ZEISS Crossbeam

Your FIB-SEM for High Throughput 3D Analysis and Sample Preparation

ZEISS Crossbeam Family

Discovering and Designing Advanced Materials With Ease

Combine imaging and analytical performance of a high resolution field emission scanning electron microscope (FE-SEM) with the processing ability of a next-generation focused ion beam (FIB). You may be working in a multi-user facility, as an academic or in an industrial lab. Take advantage of ZEISS Crossbeam’s modular platform concept and upgrade your system with growing needs, e.g. with the LaserFIB for massive material ablation. During milling, imaging or when performing 3D analytics Crossbeam will speed up your FIB applications.

Learn in this video how the TEM lamella preparation workflow of ZEISS Crossbeam enables Benedikt Müller, University of Tuebingen, and Claus Burkhardt, NMI Reutlingen, to investigate the crystal structure of NanoSQUIDS.

Extract true sample information from your high resolution SEM images using Gemini electron optics.
The Ion-sculptor FIB column introduces a new way of FIB-processing: by minimizing sample damage you’ll maximize sample quality and perform experiments faster at the same time.
When preparing TEM samples use the low voltage capabilities of the Ion-sculptor FIB: get ultra-thin samples while keeping amorphization damage at a minimum.
Within the ZEISS Crossbeam Family, either exploit variable pressure on Crossbeam 350 or use Crossbeam 550 for your most demanding characterizations.
Enhance your in situ studies with Crossbeam laser: the LaserFIB workflow enables you to gain rapid access to deeply buried structures using the femtosecond laser.

Highlights

Maximize Your SEM Insights

Take advantage of achieving up to 30% better SEM resolution at low voltage.

SEM Performance

Count on the SEM performance of your ZEISS Crossbeam for 2D surface sensitive images or when performing 3D tomography
Benefit from high resolution, contrast and signal-to-noise ratios, even when using very low accelerating voltages
Characterize your sample comprehensively with a range of detectors. Get pure materials contrast with the unique Inlens EsB detector
Investigate non-conductive specimens undisturbed by charging artifacts.

Focused Ion Beam Column of ZEISS Crossbeam

Increase Your FIB Sample Throughput

Profit from up to 40% faster material removal by the introduction of intelligent FIB milling strategies.

Ion-sculptor FIB

Use the gallium FIB column Ion-sculptor for a new way of FIB-processing
Get high quality samples, minimize FIB-induced damage and perform experiments faster at the same time
Manipulate your samples precisely and fast by using up to 100 nA current without compromising FIB resolution
Profit from speed and precision of intelligent FIB scanning strategies for material removal and perform your experiments up to 40% faster than before

EDS Analytics in 3D with ZEISS Crossbeam

Experience Best 3D Resolution in Your FIB-SEM Analysis

Enjoy the benefits of integrated 3D analysis for EDS and EBSD investigations.

Expand your Crossbeam

Expand the capacity of your Crossbeam with ZEISS Atlas 5, the market-leading package for fast, precise tomography
Perform EDS and EBSD analysis during tomography runs with the integrated 3D Analytics module of ZEISS Atlas 5
Profit from best 3D resolution and leading isotropic voxel size in FIB-SEM tomography. Probe less than 3 nm in depth and produce surface sensitive, material contrast images using the Inlens EsB detector
Save time by collecting your serial section images while milling. Take advantage of trackable voxel sizes and automated routines for active control of image quality

Array of micropillars, produced with the LaserFIB, field of view 2.1 mm.

Workflows

ZEISS Crossbeam Laser Workflow

How the LaserFIB Workflow Enhances Your in situ Studies

For in situ studies you need to localize ROIs in 3D, ablate material via a targeted preparation and perform 3D imaging and analytics. Add a femtosecond laser to your ZEISS Crossbeam and benefit from ultra-fast sample preparation.

