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X-ray microscopy from ZEISS
ZEISS X-ray microscopy for industry
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ZEISS X-ray microscopy for industry

ZEISS X-ray microscopy for industry offers significant advantages for your workflows by providing a non-destructive, 3D view of the interior of specimens. It allows you to capture a full, detailed view of structures and failures without altering the specimen. This technique is ideal for monitoring changes over time, as it preserves the integrity of the specimen. ZEISS X-ray microscopy complements other imaging and analytical methods, such as SEM, FIB-SEM, light microscopy, and various testing techniques like XRD, XPS, and mechanical tests. Its ability to integrate with 4D experiments further enhances its value in complex research and analysis.​

New: ZEISS X-ray source technology

Exclusively available on the ZEISS VersaXRM 730

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The ZEISS X-ray source technology combines advanced engineering with exceptional stability and reliability to enable high-performance X-ray microscopy. Exclusively available on the ZEISS VersaXRM 730, it delivers optimized imaging performance for demanding applications.

With its end-to-end 3D X-ray microscopes, ZEISS offers a broad portfolio of systems for a variety of applications in the field of industrial quality assurance.​

ZEISS XRMs for industry​

X-ray microscopy portfolio
ZEISS Xradia CrystalCT, Context, VersaXRM and Ultra industrial CT and X-ray microscopy systems for 3D materials analysis.
Accessibility​

Navx user interface enables highest quality scans for all user types and skill levels to increase adoption with more streamlined user experience and enhanced instrument usability.​
Productivity

Faster time-to-results and scantimes to accelerate and accommodate more users and sample types.
Capability

Push the boundaries of RaaD (Resolution at a Distance) to the next level with even higher resolution for a larger variety sample sizes and types. Benefit from faster scans, for larger samples with ZEISS Flat Panel Detector (FPX).

High-capability X-ray imaging for industrial applications

RaaD combines geometric projection and optical magnification to support high-resolution analysis across varied sample sizes.

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    With Resolution at a Distance (RaaD) from ZEISS​

    Non-destructive imaging at submicron-scale resolution​

    By using two-stage (geometric + optical) magnification, a 3D X-ray microscope can produce high-resolution images even of relatively large, intact objects. This is largely due to the detector design shown on the right. Scintillator-coupled optics with different magnifications allow the user to adjust the imaging magnification independently of the working distance, which is not possible in microCT. This is called RaaD = Resolution at a Distance.

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    Standard microCT​

    Without using ZEISS Resolution at a Distance (RaaD)​

    If you were to use a flat-panel-based microCT to obtain the best resolution of an apple seed, you would have to cut the apple open and place it very close to the X-ray source. Even by doing that, the scanning resolution would still be limited to a range above 2 µm, depending on the detector you use.

ZEISS Xradia CrystalCT industrial CT scanner with open cabinet showing numbered internal components and control workstation.

FPX Flat Panel Detector

Industrial imaging capability with breakthrough spatial resolution

Benefit from faster scans and the ability to efficiently analyze larger samples with the powerful ZEISS Flat Panel Detector (FPX).​

  1. FPX Detector​
  2. 0.4x Detector​
  3. 4x Detector​
  4. Sample Stage​
  5. X-ray Source
  • ZEISS source technology on the VersaXRM 730 with control PC for inline surface quality control in production.
  • ZEISS METROTOM industrial CT scanner with rotary sample stage inside a metrology inspection cabinet.
  • ZEISS METROTOM industrial CT scanner measuring a mounted precision component on a rotary table in a metrology lab.
  • ZEISS source technology on the VersaXRM 730 with control PC for inline surface quality control in production.
  • ZEISS METROTOM industrial CT scanner with rotary sample stage inside a metrology inspection cabinet.
  • ZEISS METROTOM industrial CT scanner measuring a mounted precision component on a rotary table in a metrology lab.

ZEISS ZXR-1 X-ray source

Engineered for reliable X-ray imaging

Exclusive ZEISS source technology on the VersaXRM 730 ensures stable performance and efficient long-term operation.​

Exceptional imaging stability​
Patented, actively cooled tungsten-diamond transmission target technology combined with intelligent real-time electronic beam control ensures highly stable imaging performance.​

Outstanding reliability​
A unique architecture actively cools the high-voltage power supply and emitter control electronics, supporting efficient thermal management and long-term system stability.​

Engineered and manufactured by ZEISS​
In-house development and production provide full control over quality, performance, and continuous technology advancement.​

Low cost of ownership​
Designed for efficient operation with an expected source lifetime of up to 7,500 hours (depending on sample type and imaging conditions).

