![Makrodetail eines RGB-LED-Bands]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.100.100.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.360.360.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.768.768.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1024.1024.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1280.1280.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1440.1440.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1442.1442.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg"} "Makrodetail eines RGB-LED-Bands")
Beschleunigen Sie die Entwicklung und Herstellung mit fortschrittlicher Mikroskopie
Höhere Produktionsmengen defektfreier Komponenten
Die Verbrauchernachfrage nach helleren und interaktiveren Displays in elektronischen Produkten treibt innovative Entwicklungen in der stark umkämpften Display-Branche voran. Neue Display-Technologien wie LCDs und starre Leuchtdioden (OLED) können inzwischen in großen Mengen und zu geringen Kosten hergestellt werden. Premium-Verbraucherprodukte bieten bereits heute flexible OLED- und microLED-Displays.
OLED-, microLED- und Photonik-Anwendungen sind komplexe Systeme, in denen empfindliche, schwer zu analysierende Materialien verwendet werden, deren Entwicklung und Herstellung fortschrittliche Mikroskopietechnologien erfordern.
3D‑Tomografie eines Bildsensors
3D-FIB-SEM-Tomografie-Datensatz eines Bildsensors, aufgenommen mit ZEISS Crossbeam. Volumen: 15,5 × 15,3 × 11,2 µm3, Voxelgröße (15 nm)3. Diese Technik kommt beispielsweise bei der Untersuchung der räumlichen Rissausbreitung in 3D‑Datensätzen zur Anwendung.
3D‑Tomografie eines Smartphone-Kameramoduls
![3D‑Röntgenbild eines Smartphone-Kameramoduls]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-camera-module-3d-xrm.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-camera-module-3d-xrm.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-camera-module-3d-xrm.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-camera-module-3d-xrm.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-camera-module-3d-xrm.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-camera-module-3d-xrm.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original./smartphone-camera-module-3d-xrm.jpg"} "3D‑Röntgenbild eines Smartphone-Kameramoduls")
3D‑Rekonstruktion eines Smartphone-Kameramoduls
3D‑Rekonstruktion eines Smartphone-Kameramoduls
Zerstörungsfreies 3D‑Röntgen-Imaging eines Kameramoduls, Auflösung: 18 µm/Voxel; zeigt den CMOS-Bildsensor und andere mechanische Komponenten.
Aufgenommen mit ZEISS Xradia Versa-Röntgenmikroskop
![Optischer Linse, bestehend aus sechs Schichten, mit 3D XRM]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1920.1920.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg"} "Optischer Linse, bestehend aus sechs Schichten, mit 3D XRM")
Analyse eines Smartphone-Kameraobjektivs
Analyse eines Smartphone-Kameraobjektivs
Virtueller Querschnitt mit Fokus auf die aus sechs Schichten bestehenden optischen Linse, Auflösung: 18 µm/Voxel.
Aufgenommen mit ZEISS Xradia Versa-Röntgenmikroskop und Compton-Streuung sowie einem proprietären Lichtquellen-Filter von ZEISS
Verwandte Produkte
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Downloads
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ZEISS Crossbeam Family
Your FIB-SEM for High Throughput 3D Analysis and Sample Preparation
Dateigröße: 8 MB -
Flyer: ZEISS DeepRecon Pro for Electronics and Failure Analysis
Faster 3D X-ray data acquisition and superior imaging quality for electronics failure analysis
Dateigröße: 1 MB -
ZEISS Xradia Versa Family
Complete your failure analysis workflow with high-resolution, non-destructive imaging
Dateigröße: 710 KB -
ZEISS Xradia Versa 3D X-ray Microscope
Accelerate Failure Analysis and Process Development for Next-generation Electronics
Dateigröße: 7 MB
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ZEISS GeminiSEM FE-SEM Family
Perform versatile, high-resolution semiconductor imaging and characterization.
Dateigröße: 1 MB -
ZEISS Xradia Context microCT
3D submicron-resolution X-ray microCT with superior image quality
Dateigröße: 1 MB
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![Vorschaubild von ZEISS Crossbeam Family]({"max":"https://asset-downloads.zeiss.com/catalogs/preview/mic/825e2d60-b568-4c4f-9de9-6f216e649fa1/EN_product-info_Crossbeam_rel-3.4.pdf.jpg"} "Download ZEISS Crossbeam Family")
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