasing throughput and reproducibility.

Integrated automation features—including the motorized filter wheel, Autoloader compatibility, and recipe-based operation—help reduce manual intervention while increasing throughput and reproducibility.

Maximum throughput, automation, and flexibility

An integrated motorized filter wheel, Autoloader support, recipe-based scanning, and instrument control APIs help reduce manual intervention and increase productivity. VersaXRM 730 is designed for the widest range of samples and advanced imaging sequences in high-demand environments.

Resolution target demonstrating the imaging performance of the ZEISS VersaXRM 730 with the 40× Prime objective for high-resolution 3D X-ray microscopy.
Resolution target demonstrating the imaging performance of the ZEISS VersaXRM 730 with the 40× Prime objective for high-resolution 3D X-ray microscopy.

Resolution target captured with the VersaXRM 730 and 40× Prime objective, clearly resolving 450 nm (and finer) lines and spaces to support the most demanding high-resolution X-ray microscopy applications.

Resolution target captured with the VersaXRM 730 and 40× Prime objective, clearly resolving 450 nm (and finer) lines and spaces to support the most demanding high-resolution X-ray microscopy applications.

Highest-resolution performance for demanding samples

VersaXRM 730 supports the most demanding samples and applications with high-resolution 3D imaging at large working distance. Its optics and RaaD architecture help preserve sample context while revealing fine internal structures in challenging materials, dense samples, advanced assemblies, and difficult-to-access regions of interest.

Three-panel visualization generated with ZEISS LabDCT Pro showing crystallographic orientation, grain size distribution, and grain boundary characterization within a peridotite sample for non-destructive 3D materials analysis.
Three-panel visualization generated with ZEISS LabDCT Pro showing crystallographic orientation, grain size distribution, and grain boundary characterization within a peridotite sample for non-destructive 3D materials analysis.

ZEISS LabDCT Pro enables non-destructive 3D crystallographic characterization in the laboratory, revealing grain orientation, grain size, and grain boundary information throughout an entire sample volume without destructive sectioning.

ZEISS LabDCT Pro enables non-destructive 3D crystallographic characterization in the laboratory, revealing grain orientation, grain size, and grain boundary information throughout an entire sample volume without destructive sectioning.

Advanced techniques for breakthrough 3D characterization

Extend analysis beyond conventional absorption-based tomography with advanced techniques such as laboratory-based diffraction contrast tomography and high aspect ratio tomography. These capabilities support deeper characterization of crystallographic structure, complex geometries, and challenging internal features.

ZEN navx software interface showing Volume Scout workflow for navigating a 3D dataset and selecting a region of interest on the ZEISS VersaXRM 730.
ZEN navx software interface showing Volume Scout workflow for navigating a 3D dataset and selecting a region of interest on the ZEISS VersaXRM 730.

ZEN navx software streamlines multi-step investigations by guiding researchers from whole-sample visualization to precise region-of-interest targeting and high-resolution imaging.

ZEN navx software streamlines multi-step investigations by guiding researchers from whole-sample visualization to precise region-of-interest targeting and high-resolution imaging.

End-to-end performance for rigorous, multi-step imaging productivity

Guided 3D navigation, Volume Scout, high-resolution imaging, automation, and advanced reconstruction support complex investigations from initial sample context through targeted analysis and downstream interpretation. 

Key capabilities for demanding 3D X-ray microscopy

ZEISS VersaXRM 730 combines highest-resolution multi-scale imaging, guided 3D navigation, automation-ready operation, and advanced reconstruction for detailed characterization of complex internal structures.

  • Capture the broader structural context

    A large field of view scan captures an entire electronics board assembly with FPX detector.

    A large field of view scan captures an entire electronics board assembly with FPX detector.

    Begin with the larger view of the sample before moving into high-resolution analysis. VersaXRM 730 helps establish overall architecture, identify regions of interest, and preserve relationships between structures.

    Use this to:

    • Analyze large or heterogeneous samples
    • Establish internal structure before detailed characterization
    • Identify where higher-resolution imaging is needed
    • Preserve context for interpretation and downstream analysis

  • Localize internal features precisely

    Three-dimensional rendering of an unstained mouse embryo with enlarged views of internal organs. Sample and images courtesy of Mass General Hospital.

    Capture the complete anatomy of an unstained mouse embryo while examining individual organs in three dimensions from a single dataset. Sample and images courtesy of Mass General Hospital.

    Target buried or difficult-to-access internal features directly in 3D. Guided navigation and Volume Scout help move from overview imaging to localized characterization with fewer manual steps and greater certainty.