Laptop running ZEISS NavX User Interface displaying CT scan views for industrial metrology analysis.
Laptop running ZEISS NavX User Interface displaying CT scan views for industrial metrology analysis.

Accessible workflows with ZEISS ZEN Navx

Intelligent guidance and automation make data acquisition effortless and efficient.

Navx guides users through automated workflows with intelligent system insights to deliver results more easily and efficiently​.

  • Effortless data acquisition for faster, more reliable results
  • Intuitive guidance with infographic-based workflow models
  • Streamlined, fully automated workflows to save time and reduce errors
  • Embedded Volume Scout for quick 3D previews and planning
  • ZEISS ZEN Navx File Transfer Utility for fast, secure data sharing 

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ZEISS DeepScout: AI-powered productivity

Revolutionize your workflow with 100× faster throughput and new applications unlocked.

Revolutionize your workflow with 100× faster throughput and new applications unlocked. ZEISS Advanced Reconstruction Toolbox (ART) for ZEISS X-ray microscopes enables you to accelerate productivity in ways never before possible. AI-based ZEISS DeepScout changes the game for understanding your sample, with throughput boosts enabling practical use of many new applications. A smartphone package acquired using DeepScout includes a large-field-of-view scan, a high-resolution scan to train the model, and a high-resolution reconstruction for the Large Field of View (LFOV).

ZEISS DeepRecon Pro: redefining reconstruction productivity

Leverage AI-powered reconstruction for faster, smarter, and more reliable analysis.
  • Comparison of CT scans of a lithium‑ion battery graphite anode microstructure.
    Comparison of CT scans of a lithium‑ion battery graphite anode microstructure with labeled regions at 100 µm scale.

    Faster time-to-results and scan times​

    ZEISS DeepRecon Pro improves the clarity of cathode grains and polymer separator. It also allows for the recovery of features otherwise obscured by image noise, such as the electrolyte saturated anode.​

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    Unmatched clarity for Metal Matrix Syntactic Foam (MMSF)​

    Metal Matrix Syntactic Foam uses aluminum-oxide hollow spheres to significantly reduce weight while maintaining strength. To accurately assess material quality, porosity, and structural integrity, maximum image detail is essential.​

    DeepRecon Pro ImageClarity delivers exactly that:​

    • More fine features​
    • Less noise​
    •  Superior visibility of pores and microstructures compared to standard FDK reconstruction and typical competitor algorithms.​ 

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    Reveal hidden particles in C4 bump structures with DeepRecon Pro ImageClarity​

    DeepRecon Pro ImageClarity uncovers hidden particles on the metal trace of this C4 bump sample—details that remain difficult or impossible to see with standard FDK reconstruction or the non-local means (NLM) algorithms commonly used by competitors.​

    With significantly less noise and more visible features, DeepRecon Pro ImageClarity delivers the clarity needed for accurate defect detection and advanced semiconductor inspection.​

Rich 3D info

With X-ray microscopy from ZEISS
ZEISS Xradia Context Industrial CT scanner with integrated control computer for non-destructive 3D inspection.
ZEISS Context XRM​
ZEISS Xradia CrystalCT Industrial CT scanner with integrated control workstation for non-destructive 3D inspection.
ZEISS CrystalCT XRM
ZEISS VersaXRM industrial CT scanner with integrated computer workstation for high-resolution 3D X-ray inspection.
ZEISS Versa XRM
ZEISS Xradia Ultra high‑resolution 3D X-ray microscope system on casters for non-destructive industrial inspection.
ZEISS Ultra XRM

