![RGB-LED灯带的宏观细节]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.100.100.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.360.360.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.768.768.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1024.1024.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1280.1280.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1440.1440.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1442.1442.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg"} "RGB-LED灯带的宏观细节")
显示器、LED和光子学
使用先进的显微镜加速产品的开发和制造进程
提高无缺陷器件的产量
消费者对电子产品中显示器界面清晰度和交互性提升的期望推动着竞争激烈的显示器行业不断创新。随着显示器技术的持续发展，LCD和刚性有机发光二极管（OLED）技术现已能够以低成本实现大批量生产，而高端消费产品则提供柔性OLED和microLED显示器。
OLED、microLED和光子学应用往往涉及复杂的系统，使用敏感且难以分析的材料，在开发和制造过程中需要先进的显微镜技术。
图像传感器的三维断层扫描
图像传感器的三维FIB-SEM断层扫描数据集，使用蔡司Crossbeam采集。体积大小：15.5 × 15.3 × 11.2 µm3，体素大小（15 nm）3。该技术的一个应用是检查三维数据集中的空间裂纹扩展。
智能手机相机模块的三维断层扫描
![智能手机相机模块的三维X射线图]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-camera-module-3d-xrm.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-camera-module-3d-xrm.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-camera-module-3d-xrm.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-camera-module-3d-xrm.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-camera-module-3d-xrm.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-camera-module-3d-xrm.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original./smartphone-camera-module-3d-xrm.jpg"} "智能手机相机模块的三维X射线图")
智能手机相机模块的三维重构
智能手机相机模块的三维重构
相机模块的三维X射线无损成像，以18 µm/体素的分辨率采集，显示了CMOS成像传感器和其他机械组件。
使用蔡司Xradia Versa X射线显微镜成像
![六层光学镜头组，使用三维XRM成像]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1920.1920.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg"} "六层光学镜头组，使用三维XRM成像")
智能手机相机镜头分析
智能手机相机镜头分析
聚焦于六层光学镜头组的虚拟截面，以18 µm/体素的分辨率成像。
使用蔡司Xradia Versa X射线显微镜通过Compton散射机制和蔡司专有源滤光片采集
![蔡司Crossbeam——专为高效率三维分析和样品制备量身打造的FIB-SEM]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/fib-sem/crossbeam/crossbeam-550-system.jpg/_jcr_content/renditions/original.image_file.100.100.file/crossbeam-550-system.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/fib-sem/crossbeam/crossbeam-550-system.jpg/_jcr_content/renditions/original.image_file.360.360.file/crossbeam-550-system.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/fib-sem/crossbeam/crossbeam-550-system.jpg/_jcr_content/renditions/original.image_file.768.768.file/crossbeam-550-system.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/fib-sem/crossbeam/crossbeam-550-system.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/crossbeam-550-system.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/fib-sem/crossbeam/crossbeam-550-system.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/crossbeam-550-system.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/fib-sem/crossbeam/crossbeam-550-system.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/crossbeam-550-system.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/fib-sem/crossbeam/crossbeam-550-system.jpg/_jcr_content/renditions/original./crossbeam-550-system.jpg"} "蔡司Crossbeam")
![蔡司GeminiSEM系列]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.100.100.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.360.360.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.768.768.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.1024.1024.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.1280.1280.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.1353.1353.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/electron-ion/sem/geminisem/zeiss_gemini-sem-stage.jpg/_jcr_content/renditions/original.image_file.1353.1353.285,86,1638,1439.file/zeiss_gemini-sem-stage.jpg"} "蔡司GeminiSEM系列")