    Use this to:

    • Navigate directly within 3D datasets
    • Define internal regions of interest
    • Reduce guesswork before high-resolution scans
    • Support failure analysis and targeted investigations

  • Increase detail for deeper characterization

    X-ray image of a MEMS gyroscope with a magnified inset highlighting internal microstructures.

    Non-destructive X-ray imaging visualizes buried structures within a MEMS gyroscope to support semiconductor packaging and failure analysis.

    VersaXRM 730 supports high-resolution 3D imaging of internal structures that require fine detail, contrast, and stability.

    Use this to:

    • Analyze fine internal structures non-destructively
    • Characterize interfaces, pores, cracks, and inclusions
    • Support demanding materials and semiconductor applications
    • Generate detailed 3D data for interpretation and correlation

  • Automate repeatable imaging sequences

    Interior of the ZEISS VersaXRM 730 showing the integrated X-ray source and motorized filter wheel.

    Integrated filter wheel enables automated filter selection, supporting repeatable imaging workflows and higher-throughput operation.

    Automation-focused operation helps improve consistency and throughput for repeated scan recipes, multiple samples, and standardized characterization approaches.

    Use this to:

    • Improve productivity across repetitive imaging
    • Support consistent operation in high-demand labs
    • Reduce manual scan setup
    • Increase confidence in repeatable results

  • Interpret complex datasets efficiently

    Three-dimensional rendering of a metallic lattice colored by crystallographic grain orientation alongside the reconstructed microstructure. Sample courtesy: Dr. Sammy Shaker, CalTech, USA.

    LabDCT Pro combines crystallographic orientation data with three-dimensional microstructure to characterize grain structure throughout a metallic lattice. Sample courtesy: Dr. Sammy Shaker, CalTech, USA.

    Reconstruction and visualization tools help teams move from data acquisition to meaningful interpretation more efficiently.

    Use this to:

    • Improve visualization of subtle features
    • Reduce artifacts in complex samples
    • Accelerate interpretation of large datasets
    • Support efficient insight generation across demanding applications

Related applications

VersaXRM 730 supports rigorous, high-performance characterization across demanding research, development, and industrial environments.
Select a category Materials research
Materials research
Semiconductors & electronics
Industrial research
Life sciences research
Geology & mining
3D rendering of an additively manufactured lattice with a segmented internal region highlighted in green. Sample courtesy of Prof. Giorgia Franchin, University of Padua.

Materials research, energy materials & batteries

3D rendering of an additively manufactured lattice with a segmented internal region highlighted in green.
Sample courtesy of Prof. Giorgia Franchin, University of Padua

3D rendering of an additively manufactured lattice with a segmented internal region highlighted in green.
Sample courtesy of Prof. Giorgia Franchin, University of Padua

Materials research, energy materials & batteries

Materials research depends on connecting internal structure to performance, failure, and evolution over time. ZEISS VersaXRM 730 enables non-destructive, multiscale imaging that links sample-scale context to high-resolution investigation of critical internal features. From advanced materials development to battery and energy materials research, researchers can analyze microstructure, degradation mechanisms, and in situ processes to better understand performance and lifetime.

Explore materials research workflows
3D X-ray microscopy rendering of solder interconnects on a smartphone circuit board, highlighting defects including solder non-wets and crack formation.

Semiconductors & electronics

3D X-ray microscopy rendering of solder interconnects on a smartphone circuit board, highlighting defects including solder non-wets and crack formation.

3D X-ray microscopy rendering of solder interconnects on a smartphone circuit board, highlighting defects including solder non-wets and crack formation.

Semiconductors & electronics

Advanced semiconductor packages, heterogeneous devices, and high-density assemblies make internal failure analysis increasingly difficult. VersaXRM 730 helps localize buried defects, preserve evidence, and move from detection to root-cause analysis with high-resolution 3D information.

Explore semiconductor workflows
3D rendering of an additively manufactured lattice with a highlighted internal region of interest.

Industrial research

3D rendering of an additively manufactured lattice with a highlighted internal region of interest.
Sample courtesy of Prof. Giorgia Franchin, University of Padua

3D rendering of an additively manufactured lattice with a highlighted internal region of interest.
Sample courtesy of Prof. Giorgia Franchin, University of Padua

Industrial research

Complex components and high-value assemblies often require detailed internal information without cutting or disassembly. VersaXRM 730 supports high-resolution evaluation of demanding geometries, interfaces, defects, and internal structures.

Explore industrial research workflows
Cross-sectional X-ray image of an unstained mouse embryo acquired with FAST Mode, showing internal anatomical structures.

