Accelerate Development and Manufacturing with Advanced Microscopy
Improved Production Yields of Defect-Free Devices
Consumer demand for brighter and more interactive display panels in electronic products is driving innovation in the highly competitive display industry. Display technology is evolving, with LCD and rigid organic light-emitting-diode (OLED) technology now produced in large volumes at low cost, and premium consumer products offering flexible OLED and microLED displays.
OLED, microLED and photonics applications are complex systems utilizing sensitive and difficult-to-analyze materials that demand advanced microscopy technologies in their development and manufacture.
3D Tomography of Image Sensor
3D FIB-SEM tomography dataset of an image sensor, acquired in a ZEISS Crossbeam. Volume size 15.5 x 15.3 x 11.2 µm3, voxel size (15 nm)3. One application of this technique is the examination of spatial crack propagation in the 3D dataset.
3D Tomography of Smartphone Camera Module
3D Reconstruction of Smartphone Camera Module
Non-destructive 3D X-ray imaging of camera module acquired at 18 µm/voxel resolution shows CMOS imaging sensor and other mechanical components.
Acquired by ZEISS Xradia Versa X-ray microscope
Smartphone Camera Lens Analysis
Virtual cross section focusing on six-layer optical lens stacks imaged at 18 µm/voxel resolution.
Acquired with ZEISS Xradia Versa X-ray microscope using Compton scattering mechanism and a ZEISS proprietary source filter