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ZEISS VersaXRM 615 supports high-throughput, non-destructive 3D X-ray imaging across routine and advanced applications.
High-throughput non-destructive 3D imaging

ZEISS VersaXRM 615

Drive routine and advanced X-ray microscopy with high power, high throughput, versatile multi-scale imaging, and reliable automation across diverse samples.

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Research and industrial labs need an X-ray microscope that can keep pace with routine imaging and advanced studies across diverse samples. ZEISS VersaXRM 615 is a high-performance workhorse for everyday non-destructive 3D imaging. High-power XRM, high-throughput operation, Resolution at a Distance (RaaD™), automation and robotics, and advanced reconstruction technologies combine to boost productivity while preserving the flexibility required for multiscale investigation.

  • Increase throughput across routine and advanced imaging

High-power imaging and productivity-focused operation help teams characterize diverse samples efficiently across repeated and demanding studies.

  • Extend operation with automation and robotics

Reliable automation and robotics support 24/7 operation, reduce manual intervention, and help high-utilization labs keep imaging moving.

  • Balance high power, productivity, and value

Versatile multi-scale imaging and advanced reconstruction support diverse applications on a powerful platform designed for everyday use.

High-performance XRM for everyday non-destructive 3D imaging

24-minute, 29-second STEP mode acquisition
4-minute, 7-second FAST mode acqusition
FAST mode reduces acquisition time from 24 minutes, 29 seconds (right) to 4 minutes, 7 seconds (left) while maintaining the image quality needed for confident 3D characterization.

Highest-resolution performance for demanding samples

VersaXRM 615 is designed to keep routine and advanced 3D imaging moving. High-power XRM, efficient acquisition, and advanced reconstruction help reduce bottlenecks and increase productivity across repeated and demanding studies.

ZEISS Autoloader with multiple samples loaded for unattended, automated 3D X-ray microscopy and high-throughput imaging workflows.
ZEISS Autoloader with multiple samples loaded for unattended, automated 3D X-ray microscopy and high-throughput imaging workflows.

ZEISS Autoloader supports unattended, multi-sample operation to increase system utilization and reduce manual intervention.

ZEISS Autoloader supports unattended, multi-sample operation to increase system utilization and reduce manual intervention.

Reliable 24/7 operation with automation and robotics

Automation and robotics help extend system utilization beyond manually attended scans. VersaXRM 615 supports reliable, repeatable operation for high-demand labs, multi-sample studies, and imaging that continues across longer operating windows.

ZEISS ZEN navx software displaying a 3D X-ray microscopy dataset with guided tools for scan setup, navigation, and recipe parameter selection.
ZEISS ZEN navx software displaying a 3D X-ray microscopy dataset with guided tools for scan setup, navigation, and recipe parameter selection.

ZEN navx streamlines scan setup, 3D navigation, and parameter selection to support efficient, repeatable X-ray microscopy workflows.

ZEN navx streamlines scan setup, 3D navigation, and parameter selection to support efficient, repeatable X-ray microscopy workflows.

A powerful balance of high power, productivity, and value

VersaXRM 615 combines advanced XRM performance with productivity-focused operation and expandable capabilities. It is built for teams that need strong imaging power and system utilization across routine and advanced work.

Three-panel multiscale X-ray microscopy image of a smartwatch battery progressing from full-sample overview to targeted high-resolution imaging of internal structures.
Three-panel multiscale X-ray microscopy image of a smartwatch battery progressing from full-sample overview to targeted high-resolution imaging of internal structures.

Move from full-sample overview to targeted high-resolution detail while preserving the surrounding sample context.

Move from full-sample overview to targeted high-resolution detail while preserving the surrounding sample context.

Versatile multi-scale imaging across diverse samples

Shared labs and advanced research environments often support many users, sample types, and imaging goals. RaaD and flexible multi-scale imaging help teams work across materials, electronics, batteries, biological specimens, geological samples, and other complex structures while preserving the context needed for interpretation.

Key capabilities for high-throughput multi-scale imaging

ZEISS VersaXRM 615 supports high-throughput 3D X-ray microscopy across diverse samples, repeated studies, and advanced applications.

