Your FIB-SEMs for Nanotomography and Nanofabrication
Your FIB-SEM for High Throughput
3D Analysis and Sample Preparation

ZEISS Crossbeam Family

Discovering and Designing Advanced Materials With Ease

With ZEISS Crossbeam you benefit from a 3D nano-workstation

Combine imaging and analytical performance of a field emission scanning electron microscope (FE-SEM) with the processing ability of a focused ion beam (FIB).

During milling, imaging or when performing 3D analytics, Crossbeam will speed up your FIB applications. Make the most of your 3D analytics with the new EDS module.

Decide on exploiting variable pressure capabilities with ZEISS Crossbeam 340. Or use Crossbeam 550 for your most demanding characterizations.

Enjoy more options with the large chamber now.

Advantages in FIB-SEM

ZEISS Crossbeam with Gemini Optics

Maximize Your SEM Insights

Take advantage of achieving up to 30% better SEM resolution at low voltage.

Count on the SEM performance of your ZEISS Crossbeam for 2D surface sensitive images or when performing 3D tomography. Get excellent images from any sample thanks to the Gemini optics with a resolution down to 1.4 nm at 1 kV acceleration voltage by applying a voltage to the sample with Tandem decel. Characterize your sample comprehensively with a range of detectors. Get pure materials contrast with the unique Inlens EsB detector. Investigate non-conductive specimens undisturbed by charging artifacts.

SEM Performance
collapse
Focused Ion Beam Column of ZEISS Crossbeam

Increase Your FIB Sample Throughput

Profit from up to 40% faster material removal by the introduction of intelligent FIB milling strategies.

Work with the highest ion beam current available in any gallium FIB-SEM. Save time with excellent FIB profiles using up to 100 nA current without compromising the ultimate FIB resolution. Profit from the speed and precision of intelligent FIB scanning strategies for material removal. Automatically prepare batches of samples, like cross-sections, TEM lamellae or any user defined pattern.

Ion Beam Current 
collapse
EDS Analytics in 3D with ZEISS Crossbeam

Experience Best 3D Resolution in Your FIB-SEM Analysis

Enjoy the benefits of integrated 3D EDS analysis.

Expand the capacity of your Crossbeam with ZEISS Atlas 5, the market-leading package for fast, precise tomography. Perform EDS analysis during tomography runs with the integrated 3D Analytics module of ZEISS Atlas 5. ZEISS Crossbeam combines Gemini optics with a FIB tailored for precision and speed. Profit from best 3D resolution and leading isotropic voxel size in FIB-SEM tomography. Probe less than 3 nm in depth and produce surface sensitive, material contrast images using the Inlens EsB detector.

Expand Your Crossbeam
collapse
360° view of Crossbeam 550
0%

The Technology Behind ZEISS Crossbeam

SEM Electron Optics

Choose between Two Columns

The FE-SEM column of ZEISS Crossbeams is based on Gemini electron optics as all ZEISS FE-SEMs. Decide on the Gemini VP column of Crossbeam 340 or the Gemini II column of Crossbeam 550.

Electron Optics
 

Gemini - Novel Optics

Profit from Surface Sensitive Imaging

High resolution imaging at low landing energy is required for beam sensitive, non-conductive samples. A two-step deceleration modus, the Tandem decel, is now introduced to ZEISS Crossbeam 550.

Novelties in Gemini Technology
 

FIB-SEM Technology

Discover the only FIB with 100 nA Current

ZEISS Crossbeam‘s focused ion beam comes with 100 nA current. Speed up your FIB work without compromising machining precision.

FIB-SEM Technology

See the Difference

Slide between high resolution imaging with and without Tandem decel

ZEISS Crossbeam image of reference sample without Tandem decel ZEISS Crossbeam image of reference sample with Tandem decel
Better SEM Resolution with Tandem decel and high gun resolution mode:

Reference sample, gold nanoparticles on carbon, is imaged without (left) and with (right) Tandem decel at 1 kV landing energy at 5 mm working distance, corresponding to the working distance at which FIB milling and simultaneous SEM imaging takes place.

ZEISS Crossbeam Family

ZEISS Crossbeam 550: standard chamber

ZEISS Crossbeam 550: standard chamber

ZEISS Crossbeam 550: standard chamber
ZEISS Crossbeam 550 with standard chamber

ZEISS Crossbeam 550: large chamber

ZEISS Crossbeam 550: large chamber

ZEISS Crossbeam 550: large chamber
ZEISS Crossbeam 550 with large chamber

Within ZEISS Crossbeam Family you have the choice between Crossbeam 340 or Crossbeam 550. Exploit the variable pressure capabilities of Crossbeam 340. Or use Crossbeam 550 for your most demanding characterizations and choose the chamber size, standard or large, that best suits your samples.  

