ZEISS Xradia Versa X-ray Microscopes
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ZEISS Xradia Versa X-ray Microscopes

Discover More with Non-destructive 3D X-Ray Imaging at Submicron Resolution

Extremely versatile ZEISS Xradia Versa 3D X-ray microscopes (XRM) provide superior 3D image quality and data for a wide range of materials and working environments. Xradia Versa XRM feature dual-stage magnification based on synchrotron-caliber optics and revolutionary RaaD™ (Resolution at a Distance) technology for high resolution even at large working distances, a vast improvement over traditional micro-computed tomography. Non-destructive imaging preserves and extends the use of your valuable sample, enabling 4D and in situ studies.

  • Widest range of capabilities - ZEISS Xradia 620 Versa
  • Faster submicron imaging - ZEISS Xradia 610 Versa
  • Flexibility and ease of use - ZEISS Xradia 510 Versa
  • Xradia Versa 510

    Xradia 620 Versa

    Xradia 620 Versa unlocks new degrees of versatility for your research with non-destructive imaging at maximum flexibility to accelerate your research. Move from exploration to discovery in a seamless workflow. 600-family technical specs with a wider range of imaging options.

    • Automated, programmable filter changer
    • High aspect ratio tomography
    • Dual scan contrast visualization
  • Xradia Versa 610

    Xradia 610 Versa

    Xradia 610 Versa extends the limits of your exploration with breakthrough innovation in source and optics technology. Higher X-ray flux delivers faster tomography scans with industry-leading resolution and contrast.

    • 500-nanometer spatial resolution
    • 40 nm minimum achievable voxel
    • 25-watt fast activation sealed source
  • Xradia Versa 620

    Xradia 510 Versa

    Xradia 510 Versa breaks the one-micron resolution barrier for 3D imaging and in situ / 4D investigations. ZEISS Xradia 510 Versa makes synchrotron-caliber research even more practical for mid-sized imaging centers and industrial laboratories.

    • 700-nanometer spatial resolution
    • 70 nm achievable voxel
    • 10-watt sealed transmission source
 A reconstruction of the grain microstructure of Armco Iron, acquired with LabDCT. The grains are colored by crystallographic orientation, and the reconstruction reveals the true grain shape. The background shows an example of a diffraction pattern that is collected during the LabDCT acquisition.

Xradia 620 Versa

Boost the performance of your Xradia Versa and explore more with its advanced capabilities. Enhance absorption contrast for low-Z or similar-Z materials with the Dual Scan Contrast Visualizer (DSCoVer). Unlock 3D crystallographic information with laboratory-based Diffraction Contrast Tomography (LabDCT). Improve scan speed and accuracy of large or irregular samples with advanced acquisition techniques such as High Aspect Ratio Tomography (HART).

A reconstruction of the grain microstructure of Armco Iron, acquired with LabDCT. The grains are colored by crystallographic orientation, and reconstruction reveals the true grain shape. The background shows an example of a diffraction pattern that is collected during the LabDCT acquisition.

ZEISS Xradia 620 Versa
ZEISS Xradia 620 Versa automated filter changer, filter wheel
ZEISS Xradia 620 Versa automated filter changer, filter wheel

Achieve New Degrees of Freedom

With more X-ray photons available on ZEISS Xradia 600-series Versa, you can now achieve even faster time to results for varied sample sizes without compromising resolution. Xradia 620 Versa offers additional unique features and imaging capabilities.

  • Improve scan speed and accuracy of large or irregular samples with advanced acquisition techniques such as High Aspect Ratio Tomography (HART)
  • Automated Filter Changer (AFC) enables seamless filter changing without manual intervention, and your selection can be programmed and recorded for each recipe
  • Unlock crystallographic information in your own lab with the optional LabDCT
A single energy scan shows that aluminum and silicon are virtually identical (left side), with very similar grayscale contrast.
DSCoVer exclusively available on ZEISS Xradia 620 Versa enables separation of the particles. 3D rendering shows Aluminum/green; Silicates/red

Gain an Edge in Contrast

Dual Scan Contrast Visualizer (DSCoVer), exclusive to Xradia 620 Versa, extends the detail captured in a single energy absorption image by combining information from tomographies taken at two different X-ray energies. DSCoVer takes advantage of how X-rays interact with matter based on effective atomic number and density. This provides you with a unique capability for distinguishing, for example, mineralogical differences within rocks as well as among difficult-to-discern materials such as silicon and aluminum.

From Xradia Context microCT, to Xradia 510/520 Versa, and now with the addition of Xradia 610/620 Versa,  you can field-convert your system to the latest X-ray microscope products.
From Xradia Context microCT, to Xradia 510/520 Versa, and now with the addition of Xradia 610/620 Versa,  you can field-convert your system to the latest X-ray microscope products.

Investment Protection

As your imaging needs evolve, so should your instrument. Unlike traditional microCT systems, the ZEISS Xradia Versa family is built on an established ZEISS 3D X-ray microscope platform that is upgradeable, expandable and reliable, paving the way for future enhancements and protecting your investment. Select the system that is right for you today and expand as your needs require.