  • Adapt imaging across diverse samples

    Steel laser weld: Crack initiation and propagation under increasing tensile load.

    VersaXRM 615 adapts to diverse sample types and imaging requirements, from biological and natural materials to engineered samples studied under changing conditions.

    Different samples require different imaging strategies. VersaXRM 615 supports versatile multi-scale imaging across materials, electronic packages, industrial devices, components, biological specimens, and natural materials on one high-performance platform.

    Use this to:

    • Investigate diverse samples on one XRM platform
    • Accommodate varying sample geometries and structures
    • Adapt imaging across routine and advanced applications
    • Support changing research questions and sample types

  • Move from overview to targeted internal analysis

    Composite image of an intact bear jaw showing a whole-jaw X-ray scan alongside progressively magnified views of the jaw and tooth structure. The images illustrate how the same specimen can be examined at different scales without sectioning.

    Multi-scale imaging of an intact bear jaw using ZEISS FPX on Versa 3D X-ray microscopes. The workflow spans from a macroscopic view of the full specimen (120 mm × 200 mm) to high-resolution imaging of the jaw-tooth interface using RaaD 0.4x and 4x objectives, enabling detailed analysis without physical sectioning.

    VersaXRM 615 helps users move efficiently from full-sample understanding to localized 3D investigation, making internal features easier to identify and analyze while preserving broader sample context.

    Use this to:

    • Move from broad structural understanding to localized analysis
    • Navigate directly to regions of interest
    • Preserve sample context throughout investigation
    • Support scout-and-zoom targeting of internal features

  • Support high-throughput characterization

    Side-by-side X-ray microscopy images of sandstone from the same 30-minute FAST Mode scan, comparing standard FDK reconstruction with a clearer DeepRecon Pro reconstruction.

    Sandstone imaged with a 30-minute FAST mode acquisition using standard FDK reconstruction (left) and DeepRecon Pro (right). AI-assisted reconstruction improves clarity and reveals internal pore structures more distinctly from the same scan data.

    High-power imaging, automation, and productivity-focused operation help teams characterize internal structures efficiently across repeated, varied, and multi-user imaging.

    Use this to:

    • Improve efficiency across repeated imaging
    • Support shared lab and multi-user operation
    • Characterize defects, pores, cracks, interfaces, and microstructures
    • Increase productivity while preserving sample context

Related applications

VersaXRM 615 supports routine and advanced non-destructive 3D imaging across diverse research and industrial applications.
Select a category Materials research
Materials research
Semiconductors & electronics
Industrial research
Life sciences research
Geology & mining
Multiscale 3D X-ray microscopy images of a ceramic matrix composite showing the full dogbone specimen, a targeted region of interest, and high-resolution internal microstructure.

Materials research, energy materials & batteries

Multiscale 3D X-ray microscopy images of a ceramic matrix composite showing the full dogbone specimen, a targeted region of interest, and high-resolution internal microstructure.
Sample courtesy of Dr. David Marshall, University of Colorado, Boulder.

A ceramic matrix composite imaged from the full test specimen to a targeted region of interest and high-resolution microstructure, supporting non-destructive multiscale and in situ materials research.
Sample courtesy of Dr. David Marshall, University of Colorado, Boulder.

Materials research, energy materials & batteries

Materials research depends on understanding how internal structures influence performance, reliability, and evolution over time. ZEISS VersaXRM 615 supports high-throughput, non-destructive 3D imaging of defects, pores, cracks, inclusions, and microstructures while enabling in situ, 4D, and correlative studies. From advanced materials development to battery and energy materials research, researchers can investigate electrodes, separators, degradation mechanisms, and microstructural changes across scales.

Explore materials research workflows
3D visualization of the solder non-wets and cracks in flip chip package visible in a 2D virtual slice (inset) and a 3D color-rendering image.

Semiconductors & electronics

3D visualization of the solder non-wets and cracks in flip chip package visible in a 2D virtual slice (inset) and a 3D color-rendering image.

3D visualization of the solder non-wets and cracks in flip chip package visible in a 2D virtual slice (inset) and a 3D color-rendering image.