Life sciences research

Cross-sectional X-ray image of an unstained mouse embryo acquired with FAST Mode, showing internal anatomical structures.
Sample collection courtesy of Danny Wescott, University of Texas at San Marcos, USA

Cross-sectional X-ray image of an unstained mouse embryo acquired with FAST Mode, showing internal anatomical structures.
Sample collection courtesy of Danny Wescott, University of Texas at San Marcos, USA

Life sciences research

Life sciences studies increasingly require intact 3D imaging, correlative microscopy, and scalable analysis of large datasets. VersaXRM 730 preserves spatial relationships while supporting high-resolution investigation of selected biological regions.

Explore life sciences workflows
Three-dimensional rendering of a copper-nickel ore sample with color-coded mineral phase segmentation.

Geology & mining

Three-dimensional rendering of a copper-nickel ore sample with color-coded mineral phase segmentation.

Three-dimensional rendering of a copper-nickel ore sample with color-coded mineral phase segmentation.

Geology & mining

Characterize natural materials in 3D while preserving valuable samples. Geoscience, mining, and oil and gas workflows often require internal information about rock fabric, mineral phases, pore networks, inclusions, and fluid pathways. VersaXRM 5 Insight supports non-destructive 3D analysis that can complement established 2D workflows and help users target downstream analysis more efficiently.

Explore geological research workflows

Advanced Reconstruction Toolbox

The ZEISS Advanced Reconstruction Toolbox extends VersaXRM 730 with reconstruction technologies that improve image quality, increase throughput, reduce artifacts, and support interpretation of complex datasets. A two-year DeepRecon Pro license is included with VersaXRM 730, while additional modules can be selected based on sample type, imaging challenge, and imaging needs.

X-ray microscopy image of a ceramic matrix composite sample showing conventional FDK reconstruction

FDK reconstruction 1x

Sample courtesy of Dr. David Marshall, Colorado University Boulder, USA
FDK reconstruction 1x
X-ray microscopy image of a ceramic matrix composite sample showing conventional FDK reconstruction 10x

FDK reconstruction 10x

Sample courtesy of Dr. David Marshall, Colorado University Boulder, USA
FDK reconstruction 10x
X-ray microscopy image of a ceramic matrix composite sample showing DeepRecon Pro reconstruction, highlighting reduced artifacts and improved visibility of internal pores and microstructural features.

DeepRecon Pro reconstruction 10x

Sample courtesy of Dr. David Marshall, Colorado University Boulder, USA
DeepRecon Pro reconstruction 10x

  • DeepRecon Pro

    DeepRecon Pro uses AI-assisted reconstruction to improve image quality and increase throughput across demanding applications.

    Use DeepRecon Pro to:

    • Increase throughput
    • Reduce noise and improve clarity
    • Support demanding imaging
    • Improve effectiveness in downstream analysis workflows

  • DeepScout

    DeepScout helps recover fine structural detail in larger scans, supporting high-resolution multi-scale characterization.

    Use DeepScout to:

    • Combine context with higher detail
    • Analyze larger volumes efficiently
    • Reduce field-of-view and resolution trade-offs
    • Support high-resolution multi-scale imaging

  • MARS

    Materials Aware Reconstruction Solution (MARS) enhances visibility and interpretation of complex samples with multiple materials or phases.

    Use MARS to:

    • Reduce artifacts
    • Improve visibility in complex samples
    • Support challenging materials datasets
    • Increase confidence in segmentation

  • PhaseEvolve

    PhaseEvolve improves contrast in low- and medium-density samples.

    Use PhaseEvolve to:

    • Enhance subtle features
    • Improve segmentation
    • Support low-contrast applications
    • Streamline analysis

  • OptiRecon

    OptiRecon helps balance image quality and throughput for demanding applications.

    Use OptiRecon to:

    • Optimize challenging datasets
    • Balance quality and speed
    • Support high-detail imaging
    • Improve reconstruction efficiency

Advanced technologies for high-performance X-ray microscopy

Three-dimensional X-ray rendering of a carburetor assembly showing detailed internal structures acquired using RaaD technology.
Three-dimensional X-ray rendering of a carburetor assembly showing detailed internal structures acquired using RaaD technology.

  • Resolution at a Distance for high-resolution internal imaging

    ZEISS Resolution at a Distance technology enables high-resolution imaging while preserving working distance. This is especially valuable for large or dense samples, complex holders, and in situ environments. RaaD helps maintain resolution performance without sample-preparation compromises such as trimming and refixturing that are often required by conventional microCT geometries.