  • Protect your investment by upgrading your system at any time with the latest capabilities and innovations
  • Constant development means that you can add advanced capabilities such as in situ sample environments, unique imaging modalities, and productivity enhancing modules
  • Field conversion from basic systems up to most advanced systems in most instances
Cement paste sample blended with resin, enabling the paste to acquire higher porosity resulting in better freeze-thaw behavior.

Xradia 610 Versa

By leveraging RaaD capability, Xradia Versa 600-series maintain the highest resolution across large working distances, accommodating samples contained within environmental chambers and high precision in situ load rigs. 600-series XRM offer even higher resolution and throughput over previous generations. Xradia Versa seamlessly integrate with other ZEISS microscopes to solve your multi-scale correlative challenges.

Cement paste sample blended with resin, enabling the paste to acquire higher porosity resulting in better freeze-thaw behavior. Courtesy Nanjing University of Science and Technology, China

ZEISS Xradia 610 Versa
True spatial resolution of 0.5 µm demonstrated on JIMA resolution target
True spatial resolution of 0.5 µm demonstrated on JIMA resolution target

True spatial resolution of 0.5 µm demonstrated on JIMA resolution target.

Highest Resolution without Compromise

ZEISS Xradia Versa use a two-stage magnification architecture to enable submicron resolution imaging at large working distances—RaaD—for a diverse set of sample sizes and types. With more X-ray photons available, the ZEISS Xradia 600 Series Versa provide faster time to results for the widest range of sample sizes and types, without compromising resolution.

✔ Deliver image quality without compromising throughput
✔ Image larger, denser objects including intact components and devices, in 3D
✔ ZEISS Xradia 600-series Versa obtain true spatial resolution of 500 nm with a minimum achievable voxel size of 40 nm

ZEISS Xradia 620 Versa X-ray source.
ZEISS Xradia 620 Versa X-ray source

Higher X-ray Flux

ZEISS Xradia 600 Series Versa leverage 25 W X-ray sealed source technology, delivering high X-ray flux that pushes the boundaries of performance. It provides excellent thermal management, with increased flux capacity and high throughput while maintaining stringent world-class Versa spot size performance. An innovative source control system ensures source responsiveness, enabling a faster scan setup for an easy and engaging user experience

✔ Faster tomography scans—up to 2X higher output—enable more sample runs and more regions of interest to explore
✔ Higher flux offers higher contrast-to-noise ratio and exceptional performance at high energy (kV), without compromising resolution
✔ Sealed sources mean higher vacuum and longer filament life

In situ kit tracking with Deben thermomechanical stage
In situ kit tracking with Deben thermomechanical stage

Premier In Situ and 4D

ZEISS Xradia 600 Series Versa can non-destructively characterize the 3D microstructure of materials under controlled variations (in situ) and enable you to observe the evolution of structures over time (4D). By leveraging RaaD, Xradia Versa XRM maintain the highest resolution across large working distances, accommodating sample, environmental chamber, and high precision in situ load rigs without sacrificing resolution.

✔ Characterize and quantify your sample under varying conditions and native-like environments in situ and over time
✔ Seamlessly integrate with other ZEISS microscopes to solve multi-scale correlative imaging challenges

Polymer with urethane backbone. Imaging after in situ experiments. Simulation of fluid flow demonstrates permeability.

Xradia 510 Versa

Benefit from the two-stage magnification technique offered by ZEISS Xradia Versa to uniquely achieve RaaD, which enables you to effectively study the widest range of sample sizes. Intuitive Scout-and-Scan control software enables a broad range of user skillsets in your busy lab.

Polymer with urethane backbone. Imaging after in situ experiments. Simulation of fluid flow demonstrates permeability. Courtesy National Chemical Laboratory, India

ZEISS Xradia 510 Versa
This is a new cartoon schematic to illustrate the magnification concept in the Versa X-ray Microscope XRM. The microscope uses a combination of geometric and optical magnification to produce a high resolution image of the sample. In this schematic, several of the high resolution objectives can be seen, as well as the 0.4X macro lens in the background. This system produces RaaD: Resolution at a Distance.
This is a new cartoon schematic to illustrate the magnification concept in the Versa X-ray Microscope XRM. The microscope uses a combination of geometric and optical magnification to produce a high resolution image of the sample. In this schematic, several of the high resolution objectives can be seen, as well as the 0.4X macro lens in the background. This system produces RaaD: Resolution at a Distance.

A Class Above MicroCT

Extend scientific research beyond the limits of projection-based microCT systems at submicron resolution with ZEISS Xradia 510 Versa XRM. Traditional computed tomography relies on a single stage of geometric magnification and maintaining high resolution for larger samples is impossible due to the longer working distances required. ZEISS Xradia Versa XRM feature a unique two-stage process based on synchrotron caliber optics. Multilength-scale capabilities enable you to image the same sample across a wide range of magnifications. An added benefit: ZEISS Xradia 510 Versa is easy to use by everyone in your busy lab.

