![détail macro de la bande LED RVB]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.100.100.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.360.360.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.768.768.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1024.1024.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1280.1280.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1440.1440.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1442.1442.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg"} "détail macro de la bande LED RVB")
Accélérez le développement et la fabrication grâce à la microscopie avancée
Amélioration des rendements de production d'appareils sans défaut
La demande des consommateurs pour des panneaux d'affichage plus lumineux et plus interactifs dans les produits électroniques stimule l'innovation dans l'industrie hautement compétitive de l'affichage. La technologie d'affichage évolue, avec des écrans LCD et des diodes électroluminescentes organiques rigides (OLED) désormais produits en grandes quantités et à faible coût, et des produits grand public haut de gamme offrant des écrans OLED et microLED flexibles.
Les applications OLED, microLED et photoniques sont des systèmes complexes utilisant des matériaux sensibles et difficiles à analyser qui demandent des technologies de microscopie avancées dans leur développement et leur fabrication.
Tomographie 3D du capteur d'image
Ensemble de données de tomographie 3D FIB-SEM d'un capteur d'image, acquis dans un ZEISS Crossbeam. Volume 15,5 x 15,3 x 11,2 µm3, taille de voxel (15 nm)3. L'une des applications de cette technique est l'examen de la propagation spatiale des fissures dans l'ensemble de données 3D.
Tomographie 3D du module caméra d'un smartphone
![Image 3D aux rayons X du module de caméra d'un smartphone]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-camera-module-3d-xrm.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-camera-module-3d-xrm.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-camera-module-3d-xrm.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-camera-module-3d-xrm.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-camera-module-3d-xrm.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-camera-module-3d-xrm.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original./smartphone-camera-module-3d-xrm.jpg"} "Image 3D aux rayons X du module de caméra d'un smartphone")
Reconstruction 3D du module caméra d'un smartphone
Reconstruction 3D du module caméra d'un smartphone
L'imagerie par rayons X 3D non destructive du module de caméra acquise à une résolution de 18 µm/voxel montre le capteur d'imagerie CMOS et d'autres composants mécaniques.
Image acquise avec le microscope à rayons X ZEISS Xradia Versa
![Pile de lentilles optiques à six couches avec 3D XRM]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1920.1920.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg"} "Pile de lentilles optiques à six couches avec 3D XRM")
Analyse de l'objectif de la caméra d'un smartphone
Analyse de l'objectif de la caméra d'un smartphone
Coupe transversale virtuelle se concentrant sur des piles de lentilles optiques à six couches capturée à une résolution de 18 µm/voxel.
Acquise avec le microscope à rayons X ZEISS Xradia Versa à l'aide du mécanisme de diffusion Compton et un filtre source propriétaire ZEISS
Produits associés
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![Série ZEISS GeminiSEM]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.100.100.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.360.360.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.768.768.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.1024.1024.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.1280.1280.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.1353.1353.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.1353.1353.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg"} "Série ZEISS GeminiSEM")
![ZEISS Xradia Context microCT]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.100.100.420,0,1500,1080.file/context_product.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.360.360.420,0,1500,1080.file/context_product.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.768.768.420,0,1500,1080.file/context_product.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.1024.1024.420,0,1500,1080.file/context_product.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.1080.1080.420,0,1500,1080.file/context_product.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.1080.1080.420,0,1500,1080.file/context_product.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.1080.1080.420,0,1500,1080.file/context_product.jpg"} "ZEISS Xradia Context microCT")
Téléchargements
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ZEISS Crossbeam Family
Your FIB-SEM for High Throughput 3D Analysis and Sample Preparation
Taille du fichier: 8 MB -
Flyer: ZEISS DeepRecon Pro for Electronics and Failure Analysis
Faster 3D X-ray data acquisition and superior imaging quality for electronics failure analysis
Taille du fichier: 1 MB -
ZEISS Xradia Versa Family
Complete your failure analysis workflow with high-resolution, non-destructive imaging
Taille du fichier: 710 KB -
ZEISS Xradia Versa 3D X-ray Microscope
Accelerate Failure Analysis and Process Development for Next-generation Electronics
Taille du fichier: 7 MB
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ZEISS GeminiSEM FE-SEM Family
Perform versatile, high-resolution semiconductor imaging and characterization.
Taille du fichier: 1 MB -
ZEISS Xradia Context microCT
3D submicron-resolution X-ray microCT with superior image quality
Taille du fichier: 1 MB
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![Image d’aperçu de ZEISS Crossbeam Family]({"max":"https://asset-downloads.zeiss.com/catalogs/preview/mic/825e2d60-b568-4c4f-9de9-6f216e649fa1/EN_product-info_Crossbeam_rel-3.4.pdf.jpg"} "Télécharger ZEISS Crossbeam Family")
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![Image d’aperçu de ZEISS GeminiSEM FE-SEM Family]({"max":"https://asset-downloads.zeiss.com/catalogs/preview/mic/14f5a214-7c73-4120-9c6c-99bf9b4908dd/EN_product-flyer_GeminiSEM-for-semiconductor.pdf.jpg"} "Télécharger ZEISS GeminiSEM FE-SEM Family")
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