  • ZEN navx for guided 3D imaging

    ZEN navx supports efficient X-ray microscopy with guided setup, tailored parameter optimization, and integrated 3D navigation. Volume Scout helps users select regions of interest and move through complex imaging sequences with greater confidence, while advanced controls remain available for demanding scans.

  • ZXR-1 source for high-performance VersaXRM imaging

    VersaXRM 730 is built around source and optics technologies designed for high-performance 3D X-ray microscopy. The system supports demanding imaging where stability, resolution, and long-term reliability are critical.

  • FAST mode for rapid tomography

    FAST mode supports rapid 3D acquisition by reducing the overhead associated with conventional step-and-shoot scanning. Combined with overview and navigation tools, it helps users move more quickly from initial sample assessment to targeted high-resolution analysis.

  • 3D crystallographic and contrast-enhanced imaging

    VersaXRM 730 supports advanced techniques beyond absorption-based tomography, including laboratory-based diffraction contrast tomography for 3D grain mapping and high aspect ratio tomography.

Downloads

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    Driving future innovation with the ZEISS X-ray source

    Exclusively on ZEISS VersaXRM 730 systems

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    LabDCT Pro on ZEISS VersaXRM 730

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  • Preview image of Perfect Tomographies. Every sample. Every user. Every time.

    Perfect Tomographies. Every sample. Every user. Every time.

    ZEISS VersaXRM 730

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  • Preview image of ZEN navx Intuitive Software for ZEISS 3D X-ray Microscopes

    ZEN navx Intuitive Software for ZEISS 3D X-ray Microscopes

    Naturally Taking You through Setting up an X-ray Scan.

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Services and support

VersaXRM 730 is backed by ZEISS service, training, and application expertise to help teams get the most from high-performance X-ray microscopy. From onboarding and method development to long-term service programs, ZEISS support helps maintain performance, improve productivity, and build confidence across demanding applications.

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FAQ

  • ZEISS VersaXRM 730 supports imaging that begins with broad sample context and moves into targeted high-resolution 3D analysis. Guided 3D navigation, RaaD technology, and reconstruction tools help localize internal structures, preserve spatial context, and characterize complex samples across scales.

  • VersaXRM 730 is the flagship system for ultimate VersaXRM performance. It provides highest-resolution performance for the most demanding samples and applications, maximum throughput, automation, and flexibility, plus advanced techniques such as laboratory-based diffraction contrast tomography and high aspect ratio tomography.

  • VersaXRM 730 supports demanding materials, semiconductor packages, industrial components, battery materials, biological samples, geological materials, and complex assemblies. It is especially valuable when difficult internal structures must be characterized non-destructively while preserving sample context.

  • Guided 3D navigation and Volume Scout help users move from overview imaging to targeted internal regions of interest. Users can define targets directly within 3D data, reducing guesswork before high-resolution imaging or downstream analysis.

  • Non-destructive 3D imaging allows internal structures to be analyzed without cutting, trimming, or disassembling the sample. This helps preserve evidence during failure analysis, maintain biological or material context, support repeated 4D studies, and guide downstream correlative microscopy.

  • The Advanced Reconstruction Toolbox provides reconstruction technologies that can improve image quality, reduce artifacts, increase throughput, and support interpretation of difficult datasets. A two-year DeepRecon Pro license is included with VersaXRM 730, while additional modules can be selected based on sample type, imaging challenge, and imaging workflow needs.

  • VersaXRM 730 is suited for the most demanding applications across materials research, semiconductor and electronics failure analysis, industrial research, battery and energy materials, life sciences, and geological research.

  • VersaXRM 730 supports recipe-based scanning, an integrated motorized filter wheel, Autoloader support, instrument control APIs, guided operation, and advanced reconstruction. These capabilities reduce manual effort and support greater consistency and throughput in rigorous imaging environments.

  • VersaXRM 730 is a laboratory-based non-destructive 3D X-ray microscope. Its operation is based on computed tomography, or CT, and it finds use across diverse applications in Materials, Industrial, and Life Science research.

  • ZEISS VersaXRM 730 is used for demanding materials characterization, semiconductor and electronics failure analysis, industrial research, battery and energy materials analysis, life sciences imaging, and geological research. It helps characterize complex internal structures in 3D without destroying the sample.

  • ZEISS VersaXRM 730 uses X-ray microscopy to visualize internal sample structures without cutting or disassembling the sample. This preserves sample context, supports repeated imaging, and helps guide downstream correlative microscopy.

  • ZEISS VersaXRM 730 is suited for labs and teams that need ultimate VersaXRM performance for the most demanding samples and applications, maximum throughput and automation, advanced techniques, and end-to-end performance for rigorous, multi-step imaging.