✔ Reduce dependence on geometric magnification and maintain submicron resolution even at large working distances
✔ Experience versatility for wide range of materials, including soft and low Z, with unique contrast solutions that overcome the limitations of traditional computed tomography
✔ Characterize the microstructure of materials in their native-like environments in situ and study the evolution of properties over time (4D)

True Spatial Resolution
True Spatial Resolution

True Spatial Resolution

ZEISS XRM systems are specified on true spatial resolution, the most meaningful measurement of your microscope’s performance. Spatial resolution refers to the minimum separation at which two features can be resolved by an imaging system. You would typically measure it by imaging a standardized resolution target with progressively smaller line-space pairs. Spatial resolution accounts for critical characteristics such as X-ray source spot size, detector resolution, magnification geometry, and vibrational, electrical and thermal stability.

✔ 0.7 μm true spatial resolution with a minimum achievable voxel size of 70 nm
✔ Energy-tuned detectors enable highest resolution across broad ranges of sample types and densities
✔ Source operates across the entire application space (30-160 kV) with a wide range of detectors, eliminating the need for manual hardware reconfigurations

Pear imaged with absorption contrast – no visibility of cell walls.
Pear imaged with phase contrast, showing details of cell walls in normal cells and stone cells (bottom).

Reveal Hidden Details

Your imaging requires superior contrast capabilities to reveal details necessary to accurately visualize and quantify features. ZEISS Xradia Versa systems deliver flexible, high contrast imaging for even your most challenging materials–low atomic number (low Z) materials, soft tissue, polymers, fossilized organisms encased in amber, and other materials of low contrast.

  • Our comprehensive approach employs proprietary enhanced absorption contrast detectors that provide you with superior contrast by maximizing collection of low energy photons while minimizing collection of contrast-reducing high energy photons
  • Tunable propagation phase contrast measures the refraction of X-ray photons at material transitions to allow you to visualize features displaying little or no contrast during absorption imaging

Breakthrough Imaging with ZEISS Xradia Versa XRM

View highlights of ZEISS Xradia Versa 3D X-ray microscopes: non-destructive imaging, higher resolution with higher throughput.

The Technology Behind Xradia Versa X-ray Microscopes

  • The Versatile Advantage of RaaD
    The Versatile Advantage of RaaD

    The Versatile Advantage of RaaD

    The Versatile Advantage of RaaD

    The two-stage magnification technique offered by ZEISS Xradia Versa uniquely achieves Resolution at a Distance, or RaaD, which enables you to effectively study the widest range of sample sizes, including those within in situ chambers.

    Images are initially magnified via geometric projection as with conventional microCT. The projected image is cast onto a scintillator, converting X-rays to a visible light image which is then optically magnified by microscope optics before acquisition by a CCD detector.

    Reducing dependence on geometric magnification enables ZEISS Xradia Versa solutions to maintain submicron spatial resolution down to 500 nm at large working distances.

  • Tensile testing of laser welded steel under increasing load.
    Tensile testing of laser welded steel under increasing load.

    Tensile testing of laser welded steel under increasing load.

    Push the Limits of Scientific Advancement

    ZEISS Xradia X-ray systems provide the industry's premier 3D imaging solution for the widest variety of in situ rigs, from high-pressure flow cells to tension, compression, and thermal stages. Moving beyond the three dimensions of space, leverage the non-destructive nature of X-ray investigation to extend your studies into the dimension of time with 4D experiments.

    These studies require samples to be further away from the X-ray source to accommodate various types of in situ rigs. On traditional microCT systems, this significantly limits the resolution achievable for your samples. ZEISS XRM are uniquely equipped with dual-stage magnification architecture with RaaD technology that enable the highest resolution for in situ imaging.

    ZEISS Xradia XRM platforms can accommodate a variety of in situ rigs, from high-pressure flow cells to tension, compression, and thermal stages, to user-customized designs. You can add the optional in situ Interface Kit to your ZEISS Xradia XRM, which includes a mechanical integration kit, a robust cabling guide, and other facilities (feed-throughs) along with recipe-based software that simplifies your control from within the Versa Scout-and-Scan user interface. When your needs require pushing the resolution limits of your in situ experiments, convert your ZEISS Xradia microCT or XRM to an Xradia 620 Versa X-ray microscope and leverage RaaD technology for the maximum performance tomographic imaging of samples within in situ chambers or rigs.

  • Begin Your Multi-Scale, Multi-Modal, Multi-Dimensional Microscopy with Non-destructive 3D Imaging

    Because of the non-destructive nature of X-rays and the versatile array of sample types and sizes they are able to image, correlative microscopy often begins with, or is enabled by, ZEISS Xradia Versa XRM.

    Using the Scout-and-Zoom capability of Versa, you are able to clearly define your region of interest (ROI) before sacrificing your sample to premature cutting or other sample prep. Rapidly scout at low resolution with a large field of view, and then zoom to the ROI at higher resolution, whether using the range of Versa objectives (up to 40X), nanoscale Xradia Ultra XRM, or ZEISS light, electron, or FIB-SEM microscopes. This prevents premature sample destruction and allows for maximum workflow efficiency while combining full sample context with key sample information.

    Additionally, the ability to perform interior tomography, or to clearly see inside your sample in 3D, further reduces the risk of losing sight of your ROI. Achieve greater efficiency by pinpointing a specific “address” to which to navigate for accurate and efficient next steps for interrogating your sample.

    Finally, examine your sample under varying conditions and over time with in situ and 4D studies before performing further analysis — chemical, surface, etc.— with other ZEISS modalities.