Spatial Resolution

0.95 µm

0.95 µm

450 nm

50 nm

Minimum Achievable Voxel

0.5 µm

0.5 µm

40 nm

16 nm

System

Most advanced microCT platform in the industry

The first commercial microCT crystallographic imaging system

Discover more with 3D X-ray imaging​ at submicron resolution

Nanoscale X-ray imaging: explore the speed for failure analysis and inspection

Benefits
  • ZEISS XRM Context® micro-computed tomography (microCT) is user-friendly.​
  • Its high-array flat panel detector provides high resolution for fine details in large volumes.​
  • Features a large field of view and rapid sample mounting/alignment.​
  • Streamlined acquisition with fast data reconstruction times.
  • ZEISS XRM CrystalCT® enhances computed tomography imaging​
  • Reveals crystallographic grain microstructures​
  • Transforms study of polycrystalline materials (metals, ceramics, etc.)​
  • Provides deeper insights for materials research 
  • ZEISS Versa 3D X-ray microscopes (XRM) offer superior 3D image quality ​
  • Features dual-stage magnification with synchrotron-caliber optics​
  • Incorporates RaaD™ (Resolution at a Distance) technology for high resolution at large distances​
  • Advanced Reconstruction Toolbox (ART) enhances results with AI-based image quality and throughput improvements
  • ​ZEISS XRM Ultra provides synchrotron-like capabilities in your lab​
  • No need to worry about limited beamtime​
  • Delivers nano-scaled resolution with non-destructive 3D X-ray microscopy

ZEISS Context XRM

ZEISS CrystalCT XRM

ZEISS VersaXRM 730

ZEISS Ultra XRM

ZEISS XRM: X-ray microscopy solutions for industry

  • Thumbnail for video "ZEISS Versa XRM Product family"

    ZEISS Versa XRM Product family
  • Thumbnail for video "Resolution at a distance capability ZEISS Versa XRM 730"

    Resolution at a distance capability ZEISS Versa XRM 730
  • Thumbnail for video "Resolution at a distance capability ZEISS Versa XRM 515"

    Resolution at a distance capability ZEISS Versa XRM 515
  • Thumbnail for video "Fast 3D failure analysis correlative workflow solution from ZEISS"

    Fast 3D failure analysis correlative workflow solution from ZEISS
  • Thumbnail for video "Cross-scale material analysis in just four steps"

    Cross-scale material analysis in just four steps
  • Thumbnail for video "Preparation and analysis of solid-state batteries with ZEISS Xradia, ZEISS Crossbeam, ZEISS Orion"

    Preparation and analysis of solid-state batteries with ZEISS Xradia, ZEISS Crossbeam, ZEISS Orion

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    Product video presenting the flagship product of the award-winning Versa XRM family, which provides the most advanced and highest performing non-destructive, 3D imaging and analysis capabilities. ZEISS VersaXRM 730 extends the boundaries of non-destructive 3D imaging with advanced contrast tuning capabilities, extensive filtering options, and enhancements delivering greater accuracy and workflow.
    ZEISS Versa XRM product family.

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    Explaining the benefits of the Resolution at a Distance capability of ZEISS XRM systems and how it differs from conventional Micro-CT solutions, showing ZEISS VersaXRM 730.
    Resolution at a distance capability.

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    Explaining the benefits of the Resolution at a Distance capability of ZEISS XRM systems and how it differs from conventional Micro-CT solutions, showing ZEISS VersaXRM 515.
    Resolution at a distance capability.

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    Watch the video about our correlative workflow solution! Learn how easy it is to use your data across technologies with ZEISS Solutions and how to achieve reliable and efficient results.
    Fast 3D failure analysis.correlative workflow solution from ZEISS.

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    What do your macroscopic structures look like? How do you find the regions of interest in a large sample? How do you access these regions of interest (ROI)? And how do you analyze them further?
    Cross-scale material analysis in just four steps.

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    By inspecting intact samples, it is possible to determine changes in the composition that influence the quality and service life of batteries. ZEISS microscopy solutions for industry offer non-destructive and high-resolution 3D analyses as well as correlative analyses that are important for quality inspection.
    Preparation and analysis of solid-state batteries with ZEISS Xradia, ZEISS Crossbeam, ZEISS Orion.​

Downloads

  • Preview image of RMS_Brochure_VersaXRM730 EN PDF

    RMS_Brochure_VersaXRM730 EN PDF

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    ZEISS_IMS_Ultra_roduct-info_EN.pdf

    10 MB
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    ZEISS_IMS_product-info_XRM_CrystalCT_1-3_EN.pdf

    15 MB
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  • Preview image of ZEISS_IMS_product-info_XRM_Context_1-4_EN.pdf

    ZEISS_IMS_product-info_XRM_Context_1-4_EN.pdf

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  • Preview image of ZEISS_IMS_VersaXRM730_Product-flyer_PDF_EN

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  • Preview image of ZEISS_IMS_product-flyer_Versa_ZXR1_EN.pdf

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Contact us​

Interested in exploring our products or services further? We're excited to offer you more details or a live demo, either remotely or in person.​

ZEISS Metrology Shop

Easily order probes, measurement accessories, and more​

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Get access to the full range of systems and software services​

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Do you need more information?

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