![macro detail of RGB-LED-stripe]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.100.100.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.360.360.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.768.768.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1024.1024.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1280.1280.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1440.1440.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1442.1442.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg"} "macro detail of RGB-LED-stripe")
Accelerate Development and Manufacturing with Advanced Microscopy
Improved Production Yields of Defect-Free Devices
Consumer demand for brighter and more interactive display panels in electronic products is driving innovation in the highly competitive display industry. Display technology is evolving, with LCD and rigid organic light-emitting-diode (OLED) technology now produced in large volumes at low cost, and premium consumer products offering flexible OLED and microLED displays.
OLED, microLED and photonics applications are complex systems utilizing sensitive and difficult-to-analyze materials that demand advanced microscopy technologies in their development and manufacture.
3D Tomography of Image Sensor
3D FIB-SEM tomography dataset of an image sensor, acquired in a ZEISS Crossbeam. Volume size 15.5 x 15.3 x 11.2 µm3, voxel size (15 nm)3. One application of this technique is the examination of spatial crack propagation in the 3D dataset.
3D Tomography of Smartphone Camera Module
![3D X-ray Image of Smartphone Camera Module]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-camera-module-3d-xrm.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-camera-module-3d-xrm.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-camera-module-3d-xrm.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-camera-module-3d-xrm.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-camera-module-3d-xrm.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-camera-module-3d-xrm.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original./smartphone-camera-module-3d-xrm.jpg"} "3D X-ray Image of Smartphone Camera Module")
3D Reconstruction of Smartphone Camera Module
3D Reconstruction of Smartphone Camera Module
Non-destructive 3D X-ray imaging of camera module acquired at 18 µm/voxel resolution shows CMOS imaging sensor and other mechanical components.
Acquired by ZEISS Xradia Versa X-ray microscope
![Six Layer Optical Lens Stack with 3D XRM]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1920.1920.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg"} "Six Layer Optical Lens Stack with 3D XRM")
Smartphone Camera Lens Analysis
Smartphone Camera Lens Analysis
Virtual cross section focusing on six-layer optical lens stacks imaged at 18 µm/voxel resolution.
Acquired with ZEISS Xradia Versa X-ray microscope using Compton scattering mechanism and a ZEISS proprietary source filter
Related Products
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![ZEISS GeminiSEM Family]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.100.100.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.360.360.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.768.768.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.1024.1024.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.1280.1280.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.1353.1353.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.1353.1353.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg"} "ZEISS GeminiSEM Family")
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![ZEISS Xradia Versa XRM]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.100.100.174,252,1601,1679.file/xradia-630-versa.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.360.360.174,252,1601,1679.file/xradia-630-versa.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.768.768.174,252,1601,1679.file/xradia-630-versa.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.1024.1024.174,252,1601,1679.file/xradia-630-versa.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.1280.1280.174,252,1601,1679.file/xradia-630-versa.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.1427.1427.174,252,1601,1679.file/xradia-630-versa.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.1427.1427.174,252,1601,1679.file/xradia-630-versa.jpg"} "ZEISS Xradia Versa XRM")
Downloads
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ZEISS Crossbeam Family
Your FIB-SEM for High Throughput 3D Analysis and Sample Preparation
File size: 8 MB -
Flyer: ZEISS DeepRecon Pro for Electronics and Failure Analysis
Faster 3D X-ray data acquisition and superior imaging quality for electronics failure analysis
File size: 1 MB -
ZEISS Xradia Versa Family
Complete your failure analysis workflow with high-resolution, non-destructive imaging
File size: 710 KB -
ZEISS Xradia Versa 3D X-ray Microscope
Accelerate Failure Analysis and Process Development for Next-generation Electronics
File size: 7 MB
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ZEISS GeminiSEM FE-SEM Family
Perform versatile, high-resolution semiconductor imaging and characterization.
File size: 1 MB -
ZEISS Xradia Context microCT
3D submicron-resolution X-ray microCT with superior image quality
File size: 1 MB
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![Preview image of ZEISS Crossbeam Family]({"max":"https://asset-downloads.zeiss.com/catalogs/preview/mic/825e2d60-b568-4c4f-9de9-6f216e649fa1/EN_product-info_Crossbeam_rel-3.4.pdf.jpg"} "Download ZEISS Crossbeam Family")
![Preview image of Flyer: ZEISS DeepRecon Pro for Electronics and Failure Analysis]({"max":"https://asset-downloads.zeiss.com/catalogs/preview/mic/887d3510-a8ba-4c73-b8db-dc04cdf9f60e/EN_product-flyer_DeepRecon-Pro-semiconductor-electronics_US.pdf.jpg"} "Download Flyer: ZEISS DeepRecon Pro for Electronics and Failure Analysis")
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