    Leverage the widest array of microscopy solutions available — exclusively from ZEISS — to perform multi-modal, multi-lengthscale, multi-dimensional analyses, by starting with non-destructive 3D X-ray microscopy.

    Full correlative sample workflow for the project

    Full correlative sample workflow for the project. Initial XRM scans highlight key areas for higher resolution imaging and target locations for thin section orientation within the volume. Subsequent 2D analysis includes electron and light microscopy, leading to correlation with in situ microanalytical data.

Features That Make Every Versa Platform More Powerful

  • Scout-and-Scan Control System

    Create Efficient Workflows Using the Super Simple Control System

    All of the features introduced by ZEISS Xradia Versa instruments are seamlessly integrated within the Scout-and-Scan Control System, an efficient workflow environment that allows you to easily scout a region of interest and specify scanning parameters. The interface maintains the flexibility for which ZEISS Xradia Versa systems are known, enabling you to set-up scans even more easily.

    Scout-and-Scan software also offers recipe-based repeatability, which is especially useful for your in situ and 4D research and enables you to have greater control and efficiency for future work. The easy-to-use system is ideal for a central lab-type setting where your users may have a wide variety of experience levels.

    Benefit from:

    ● Internal camera for sample viewing
    ● Recipe control (set, save, recall)
    ● Multiple energies
    ● Multiple samples with Autoloader option
    ● Micropositioning capability with a simple mouse click

  • Watch this video and gain insights into the workflow guided by SmartShield.

    SmartShield

    Easily Protect Your Sample to Optimize Experiment Setup

    SmartShield is a solution that protects your sample and your microscope. This automated collision avoidance system works within the Scout-and-Scan Control System. It enables you to navigate Xradia Versa more confidently than ever. With the click of a button SmartShield creates a digital protective layer based on the dimensions of your sample.

    With SmartShield, you benefit from:

    ● Improved operator efficiency enabled by a streamlined sample setup
    ● Enhanced user experience for novice and advanced users
    ● Protection of your valuable samples and your investment
    ● Uncompromising scan quality

  • Wide Field Mode

    Wide Field Mode (WFM) can be used to image across an extended lateral field of view. The wide lateral field of view can provide 3x larger 3D volume for large samples, or give a higher voxel density for a standard field of view. All Xradia Versa systems are capable of WFM with the 0.4x objective. In combination with Vertical Stitching, WFM enables you to image larger samples at exceptional resolution.

Application Examples

ZEISS Xradia Versa at Work

  • Additive manufactured lattice structure.
  • Porous glass foam insulation imaged at multiple length scales.
  • Carbon fiber reinforced polymer composite.
  • Localized high resolution tomography and segmentation of multiple phases in concrete.
  • Additive manufactured lattice structure.
    Additive manufactured lattice structure.Sample courtesy of Kavan Hazeli, Mechanical and Aerospace Engineering, The University of Alabama, Huntsville
    Sample courtesy of Kavan Hazeli, Mechanical and Aerospace Engineering, The University of Alabama, Huntsville

    Additive manufactured lattice structure.

    Additive manufactured lattice structure.

  • Porous glass foam insulation imaged at multiple length scales.
    Porous glass foam insulation imaged at multiple length scales.Sample courtesy of M.B. Østergaard, Dr. R.R. Petersen and Prof. Y. Yue (Aalborg University), and Dr. J. König (Jozef Stefan Institute)
    Sample courtesy of M.B. Østergaard, Dr. R.R. Petersen and Prof. Y. Yue (Aalborg University), and Dr. J. König (Jozef Stefan Institute)

    Porous glass foam insulation imaged at multiple length scales.

    Porous glass foam insulation imaged at multiple length scales.

  • Carbon fiber reinforced polymer composite.
    Carbon fiber reinforced polymer composite.

    Carbon fiber reinforced polymer composite.

    Carbon fiber reinforced polymer composite.

  • Localized high resolution tomography and segmentation of multiple phases in concrete.
    Localized high resolution tomography and segmentation of multiple phases in concrete.

    Localized high resolution tomography and segmentation of multiple phases in concrete.

    Localized high resolution tomography and segmentation of multiple phases in concrete.

Microscopy Solutions for Materials Science

Typical tasks and applications:

  • Characterize three-dimensional structure
  • Observe failure mechanisms, degradation phenomena, and internal defects
  • Investigate properties at multiple length scales
  • Quantify microstructural evolution
  • Perform in situ and 4D (time dependent) studies to understand the impact of heating, cooling, desiccation, wetting, tension, compression, imbibition, drainage and other simulated environmental studies
  • Understand the 3D structure of fibers as well as pores and pore pathways in paper
  • Observe the propagation of a crack inside your sample
  • The XRM micrograph of a blossom reveals its components in a new 3D view.
  • Dragonfly, imaged in its native structure without any sample preparation and sectioning.
  • Seeds are very solid and compact structures and their inside is difficult to image as a whole.
  • Embedded plant root in soil.
  • The XRM micrograph of a blossom reveals its components in a new 3D view.
    The XRM micrograph of a blossom reveals its components in a new 3D view.

    The XRM micrograph of a blossom reveals its components in a new 3D view. Sepals (yellow) and petals (purple) can be distinguished.

