![macrodetalle de banda LED RGB]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.100.100.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.360.360.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.768.768.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1024.1024.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1280.1280.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1440.1440.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/display-led-photonics-microscopy-solutions.jpg/_jcr_content/renditions/original.image_file.1442.1442.300,0,1742,1442.file/display-led-photonics-microscopy-solutions.jpg"} "macrodetalle de banda LED RGB")
Acelere el desarrollo y la fabricación con microscopía avanzada
Mejor producción de dispositivos sin defectos
Las demandas de los consumidores de paneles de visualización más luminosos e interactivos en los productos electrónicos está impulsando la innovación en la industria sumamente competitiva de las pantallas. La tecnología de la pantalla está evolucionando, con la tecnología LCD y de diodo orgánico de emisión de luz (OLED) rígido que ahora se producen en grandes volúmenes a bajo coste, y los productos de consumo premium que ofrecen OLED flexibles y pantallas microLED.
Las aplicaciones de OLED, microLED y fotónica son sistemas complejos que utilizan materiales sensibles y difíciles de analizar que exigen tecnologías avanzadas de microscopía en su desarrollo y fabricación.
Tomografía en 3D del sensor de imagen
Conjunto de datos de tomografía FIB-SEM en 3D de un sensor de imagen, captado con ZEISS Crossbeam. Tamaño de volumen 15,5 x 15,3 x 11,2 µm3, tamaño de vóxel (15 nm)3. Una aplicación de esta técnica es el examen de la propagación de grietas espaciales en el conjunto de datos en 3D.
Tomografía en 3D del módulo de cámara del smartphone
![Imagen de rayos X en 3D de módulo de cámara de smartphone]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-camera-module-3d-xrm.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-camera-module-3d-xrm.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-camera-module-3d-xrm.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-camera-module-3d-xrm.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-camera-module-3d-xrm.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-camera-module-3d-xrm.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-module-3d-xrm.jpg/_jcr_content/renditions/original./smartphone-camera-module-3d-xrm.jpg"} "Imagen de rayos X en 3D de módulo de cámara de smartphone")
Reconstrucción en 3D de módulo de cámara de smartphone
Reconstrucción en 3D de módulo de cámara de smartphone
Captura de imágenes de rayos X en 3D no destructiva de módulo de cámara, captado con una resolución de 18 µm/vóxel que muestra el sensor de captura de imágenes CMOS y otros componentes mecánicos.
Imagen captada con microscopio de rayos X ZEISS Xradia Versa
![Pila de lente óptica de seis capas con 3D XRM]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.100.100.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.360.360.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.768.768.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1024.1024.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1280.1280.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1440.1440.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/applications/electronics-and-semiconductor/microscopy-solutions-for-semiconductor-and-electronics/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg/_jcr_content/renditions/original.image_file.1920.1920.file/smartphone-camera-lens-assembly-3d-xrm-cross-section.jpg"} "Pila de lente óptica de seis capas con 3D XRM")
Análisis de lentes de cámara de smartphone
Análisis de lentes de cámara de smartphone
Sección transversal virtual centrada en pilas de lentes ópticas de seis capas, captada con una resolución de 18 µm/vóxel.
Imagen captada con el microscopio de rayos X ZEISS Xradia Versa usando el mecanismo de dispersión Compton y un filtro de fuente patentado de ZEISS
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Descargas
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ZEISS Crossbeam Family
Your FIB-SEM for High Throughput 3D Analysis and Sample Preparation
Tamaño de archivo: 8 MB -
Flyer: ZEISS DeepRecon Pro for Electronics and Failure Analysis
Faster 3D X-ray data acquisition and superior imaging quality for electronics failure analysis
Tamaño de archivo: 1 MB -
ZEISS Xradia Versa Family
Complete your failure analysis workflow with high-resolution, non-destructive imaging
Tamaño de archivo: 710 KB -
ZEISS Xradia Versa 3D X-ray Microscope
Accelerate Failure Analysis and Process Development for Next-generation Electronics
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ZEISS GeminiSEM FE-SEM Family
Perform versatile, high-resolution semiconductor imaging and characterization.
Tamaño de archivo: 1 MB -
ZEISS Xradia Context microCT
3D submicron-resolution X-ray microCT with superior image quality
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