ZEISS Intelligent Workflows

ZEISS @ Semicon Europa

Tue, 18 November 2025 - Fri, 21 November 2025

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Unleash the Power of Cutting-Edge Microscopy in Electronics

ZEISS Solutions for Semiconductor Development, Manufacturing and Analysis

With the most comprehensive imaging portfolio in the industry, ZEISS delivers cutting-edge solutions across the entire semiconductor value chain—from wafer fab to packaging and assembly. For mask making and lithography, ZEISS enables zero defect strategies, in-die metrology, and precise overlay control. Its process control and failure analysis tools provide actionable insights to meet the challenges of next-gen semiconductor devices.

Register for a free trade show ticket and visit ZEISS at Semicon Europe. Semicon will be held in parallel to Productronica, the ticket is valid for both events.

Visit ZEISS also at Advanced Packaging Conference (APC) on Nov 19 and MEMS & Imaging Sensors Summit on Nov 20. Location: ICM Munich, Room 14a

Please note:

Online registration in advance is required.
The online voucher link can only be redeemed once and is valid for one person at a time.
Use the mobile ticket for smartphone and tablet or the Print@home-Ticket.
The ticket is valid for Semicon and Productronica during the trade fair times.

💡 Meet us at our booth to experience

Multi-Site lamella preparation in silicon using ZEN TEM Prep module in ZEN core. The array contains 7x6 1µm thick lamellas, aka chunks.

Microscopy Systems

Automated workflow for site-specific preparation ideally suited for high resolution TEM and STEM imaging and analysis at atomic resolution. Navigate specimen’s ROI, extract TEM lamella including ROI from bulk sample, perform the bulk milling or trenching step, finalize the workflow with lift-out and thinning where appropriate.

Axio Imager Vario

Analyze smallest MEMS sensors or an entire flat panel. Investigate extremely large specimens simultaneously offering high stability.

Individual software solutions

Optimized and modern infrastructures and environmental architectures in the cleanroom. Connected entire production chains, eliminated ineffective isolated solutions and anchored possibilities for cross-location platform architectures on a cloud basis. Benefit from higher quality, production reliability and more efficient use of resources.