    The XRM micrograph of a blossom reveals its components in a new 3D view. Sepals (yellow) and petals (purple) can be distinguished.

  • Dragonfly, imaged in its native structure without any sample preparation and sectioning.
    Dragonfly, imaged in its native structure without any sample preparation and sectioning.

    Dragonfly, imaged in its native structure without any sample preparation and sectioning.

    Dragonfly, imaged in its native structure without any sample preparation and sectioning.

  • Seeds are very solid and compact structures and their inside is difficult to image as a whole.
    Seeds are very solid and compact structures and their inside is difficult to image as a whole.

    Seeds are very solid and compact structures and their inside is difficult to image as a whole. The image shows the pre-shaped seed leaves which will contain the energy reservoir for the further growth of the plant.

    Seeds are very solid and compact structures and their inside is difficult to image as a whole. The image shows the pre-shaped seed leaves which will contain the energy reservoir for the further growth of the plant.

  • Embedded plant root in soil.
    Embedded plant root in soil.Sample courtesy of Keith Duncan, Research Scientist, Donald Danforth Plant Science Center, St. Louis, MO
    Sample courtesy of Keith Duncan, Research Scientist, Donald Danforth Plant Science Center, St. Louis, MO

    Embedded plant root in soil: the root can be recognized as a dominant structure within the soil which consists of grains of different sizes and shapes. Voxel size: 5.5 µm.

    Embedded plant root in soil: the root can be recognized as a dominant structure within the soil which consists of grains of different sizes and shapes. Voxel size: 5.5 µm.

Applications in Life Sciences

Typical tasks and applications:

  • 3D imaging of biological samples in their natural surroundings
  • Imaging of plant roots still embedded in their original soil without any special sample preparation
  • Imaging of fragile animal models and plants without any sample preparation and sectioning
  • Submicron imaging of solid structures like seeds as a whole
  • Visualization of C4 bumps, TSVs, and Cu-pillar micro bumps in a 2.5D package.
  • Virtual cross section from the 2.5D package.
  • DRAM package interconnect within a 10 mm x 7 mm x 1 mm package containing a 4-die stack.
  • Virtual cross section of micro bumps in a DRAM package.
  • Visualization of C4 bumps, TSVs, and Cu-pillar micro bumps in a 2.5D package.
    Visualization of C4 bumps, TSVs, and Cu-pillar micro bumps in a 2.5D package.

    Visualization of C4 bumps, TSVs, and Cu-pillar micro bumps in a 2.5D package, enabling high-resolution views from within the intact package, 1 µm/voxel.

    Visualization of C4 bumps, TSVs, and Cu-pillar micro bumps in a 2.5D package, enabling high-resolution views from within the intact package, 1 µm/voxel.

  • Virtual cross section from the 2.5D package.
    Virtual cross section from the 2.5D package.

    Virtual cross section from the 2.5D package reveals solder cracks and voids in C4 bumps.

    Virtual cross section from the 2.5D package reveals solder cracks and voids in C4 bumps.

  • DRAM package interconnect within a 10 mm x 7 mm x 1 mm package containing a 4-die stack.
    DRAM package interconnect within a 10 mm x 7 mm x 1 mm package containing a 4-die stack.

    DRAM package interconnect within a 10 mm x 7 mm x 1 mm package containing a 4-die stack. Solder extrusion is easily visualized in 3 dimensions, 0.8 µm/voxel.

    DRAM package interconnect within a 10 mm x 7 mm x 1 mm package containing a 4-die stack. Solder extrusion is easily visualized in 3 dimensions, 0.8 µm/voxel.

  • Virtual cross section of micro bumps in a DRAM package.
    Virtual cross section of micro bumps in a DRAM package.

    Virtual cross section of micro bumps in a DRAM package. TSVs are 6 μm in diameter and micro bumps average 35 µm in diameter. Small solder voids of 2 μm are visible.

    Virtual cross section of micro bumps in a DRAM package. TSVs are 6 μm in diameter and micro bumps average 35 µm in diameter. Small solder voids of 2 μm are visible.

Applications in Electronics & Semiconductor

Typical tasks and applications:

  • Perform structural and failure analysis for process development, yield improvement and construction analysis of advanced semiconductor packages, including 2.5/3D and fan-out packages
  • Analyze printed circuit boards for reverse engineering and hardware security
  • Non-destructively image across length scales from module to package to interconnect for submicron-resolution characterization of defects at speeds that can complement physical cross-sectioning
  • Enable better understanding of defect locations and distributions by viewing unlimited virtual cross-section and plan-view images from all desired angles
  • Granulite facies metagabbro sample from the Lewisian complex that has been analyzed using Mineralogic 3D software for quantitative analysis of mineralogy, grain size, shape and distributions, and mineral relationships, inclusion assemblages and more all prior to destructive sample preparation.
  • Individual gold grain identified from population of ~26,000 pyrite grains.
  • Multiscale non-invasive characterization of sandstone core.
  • Traditional absorption contrast image of disaggregated olivine.
  • Individual sub-crystals identified using LabDCT Pro on disaggregated olivine.
  • Granulite facies metagabbro sample from the Lewisian complex
    Granulite facies metagabbro sample from the Lewisian complex

    Granulite facies metagabbro sample from the Lewisian complex that has been analyzed using Mineralogic 3D software for quantitative analysis of mineralogy, grain size, shape, and distributions, as well as mineral relationships, inclusion assemblages and more all prior to destructive sample preparation.

