ZEISS at ISTFA 2026

Stop by booth #409 to learn about the latest advances in 3D X-ray microscopy, FE-SEM, and FIB-SEM solutions for failure analysis and process development.

ZEISS will showcase a dynamic lineup of presentations, papers, and new products at ISTFA. Join tutorials on SEM fundamentals and defect localization for improved yield, and take part in exhibit-floor industry forums exploring how to fund an FA lab and address failure analysis challenges driven by disruptive packaging technologies in the AI era.

Sunday, October 4

Tutorial – Basics and Current Aspects of Scanning Electron Microscopy
Session: Microscopy II – 10:20 am CDT
Dr. Heiko Stegmann, Carl Zeiss Microscopy GmbH

Tutorial - Defect Localization Methods for Device Characterization and Yield Management
Session: Fault Isolation II – 2:30 pm CDT
Greg Johnson, ZEISS Microscopy

Tuesday, October 6

Three-dimensional Simulation of FIB-SEM Image Series from Layout Data for Automatic FIB Endpoint Detection
Session: AI Applications for Failure Analysis III – 3:40 pm CDT
Dr. Heiko Stegmann, Carl Zeiss Microscop; Mr. Roland Salzer, Carl Zeiss Microscopy; Dr. Daniel Plencner, Carl Zeiss AG; Dr. Dmitrii Fedotov, Carl Zeiss AG; Dr. Eckhard Langer, Infineon Technologies Dresden GmbH & Co. KG

Capacitive Effects in AFM-in-SEM for SOI
Session: Scanning Probe Analysis – 4:20 pm CDT
Mr. Greg Johnson, ZEISS Microscopy; Dr. Frank Hitzel, DoubleFox GmbH; Mr. Pascal Limbecker, GlobalFoundries Dresden Module One LLC & Co. KG; Dr. Rong Wu, GlobalFoundries Dresden Module One LLC & Co. KG; Dr. Andreas Bautz, GlobalFoundries Dresden Module One LLC & Co. KG

Wednesday, October 7

Reducing Time‑to‑Result in Wafer Physical Defect Review via Correlative Light Microscopy Pre‑Targeting and Synchronized Automated SEM Imaging
Session: Microscopy Analysis & Material Characterization I – 8:20 am CDT
Anthony Lisi, Carl Zeiss Microscopy; Efrat Moyal, Carl Zeiss Microscopy; Dr. David Giraldo, Carl Zeiss Microscopy; Michael O'Relley, Carl Zeiss Microscopy; Dr. Mansoureh Norouzi Rad, Carl Zeiss Microscopy; Nathaniel Cohan, Carl Zeiss Microscopy

Industry Forum – Specifiers, Justifiers, & Buyers: A Peer Exchange on How to Fund FA Labs
Exhibit Hall – 11:50 am – 1:20 pm CDT
This interactive session explores how FA labs successfully secure funding for critical equipment by bridging technical needs with business and financial justification.

Industry Forum – Design for Analysis: Confronting the Challenges of Backside Power, Heterogeneous Integration, and Co-Packaged Optics in the AI Era
Exhibit Hall – 1:30 – 3:00 pm CDT
Join this interactive session with industry experts on the FA challenges posed by these disruptive technologies.

Thursday, October 8

Imaging Dopant Interfaces in 5 nm-node finFETs with STEM EBIC
Session: Microscopy Analysis & Material Characterization I – 8:20 am CDT
William A Hubbard, PhD, NanoElectronic Imaging, Inc.; Dr. Heiko Stegmann, Carl Zeiss Microscopy; Ms. Hyun Hwa Kim, Carl Zeiss Microscopy; Mr. Greg Johnson, Carl Zeiss Microscopy

Passive Voltage Contrast for Dopant Calibration
Session: Microscopy Analysis & Material Characterization I – 9:40 am CDT
Mr. Greg Johnson, Carl Zeiss Microscopy; Dr. Rainer Arnold, Carl Zeiss Microscopy; Ms. Hyun Hwa Kim, Carl Zeiss Microscopy; Dr. Markus Boese, Carl Zeiss Microscopy; Dr. Thomas Schweinboeck, Infineon; Dr. Soeren Hommel, Infineon; Dr. Aidan Arthur Taylor, Infineon Technologies Austria AG