Semiconductors & electronics

Advanced electronics and semiconductor packages contain complex internal architectures that are difficult to evaluate externally. VersaXRM 615 supports buried defect localization, virtual cross-sectioning, advanced packaging studies, and targeted analysis before destructive preparation.

Explore semiconductor workflows
3D X-ray microscopy rendering of an additively manufactured titanium duct with an enlarged region showing internal surface roughness.

Industrial research

3D X-ray microscopy rendering of an additively manufactured titanium duct with an enlarged region showing internal surface roughness.
Test part supplied by LZN and Liebherr.

Non-destructive 3D imaging of an additively manufactured Ti-6Al-4V duct connects the full component with a detailed view of its inaccessible internal surface.
Test part supplied by LZN and Liebherr.

Industrial research

Industrial research teams need insight into how internal structures and manufacturing processes affect performance. VersaXRM 615 supports high-throughput 3D evaluation of components, coatings, composites, metals, polymers, and other engineered materials.

Explore industrial research workflows
3D X-ray microscopy volume of a soil-filled biological sample with a cylindrical region of interest identified for detailed root analysis.

Life sciences research

3D X-ray microscopy volume of a soil-filled biological sample with a cylindrical region of interest identified for detailed root analysis.
Sample courtesy of K. Duncan, Donald Danforth Plant Science Center, St. Louis, USA

Non-destructive X-ray microscopy preserves the environmental context of a root system in soil while identifying a localized region for subsequent higher-resolution investigation.
Sample courtesy of K. Duncan, Donald Danforth Plant Science Center, St. Louis, USA.

Life sciences research

Life science studies increasingly rely on non-destructive imaging that preserves biological context. VersaXRM 615 supports intact sample imaging, region-of-interest localization, and correlative multi-scale investigation across diverse biological samples.

Explore life sciences workflows
Three-stage 3D X-ray microscopy sequence of a sandstone core showing the full core, an internal cross-section, and a segmented pore-scale volume.

Geology & mining

Three-stage 3D X-ray microscopy sequence of a sandstone core showing the full core, an internal cross-section, and a segmented pore-scale volume.

Multi-scale characterization of a sandstone core progresses from the intact specimen to interior tomography and segmented pore-scale analysis while preserving the original sample.

Geology & mining

Geology and mining studies often involve heterogeneous and valuable samples that benefit from non-destructive analysis. VersaXRM 615 supports 3D characterization of mineral distributions, pore networks, and structural variation while preserving specimens for additional studies.

Explore geology and mining workflows

Extend VersaXRM 615 with advanced reconstruction technologies

Advanced samples can present challenges such as low contrast, dense materials, artifacts, and complex multi-material structures. The ZEISS Advanced Reconstruction Toolbox extends VersaXRM 615 with reconstruction technologies that improve image quality, throughput, and interpretation. A two-year DeepRecon Pro license is included with VersaXRM 615, while additional modules can be selected based on application needs.
EMI shielding elastomer gasket imaged by X-ray microscopy, comparing standard FDK reconstruction (left) and ZEISS DeepRecon Pro reconstruction (right) with improved contrast and reduced noise.

DeepRecon Pro

EMI shielding elastomer gasket imaged by X-ray microscopy, comparing standard FDK reconstruction (left) and ZEISS DeepRecon Pro reconstruction (right) with improved contrast and reduced noise.

Standard FDK reconstruction (left) and ZEISS DeepRecon Pro reconstruction (right) of an EMI shielding elastomer gasket. DeepRecon Pro reduces image noise and improves contrast, revealing material features with greater clarity in this 2D slice from a 3D X-ray microscopy dataset acquired at 500 nm voxel size.

DeepRecon Pro

DeepRecon Pro uses deep-learning reconstruction to improve image quality and accelerate imaging, supporting higher productivity across varied characterization applications.

Three-panel comparison of CT image reconstructions showing a low-resolution scan, a higher-resolution scan, and a ZEISS DeepScout reconstruction. The DeepScout image provides image quality comparable to the higher-resolution scan while covering a field of view that is twice as large.

DeepScout

Three-panel comparison of CT image reconstructions showing a low-resolution scan, a higher-resolution scan, and a ZEISS DeepScout reconstruction. The DeepScout image provides image quality comparable to the higher-resolution scan while covering a field of view that is twice as large.