  ZEISS Crossbeam 340 ZEISS Crossbeam 550
SEM Gemini I VP optics
               - 
Gemini II optics
Tandem decel option 
Chamber Size and Ports standard with 18 ports standard with 18 configurable ports or large with 22 configurable ports
Stage 100 mm travel range in x/y standard with 100 mm or large 153 mm travel range in x/y
Charge Control Flood Gun
Local Charge Compensation
Variable Pressure
Flood Gun
Local Charge Compensation
                  -
Exemplified Options Inlens Duo for sequential SE/EsB* imaging
VPSE detector
 
Inlens SE and Inlens EsB* for simultaneous imaging SE/EsB* imaging
large airlock for 8 inch wafers
configure three pneumatically driven accessories simultaneously on the large chamber, e.g. STEM, 4-Quadrant-Backscatter detetor, and local charge compensation
Advantages Maximum sample variety due to variable pressure mode, wide range of in situ experiments, sequential Inlens SE / EsB* imaging possible. High throughput in analytics and imaging, high resolution under all conditions, simultaneous Inlens SE and Inlens EsB* imaging.
    * SE secondary electron, EsB energy selective backscatter

Application Examples

  • Images
    Alumina spheres imaged with Tandem decel on Crossbeam 550

    Alumina spheres imaged with
    Tandem decel on Crossbeam 550

    Trench milled with 100 nA beam current

    Trench milled with 100 nA beam current

    Comparison of milling strategies on Crossbeam 550

    Comparison of milling strategies on Crossbeam 550

    TEM lamella in Ag-Ni-Cu multi-layer system

    TEM lamella in Ag-Ni-Cu multi-layer system

    Batch of 35 TEM lamellae

    Batch of 35 TEM lamellae

    STEM image and EDS elemental map of Cr depletion in steel

    STEM image and EDS elemental map
    of Cr depletion in steel

    Nanopatterning:
    Nanofluidics channels fabricated by FIB in a silicon master stamp (left).
    Detail: meander- shaped channel (center). Inlets and outlets have a funnel shape (right).
    Courtesy of: I. Fernández-Cuesta, INF Hamburg, Germany.  

    inlens_meander-channels-total_crossbeam-550

    Nanofluidic channels, master stamp

    Nanofluidic channels,  meander-shaped channels

    Nanofluidic channels, meander-shaped channels

    Nanofluidic channels,  funnel-shaped inlets and outlets

    Nanofluidic channels, funnel-shaped inlets and outlets

  • Videos

    Live imaging of FIB-milling a spiral in silicon

    Imaged with the SEM using an Inlens detector.

    A sample holder designed for ZEISS FIB-SEMs to prepare TEM-lamellae

    The patented X²-preparation method is used to prepare ultra-thin, stable TEM lamellae with a homogenous thickness of less than 10 nm without causing sample damage.

    Investigation of a lead free solder containing Cu and Ag particles in an Sn matrix

    Tomography data of SEM images were acquired at 1.8 kV
    Courtesy of: M. Cantoni, EPFL Lausanne, Switzerland.

    Elemental mapping: EDS maps were acquired at 6 kV, using Atlas 5 Analytics.Courtesy of:  M. Cantoni, EPFL Lausanne, Switzerland.

Software

FIB-SEM-Microscop

ZEISS Atlas 5 – Master Your Multi-scale Challenge

Atlas 5 makes your life easier: create comprehensive multi-scale, multi-modal images with a sample-centric correlative environment. Atlas 5 is the powerful yet intuitive hardware and software package that extends the capacity of your focused ion beam SEM.

Correlate X-ray microscopy and FIB-SEM: use the X-ray data to localize sub-surface features in 3D to target FIB sites that are not visible on the sample surface.

Profit from two modules dedicated specifically to FIB-SEM applications: Automatically create 3D data stacks with the 3D Tomography module. Solve even complex tasks in nanopatterning and –prototyping with the module for advanced nanopatterning and visualization engine (NPVE Advanced).


read more

Visualization and Analysis Software

Visualization and Analysis Software

ZEISS recommends Dragonfly Pro from Object Research Systems (ORS)

An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, SEM and helium ion microscopy.
Formerly Visual SI Advanced, Dragonfly Pro delivers high-definition visualization techniques and industry-leading graphics. Dragonfly Pro supports customization through easy to use Python scripting. Users now have total control of their 3D data post-processing environment and workflows.

more

 

Downloads

ZEISS Crossbeam Family

Your FIB-SEM for High Throughput 3D Analysis and Sample Preparation

Pages: 20
Filesize: 11,734 kB

Technology Note: ZEISS Crossbeam 550

High Throughput Imaging

Pages: 5
Filesize: 2,045 kB

Application Note: FIB-SEMs

X² STEM Lamella Preparation from Multicomposite Organic Electronic Devices with ZEISS FIB-SEMs

Pages: 6
Filesize: 883 kB

Technology Note: ZEISS Focused Ion Beam Column

Enabling Precision and long-term Stability for Cutting Edge Crossbeam Applications

Pages: 6
Filesize: 1,891 kB

Application Note: ZEISS Crossbeam Family

High Resolution STEM and EDS Study of Chromium Depletion in Stainless Steel

Pages: 5
Filesize: 1,615 kB

Technology Note: ZEISS Crossbeam

Reproducible TEM Lamella Thinning by FIB with Real-time Thickness Control and End-point Detection

Pages: 5
Filesize: 1,395 kB

We use cookies on this site. Cookies are small text files that are stored on your computer by websites. Cookies are widely used and help to optimize the pages that you view. By using this site, you agree to their use. more