    Granulite facies metagabbro sample from the Lewisian complex that has been analyzed using Mineralogic 3D software for quantitative analysis of mineralogy, grain size, shape, and distributions, as well as mineral relationships, inclusion assemblages and more all prior to destructive sample preparation.

  • Individual gold grain identified from population of ~26,000 pyrite grains.
    Individual gold grain identified from population of ~26,000 pyrite grains.

    Individual gold grain identified from population of ~26,000 pyrite grains.

    Individual gold grain identified from population of ~26,000 pyrite grains.

  • Multiscale non-invasive characterization of sandstone core.
    Multiscale non-invasive characterization of sandstone core.

    Multiscale non-invasive characterization of sandstone core, showing high quality non-invasive interior tomography and integrated pore scale analytical investigation (showing pore separation).

    Multiscale non-invasive characterization of sandstone core, showing high quality non-invasive interior tomography and integrated pore scale analytical investigation (showing pore separation).

  • Traditional absorption contrast image of disaggregated olivine.
    Traditional absorption contrast image of disaggregated olivine.

    Traditional absorption contrast image of disaggregated olivine.

    Traditional absorption contrast image of disaggregated olivine.

  • Individual sub-crystals identified using LabDCT Pro on disaggregated olivine.
    Individual sub-crystals identified using LabDCT Pro on disaggregated olivine.

    Individual sub-crystals identified using LabDCT Pro on disaggregated olivine.

    Individual sub-crystals identified using LabDCT Pro on disaggregated olivine.

Microscopy Solutions for Raw Materials

Typical tasks and applications:

  • Achieve automated mineralogy in 3D with little to no sample prep
  • Perform multiscale pore structure and fluid flow analysis, directly measure fluid flow using in situ flow equipment
  • Perform non-destructive scout scans and cut to ROI for buried structures in metamorphic rocks
  • Analyze grain orientations in steel and other metals
  • Surface roughness evaluation of an AM printed duct (Ti-6Al-4V).
  • Imaging of different A205 AM powder qualities at 3.9 µm voxel resolution.
  • Inner structure of an AM manufactured aluminum gear wheel.
  • ISO 25178 surface roughness evaluation of a Ti-6Al-4V test sample.
  • Surface roughness evaluation of an AM printed duct (Ti-6Al-4V).
    Surface roughness evaluation of an AM printed duct (Ti-6Al-4V).Test part supplied by LZN and Liebherr
    Test part supplied by LZN and Liebherr

    Surface roughness evaluation of an AM printed duct (Ti-6Al-4V); high resolution scan acquired at ~1.7 mm voxel over a ~3.4 mm area.

    Surface roughness evaluation of an AM printed duct (Ti-6Al-4V); high resolution scan acquired at ~1.7 mm voxel over a ~3.4 mm area.

  • Imaging of different A205 AM powder qualities at 3.9 µm voxel resolution.
    Imaging of different A205 AM powder qualities at 3.9 µm voxel resolution.

    Imaging of different A205 AM powder qualities at 3.9 µm voxel resolution.

    Imaging of different A205 AM powder qualities at 3.9 µm voxel resolution.

  • Inner structure of an AM manufactured aluminum gear wheel.
    Inner structure of an AM manufactured aluminum gear wheel.Sample courtesy of Timo Bernthaler, University of Aalen
    Sample courtesy of Timo Bernthaler, University of Aalen

    Inner structure of an AM manufactured aluminum gear wheel; 3 µm voxel resolution imaging is used to see unmelted particles, high-Z inclusions, and small voids.

    Inner structure of an AM manufactured aluminum gear wheel; 3 µm voxel resolution imaging is used to see unmelted particles, high-Z inclusions, and small voids.

  • ISO 25178 surface roughness evaluation of a Ti-6Al-4V test sample.
    ISO 25178 surface roughness evaluation of a Ti-6Al-4V test sample.Test part by LZN and Liebherr
    Test part by LZN and Liebherr

    ISO 25178 surface roughness evaluation of a Ti-6Al-4V test sample. Results are very similar between XRM and ZEISS Smartproof 5 confocal microscope.

    ISO 25178 surface roughness evaluation of a Ti-6Al-4V test sample. Results are very similar between XRM and ZEISS Smartproof 5 confocal microscope.

Microscopy Solutions for Additive Manufacturing

Typical tasks and applications:

  • Detailed shape, size, and volume distribution analysis of particles in Additive Manufacturing (AM) powder bed to determine proper process parameters
  • High-resolution, non-destructive imaging for microstructural analysis of AM parts
  • 3D imaging for comparison with the nominal CAD representation
  • Detection of unmelted particles, high-Z inclusions, and voids
  • Surface roughness analysis of inner structures that cannot be accessed by other methods
  • Intact cylinder cell (160 kV)
  • Large pouch cell (120 kV)
  • Small pouch cell (80 kV)
  • Small pouch cell
  • Intact cylinder cell (160 kV)
    Intact cylinder cell (160 kV)

    Intact cylinder cell (160 kV) – welding burrs, metallic inclusions, folds and kinks in conductive layers.

