Multibeam Array Tomography
High Throughput of Large Volumes of Ultrastructural Data
Schematic Representation of a Typical Workflow
A resin-embedded sample is cut into an array of serial sections, each with a section thickness of typically 30 – 70 nm, and attached to a sample carrier in the order they were cut.
Each serial section is imaged in the multi-beam scanning electron microscope (ZEISS MultiSEM).
The acquired EM images are processed and digitally aligned into a 3D data set. Cell compartments can be identified and segmented.
The segmented 3D data set can be visualized, investigated, and statistically analyzed.
Understanding Neuronal Connectivity of Brain Tissue on a Larger Scale
Assembled mosaic of a square millimeter captured at 4 nm pixel size in 6.5 minutes from a 30 nm thick brain slice, prepared with a high-contrast staining protocol and cut with an ATUMtome, an ultramicrotome that collects sections on a tape.
Individual hexagonal multibeam fields of view (mFoV) put together using an exemplary set of seven mFoV taken from the previous data set.
Example of a single mFoV, consisting of 61 individual image tiles acquired with 61 electron beams in parallel, covering more than 100 µm from left to right, typically acquired in just seconds.