Introducing LaserFIB for ZEISS Crossbeam
Your femtosecond laser for ultrafast, large-scale material ablation
Discover the new LaserFIB for ZEISS Crossbeam, your femtosecond laser for ultrafast material processing of large samples.
Fabricate samples on the scale from 10 µm to 1 mm or more. Cut deep cross-section through hard material such as SiC and expose structures of interest directly. When performing laser milling you will easily avoid contamination of your FIB-SEM as the laser is attached to a dedicated chamber which is separated from the main instrument chamber.
Massive Material Removal
Prepare larger samples in less time
The new LaserFIB for ZEISS Crossbeam is the ideal tool to prepare extremely large cross-sections up to millimeters in width and depth within minutes. Thanks to the ultrashort pulse duration of the femtosecond laser, LaserFIB reaches highest removal rates of up to 15 mio. µm³ per second.
These high ablation rates are ideal to prepare samples for further FIB machining with ZEISS Crossbeam, complementing LaserFIB with highest precision at an even smaller scale (100 nm – few 10 µm).
Combining Laser and FIB
Reveal all structural details
Expose regions that are hidden under the surface directly, revealing all structural details in a wide range of material types. Whether a hard or soft material, conducting or insulating material: LaserFIB machines your sample at unprecedented speed. Applications include preparation of titanium alloy pillars for micromechanical testing or cube preparation in tungsten carbide.
Before laser processing, you can correlate your FIB-SEM reference image with 3D data, e.g. X-ray microscopy data. After laser processing, return your sample to the main FIB-SEM chamber for analysis. Perform final FIB polishing to reveal even more details.
Conduct quasi-athermal ablation
Thanks to ultrashort laser pulses (femtosecond laser), LaserFIB conducts quasi-athermal ablation, reducing sample damage and heat affected zones to a minimum.
The laser work is done in a dedicated chamber to avoid contamination and to enable safe and easy sample transfer between laser chamber and the main FIB-SEM chamber.