    Intact cylinder cell (160 kV) – welding burrs, metallic inclusions, folds and kinks in conductive layers.

  • Large pouch cell (120 kV)
    Large pouch cell (120 kV)

    Large pouch cell (120 kV) – failure analysis, swelling, wetting, electrolyte gas evolution.

    Large pouch cell (120 kV) – failure analysis, swelling, wetting, electrolyte gas evolution.

  • Small pouch cell (80 kV)
    Small pouch cell (80 kV)

    Small pouch cell (80 kV) – in situ microstructure, aging effect at cathode grain level, separator layer.

    Small pouch cell (80 kV) – in situ microstructure, aging effect at cathode grain level, separator layer.

  • Small pouch cell
    Small pouch cell

    Small pouch cell: 0.4x overview scan; 4x Resolution at a Distance; 20x RaaD.

    Small pouch cell: 0.4x overview scan; 4x Resolution at a Distance; 20x RaaD.

Microscopy Solutions for Lithium Ion Batteries

Typical tasks and applications:

  • Recipe development and supply chain control: inspection of intact samples for effective supplier control, revealing changes in recipe or cost savings that may affect performance or longevity
  • Safety and quality inspection: Identification of debris, particle formation, burrs at the electrical contact or damage to the polymer separator
  • Lifetime and aging effect: Longitudinal studies of aging effects

Accessories

Upgrade your microscope with additional accessories to enhance its capabilities

3D X-ray dataset of a camera lens acquired using ZEISS Xradia 620 Versa and DeepRecon Pro.
3D X-ray dataset of a camera lens acquired using ZEISS Xradia 620 Versa and DeepRecon Pro.

Advanced Reconstruction Toolbox

Higher Throughput with Image Quality

Artificial intelligence (AI)-driven reconstruction technologies for your ZEISS Xradia systems. A deep understanding of both X-ray physics and applications enable you to solve some of the hardest imaging challenges in new and innovative ways.

Autoloader option enables you to program up to 70 samples at a time to run sequentially.
Autoloader option enables you to program up to 70 samples at a time to run sequentially.

Autoloader

Maximize Your Instrument’s Utilization

Maximize use and minimize user intervention with the optional ZEISS Autoloader. Reduce the frequency of user interaction and increase productivity by enabling multiple jobs to run. Load up to 14 sample stations, which can support up to 70 samples, queue, and allow to run all day, or off-shift.

In Situ Interface Kit
In Situ Interface Kit

In Situ Interface Kit

Push the Limits of Scientific

ZEISS Xradia platforms can accommodate a variety of in situ rigs, from high-pressure flow cells to tension, compression, and thermal stages, to user-customized designs. Moving beyond the three dimensions of space, leverage the non-destructive nature of X-ray investigation to extend your studies into the dimension of time with 4D experiments.

Lithium ion battery
Lithium ion battery

Lithium ion battery

Visualization and Analysis

ZEISS Recommends Dragonfly Pro

An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, SEM and helium ion microscopy.​ Available exclusively through ZEISS, ORS Dragonfly Pro offers an intuitive, complete, and customizable toolkit for visualization and analysis of large 3D grayscale data. Dragonfly Pro allows for navigation, annotation, creation of media files, including video production, of your 3D data. Perform image processing, segmentation, and object analysis to quantify your results.

Optional Flat Panel Extension (FPX) delivers large-sample, high throughput scanning with ZEISS best-in-class image quality.
Optional Flat Panel Extension (FPX) delivers large-sample, high throughput scanning with ZEISS best-in-class image quality.

Optional Flat Panel Extension (FPX) delivers large-sample, high throughput scanning with ZEISS best-in-class image quality.

Flat Panel Extension (FPX)

Large Samples with Throughput

Optional Flat Panel Extension (FPX) delivers large-sample, high throughput scanning with ZEISS best-in-class image quality. FPX enhances imaging flexibility and creates workflow efficiencies with an all-in-one system for industrial and academic research.

Scout-and-Zoom is a unique capability of ZEISS X-ray microscopes that leverages FPX to perform exploratory “Scout” scans across a large field of view to identify interior regions of interest for higher resolution “Zoom” scans without complex sample preparation.

FPX also enables high throughput and large area mapping capabilities for LabDCT Pro.

Exclusively Available for ZEISS Xradia 620 Versa XRM

Non-destructive three-dimensional grain map of an Armco iron sample with illustrations of the various grain analysis that can be performed on a typical LabDCT Pro dataset.
Non-destructive three-dimensional grain map of an Armco iron sample with illustrations of the various grain analysis that can be performed on a typical LabDCT Pro dataset.

Non-destructive three-dimensional grain map of an Armco iron sample with illustrations of the various grain analysis that can be performed on a typical LabDCT Pro dataset.

LabDCT Pro

Unlocking Crystallographic Information

LabDCT Pro for diffraction contrast tomography (DCT), available exclusively on Xradia 620 Versa, enables non-destructive mapping of grain orientation and microstructure in 3D. Direct visualization of 3D crystallographic grain orientation opens up a new dimension in the characterization of polycrystalline materials like metal alloys, geomaterials, ceramics, or pharmaceuticals.