![蔡司Xradia Context microCT]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.100.100.420,0,1500,1080.file/context_product.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.360.360.420,0,1500,1080.file/context_product.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.768.768.420,0,1500,1080.file/context_product.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.1024.1024.420,0,1500,1080.file/context_product.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.1080.1080.420,0,1500,1080.file/context_product.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.1080.1080.420,0,1500,1080.file/context_product.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-context-microct/context_product.jpg/_jcr_content/renditions/original.image_file.1080.1080.420,0,1500,1080.file/context_product.jpg"} "蔡司Xradia Context microCT")
![蔡司Xradia Versa XRM]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.100.100.174,252,1601,1679.file/xradia-630-versa.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.360.360.174,252,1601,1679.file/xradia-630-versa.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.768.768.174,252,1601,1679.file/xradia-630-versa.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.1024.1024.174,252,1601,1679.file/xradia-630-versa.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.1280.1280.174,252,1601,1679.file/xradia-630-versa.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.1427.1427.174,252,1601,1679.file/xradia-630-versa.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/xradia/xradia-versa/xradia-610-620-versa/xradia-630-versa.jpg/_jcr_content/renditions/original.image_file.1427.1427.174,252,1601,1679.file/xradia-630-versa.jpg"} "蔡司Xradia Versa XRM")
下载
-
-
蔡司 Crossbeam 产品系列
专为高通量 3D 分析和样品制备量身打造的 FIB-SEM
文件大小: 9 MB -
Flyer: ZEISS DeepRecon Pro for Electronics and Failure Analysis
Faster 3D X-ray data acquisition and superior imaging quality for electronics failure analysis
文件大小: 1 MB -
ZEISS Xradia Versa Family
Complete your failure analysis workflow with high-resolution, non-destructive imaging
文件大小: 710 KB -
ZEISS Xradia Versa 3D X-ray Microscope
Accelerate Failure Analysis and Process Development for Next-generation Electronics
文件大小: 7 MB
-
-
-
ZEISS GeminiSEM FE-SEM Family
Perform versatile, high-resolution semiconductor imaging and characterization.
文件大小: 1 MB -
ZEISS Xradia Context microCT
3D submicron-resolution X-ray microCT with superior image quality
文件大小: 1 MB
-
![蔡司 Crossbeam 产品系列的预览图像]({"max":"https://asset-downloads.zeiss.com/catalogs/preview/mic/9e78ebd8-2052-4af4-abc9-1bea0285f29f/CN_product-information_Crossbeam_rel3_4.pdf.jpg"} "下载蔡司 Crossbeam 产品系列")
![Flyer: ZEISS DeepRecon Pro for Electronics and Failure Analysis的预览图像]({"max":"https://asset-downloads.zeiss.com/catalogs/preview/mic/887d3510-a8ba-4c73-b8db-dc04cdf9f60e/EN_product-flyer_DeepRecon-Pro-semiconductor-electronics_US.pdf.jpg"} "下载Flyer: ZEISS DeepRecon Pro for Electronics and Failure Analysis")
![ZEISS Xradia Versa Family的预览图像]({"max":"https://asset-downloads.zeiss.com/catalogs/preview/mic/259c7b8f-bff7-4d2b-a4dc-f2b486faead1/EN_product-flyer_Xradia-Versa-Family_semiconductor.pdf.jpg"} "下载ZEISS Xradia Versa Family")
![ZEISS Xradia Versa 3D X-ray Microscope的预览图像]({"max":"https://asset-downloads.zeiss.com/catalogs/preview/mic/c55cf884-7984-4e5b-a152-5580c7af9099/EN_solutions-brochure_Versa-Electronics-Failure-Analysis.pdf.jpg"} "下载ZEISS Xradia Versa 3D X-ray Microscope")
![ZEISS GeminiSEM FE-SEM Family的预览图像]({"max":"https://asset-downloads.zeiss.com/catalogs/preview/mic/14f5a214-7c73-4120-9c6c-99bf9b4908dd/EN_product-flyer_GeminiSEM-for-semiconductor.pdf.jpg"} "下载ZEISS GeminiSEM FE-SEM Family")
![ZEISS Xradia Context microCT的预览图像]({"max":"https://asset-downloads.zeiss.com/catalogs/preview/mic/f880a917-7f29-4c15-895c-49a5d651de71/EN_product-flyer_Xradia-Context-for-semiconductor.pdf.jpg"} "下载ZEISS Xradia Context microCT")