Comparison of a low-resolution scan, a higher-resolution scan, and a ZEISS DeepScout reconstruction. DeepScout delivers comparable image detail while doubling the field of view.

DeepScout

DeepScout enhances effective resolution across larger overview scans, helping users investigate larger volumes while reducing the trade-off between field of view and detail.

Biomedical implant in bone shown without MARS (left) and with ZEISS MARS artifact reduction (right).

Materials Aware Reconstruction Solution

Biomedical implant in bone shown without MARS (left) and with ZEISS MARS artifact reduction (right).

Materials Aware Reconstruction Solution reduces beam-hardening artifacts around a metal implant in bone, improving visualization of the surrounding heterogeneous structures.

MARS

Materials Aware Reconstruction Solution (MARS) reduces artifacts in multi-material samples, improving visualization and interpretation of heterogeneous structures.

3D segmentation of agglomerate grain of pharmaceutical powder using the PhaseEvolve data and segmented with 3D World ZEISS edition.

PhaseEvolve

3D segmentation of agglomerate grain of pharmaceutical powder using the PhaseEvolve data and segmented with 3D World ZEISS edition.

PhaseEvolve improves contrast in pharmaceutical powder. This 3D segmentation shows the volume/surface area ratio of grains adhered to each other via the previously unobservable binder material, allowing for quantifiable data acquisition via high resolution segmentation.

PhaseEvolve

PhaseEvolve enhances contrast in low- and medium-density materials, making subtle structures easier to visualize and supporting more effective segmentation.

Three-panel comparison of X-ray microscopy reconstruction results from an electronics sample. The left image shows standard reconstruction from a 90-minute scan, the center image shows standard reconstruction from a 22-minute scan, and the right image shows ZEISS OptiRecon from the same 22-minute scan. Magnified insets highlight image detail and demonstrate improved image quality with OptiRecon at reduced scan times.
Three-panel comparison of X-ray microscopy reconstruction results from an electronics sample. The left image shows standard reconstruction from a 90-minute scan, the center image shows standard reconstruction from a 22-minute scan, and the right image shows ZEISS OptiRecon from the same 22-minute scan. Magnified insets highlight image detail and demonstrate improved image quality with OptiRecon at reduced scan times.

Comparison of reconstructed X-ray microscopy images showing standard reconstruction at full scan time, standard reconstruction with reduced scan time, and ZEISS OptiRecon at the same reduced scan time. OptiRecon maintains image quality while enabling faster data acquisition.

Comparison of reconstructed X-ray microscopy images showing standard reconstruction at full scan time, standard reconstruction with reduced scan time, and ZEISS OptiRecon at the same reduced scan time. OptiRecon maintains image quality while enabling faster data acquisition.

OptiRecon

OptiRecon provides flexibility to balance throughput and image quality, allowing users to adapt reconstruction performance to different imaging requirements.

Technologies that keep imaging moving

Interior view of the ZEISS VersaXRM 615 showing the integrated X-ray microscopy architecture, including the imaging chamber, sample stage, detector, and source assembly.
Interior view of the ZEISS VersaXRM 615 showing the integrated X-ray microscopy architecture, including the imaging chamber, sample stage, detector, and source assembly.

The integrated architecture of ZEISS VersaXRM 615 combines high-power X-ray imaging, flexible multi-scale performance, automation, guided workflows, and advanced reconstruction technologies to support productive 3D X-ray microscopy across diverse applications.

The integrated architecture of ZEISS VersaXRM 615 combines high-power X-ray imaging, flexible multi-scale performance, automation, guided workflows, and advanced reconstruction technologies to support productive 3D X-ray microscopy across diverse applications.

  • Resolution at a Distance for high-resolution internal imaging

    ZEISS RaaD technology maintains high-resolution performance at large working distance, helping users investigate internal features in larger or complex samples while preserving sample context and supporting varied sample geometries.

  • High-power imaging for greater throughput

    The high-power VersaXRM 615 platform supports faster imaging of challenging samples, helping reduce acquisition bottlenecks and increase productivity across routine and advanced 3D studies.