✔ LabDCT Pro supports specimens with crystal structures from cubic symmetry to systems with lower symmetry such as monoclinic materials
✔ Acquire high resolution crystallographic information using the dedicated 4X DCT objective. For even larger samples, use large area mapping and increase your throughput with the Flat Panel Extension (FPX).
✔ Obtain comprehensive 3D microstructure analysis from larger representative volumes and wide-ranging sample geometries
✔ Investigate microstructural evolution with 4D imaging experiments.
✔ Combine 3D crystallographic information with 3D microstructural features.
✔ Combine modalities to understand structure-property relationships.

Non-contact, non-destructive measurement of a smartphone camera lens module.
Non-contact, non-destructive measurement of a smartphone camera lens module.

When investigating a smartphone camera lens module in the assembled state, the assessment of geometrical properties requires a non-contact, non-destructive measurement method to quantify relational parameters. MTX allows the accuracy-verified measurement of properties like thickness of annular wedges, centration interlock diameters, gaps between wedges, lens- tolens tilt, or apex heights and centration. These parameters are important for functional inspection and the enhancement of manufacturing designs and processes, to enable production of versatile cell phone cameras.

Metrology Extension

Adding Measurement Accuracy to X-ray Microscopy

With the Metrology Extension (MTX) you turn your Xradia 620 Versa into a verified measurement accuracy system far beyond the limits of conventional CT technology. This is essential for academic and industrial labs where miniaturization and integration of components drive a growing demand for high-resolution metrology. Benefit from high resolution X-ray imaging combined with high-precision metrology.

✔ Leading CT metrology accuracy: Calibrated with MTX, ZEISS Xradia Versa provides a market-leading maximum permissible error value of MPESD = (1.9 + L/100) μm for measurements in small-scale volumes, where L is the measured length in mm.
✔ Small volumes at high resolution: MTX enables measurements with high dimensional accuracy within small reconstructed volumes of 125 mm3.
✔ Simple calibration workflow: The MTX package provides an integrated user-guided calibration workflow.
✔ Once the calibration routine has been executed, you perform precise measurements and make the data available to standard metrology software for further processing.

Downloads

    • 3D Imaging Systems

      Your Guide to the Widest Selection of Optical Sectioning, Electron Microscopy and X-ray Microscopy Techniques.

      Pages: 68
      File size: 5 MB
    • ZEISS Xradia 510 Versa

      Submicron X-ray Imaging: Maintain High Resolution Even at Large Working Distances

      Pages: 25
      File size: 13 MB
    • ZEISS Xradia 610 and 620 Versa

      Your 3D X-ray Microscopes for Faster Sub-Micron Imaging of Intact Samples

      Pages: 41
      File size: 11 MB
    • Flyer: ZEISS DeepRecon Pro for Electronics and Failure Analysis

      Faster 3D X-ray data acquisition and superior imaging quality for electronics failure analysis

      Pages: 2
      File size: 1 MB
    • Metrology Extensionfor ZEISS Xradia Versa

      Adding measurement accuracy to X-ray microscopy.

      Pages: 4
      File size: 812 KB
    • ZEISS DeepRecon

      Faster throughput, superior image qualityfor industry

      Pages: 2
      File size: 1 MB
    • ZEISS Mineralogic 3D

      The next dimension in automated mineralogy

      Pages: 2
      File size: 1 MB
    • ZEISS Mineralogic 3D for Mining - Flyer

      Your geometallurgy goals realized with maximum efficiency

      Pages: 2
      File size: 677 KB
    • ZEISS ORS Dragonfly

      Outstanding 3D visualization with best-in-class graphics

      Pages: 2
      File size: 689 KB
    • ZEISS PhaseEvolve

      Reveal contrast that has never been seen before

      Pages: 2
      File size: 2 MB
    • ZEISS Xradia Versa with FPX

      Larger samples, higher throughput

      Pages: 2
      File size: 1 MB
    • ZEISS ZEN Intellesis - Flyer

      Segmentation and Classification by Machine Learning

      Pages: 4
      File size: 871 KB
    • ZEISS Xradia Versa 3D X-ray Microscope

      Accelerate Failure Analysis and Process Development for Next-generation Electronics

      Pages: 8
      File size: 7 MB
    • Diffraction Contrast Tomography

      Unlocking Crystallographic Information from Laboratory X-ray Microscopy

      Pages: 6
      File size: 1 MB
    • X-ray Nanotomography in the Laboratory

      with ZEISS Xradia Ultra 3D X-ray Microscopes

      Pages: 15
      File size: 6 MB
    • 4D Study of Silicon Anode Volumetric Changes in a Coin Cell Battery using X-ray Microscopy

      Pages: 7
      File size: 1 MB
    • ZEISS Mineralogic 3D para el ámbito de la geociencia (Spanish Version)

      Alcance sus objetivos de identificación de minerales de forma no destructiva

      Pages: 2
      File size: 1 MB
    • ZEISS Xradia 610 & 620 Versa

      탐구의 한계를 확장해 보세요.

      Pages: 41
      File size: 26 MB

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