  • Automation and robotics for 24/7 operation

    Automation and robotics help reduce manual intervention and extend system utilization. Autoloader-enabled multi-sample operation supports repeated studies and high-demand environments where productivity matters.

  • ZEN navx for guided 3D imaging

    ZEN navx supports efficient operation with guided setup, tailored parameter optimization, integrated 3D navigation, and Volume Scout targeting. These tools help users with different experience levels work more consistently while retaining control for advanced imaging.

  • Advanced reconstruction for productive imaging

    DeepRecon Pro and optional ART modules help improve image quality, reduce reconstruction bottlenecks, and adapt data processing to varied samples and applications.

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    Extend the Limits of Your Exploration with Advanced 3D X-ray Microscopy

    ZEISS VersaXRM 615

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Services and support

ZEISS VersaXRM 615 is supported by ZEISS service, application, and training expertise to help labs get the most from high-throughput X-ray microscopy. From installation and onboarding to advanced application support, ZEISS helps users build confidence, improve system utilization, and maintain reliable performance over time.

Support areas

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Imaging and application training
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FAQ

  • ZEISS VersaXRM 615 combines high-power XRM, automation, robotics, and advanced reconstruction to help reduce imaging and processing bottlenecks. These capabilities support greater productivity across routine, repeated, and advanced non-destructive 3D imaging.

  • ZEISS VersaXRM 615 is well suited for materials research, electronics and semiconductor failure analysis, industrial research, energy materials and batteries, life sciences, and geology and mining. It is designed for labs that need high-throughput imaging and versatile multi-scale XRM across diverse samples.

  • Multi-scale imaging helps connect full-sample structure with localized internal features. Users can move from overview imaging to targeted higher-resolution analysis to understand defects, pores, cracks, interfaces, or buried regions of interest within their broader structural environment.

  • ZEISS VersaXRM 615 supports non-destructive 3D imaging, allowing internal structures to be visualized without immediately cutting, trimming, or disassembling the sample. This preserves spatial relationships across scales and supports more informed interpretation.

  • ZEN navx and Volume Scout help users navigate within 3D data and target internal regions of interest. This supports localized analysis while preserving context from the larger sample and reduces uncertainty before higher-resolution or downstream analysis.

  • ZEISS VersaXRM 615 supports engineered materials, electronics assemblies, semiconductor packages, industrial components, battery materials, biological specimens, geological samples, and other complex structures that benefit from non-destructive 3D imaging.

  • Non-destructive imaging preserves the sample for repeated scans, follow-up analysis, in situ experiments, or correlative microscopy. This is especially valuable for rare, complex, or evolving samples and those needed for downstream analysis.

  • ZEISS VersaXRM 615 combines versatile multi-scale imaging, RaaD, guided operation, automation, robotics, and expandable reconstruction capabilities. This flexibility helps labs support new sample types, changing applications, and more demanding imaging needs over time.

  • ZEISS VersaXRM 615 is a high-performance workhorse for everyday non-destructive 3D imaging. It combines high throughput, high-power XRM, automation and robotics, and versatile multi-scale imaging across diverse samples.

  • ZEISS VersaXRM 615 supports versatile multi-scale imaging by helping users move from broad sample overview to targeted internal analysis. This connects full-sample structure with regions of interest while preserving spatial context.

  • ZEISS VersaXRM 615 visualizes internal structures in 3D without cutting, disassembling, or destroying the sample. This supports repeated analysis, region-of-interest targeting, in situ studies, and correlative microscopy.

  • ART modules for ZEISS VersaXRM 615 include DeepRecon Pro, DeepScout, Materials Aware Reconstruction Solution, PhaseEvolve, and OptiRecon. A two-year DeepRecon Pro license is included, while additional modules can be selected based on sample type, imaging challenge, and application needs.

  • ZEISS VersaXRM 615 is the high-performance workhorse for high-throughput routine and advanced non-destructive 3D imaging. VersaXRM 5 Insight is a high-value hybrid VersaXRM + microCT solution for efficient, insight-driven imaging, while VersaXRM 730 delivers ultimate performance for the most demanding samples and rigorous, multi-step imaging environments.