Gain rapid access to deeply buried structures
Prepare extremely large cross-sections up to millimeters in width and depth
Benefit from minimal damage and heat affected zones due to ultrashort laser pulses
Perform laser work in a dedicated chamber to avoid contamination of your FIB-SEM
Find your hidden ROIs by correlation with previously acquired X-ray microscopy datasets

The Workflow for TEM Lamella Preparation

Just do it with high quality at high throughput

1. Automated navigation to the specimen’s region of interest (ROI)

Begin the workflow without time-consuming search for the ROI
Use the navigation camera on the airlock to locate specimens
The integrated user interface makes it easy to navigate to your ROI
Benefit from the large, distortion-free field of view in the SEM

Lamella of a copper sample ready for lift out

2. Automated Sample Preparation (ASP) to prepare a lamella out of the bulk

Start the preparation with a simple three-step process: ASP
Define the recipe including drift correction, deposition and coarse and fine milling
The ion optics of the FIB column enables high throughput for the workflow
Duplicate the recipe and repeat as often as required in order to start a batch preparation

Part of the TEM lamella preparation workflow in a ZEISS Crossbeam

3. Lift out

Bring in the micromanipulator and attach the lamella to its tip
Cut out the lamella from the bulk
The lamella is then ready for lift out and can be transferred to a TEM grid

TEM lamella of a silicon sample after final thinning

4. Thinning: the final step is crucial, as it defines the quality of your TEM lamella

The instrument’s design allows you to reach a desired thickness of the lamella by enabling live monitoring of the thinning
Use two detector signals in parallel to judge lamella thickness and obtain reproducible end thickness on the one hand (with the SE detector) and to control surface quality on the other hand (with the Inlens SE detector)
Prepare high quality samples with negligible amorphization

360° View of Crossbeam 550

The Technology Behind ZEISS Crossbeam

SEM Electron Optics

Choose between Two Columns

The FE-SEM column of ZEISS Crossbeams is based on Gemini electron optics as all ZEISS FE-SEMs. Decide on the Gemini VP column of Crossbeam 350 or the Gemini II column of Crossbeam 550.

Field emission SEMs are designed for high resolution imaging. Key to the performance of a field emission SEM is its electron optical column. Gemini technology comes with all ZEISS FE-SEMs and FIB-SEMs: it is tailored for excellent resolution on any sample, especially at low accelerating voltages, for complete and efficient detection, and ease-of-use.

Gemini Optics is Characterized by Three Main Components

The Gemini objective lens design combines electrostatic and magnetic fields to maximize optical performance while reducing field influences at the sample to a minimum. This enables excellent imaging, even on challenging samples such as magnetic materials.
Gemini beam booster technology, an integrated beam deceleration, guarantees small probe sizes and high signal-to-noise ratios.
The Gemini Inlens detection concept ensures efficient signal detection by detecting secondary (SE) and backscattered (BSE) electrons in parallel minimizing time-to-image.

Benefits for Your FIB-SEM Applications

Long-term stability of the SEM alignment and the effortless way it adjusts all system parameters such as probe current and acceleration voltage
Achieve distortion-free, high resolution imaging even over large fields of view with the help of the near magnetic-field free optics
Tilt the specimen without influencing the electron optical performance

ZEISS Crossbeam with Gemini I SEM Column

ZEISS Crossbeam 350: Gemini colum with single condenser, two Inlens detectors and VP capability.

ZEISS Crossbeam with Gemini II SEM Column

ZEISS Crossbeam 550: Gemini II column with double condenser and two Inlens detectors.

Crossbeam 350 with Gemini I VP

Maximum sample flexibility in multi-purpose environments
In situ experiments with outgassing or charging samples
Unique Gemini material contrast with the Inlens EsB detector

Crossbeam 550 with Gemini II

High resolution even at low voltage and high current thanks to the double condenser system
More information in less time with high resolution imaging and fast analytics
Unique topographical and material contrast with simultaneous Inlens SE and EsB imaging

Gemini Novel Optics

Profit from Surface Sensitive Imaging

High resolution imaging at low landing energy is required for beam as a standard. It is essential for:

beam sensitive samples
non-conductive materials
gaining true sample surface information without undesirable background signal from deeper sample layers

The novel Gemini optics are optimized for resolutions at low and very low voltages and for contrast enhancement.
Technological characteristics are the high gun resolution mode and the optional Tandem decel.

The high gun resolution mode results in minimized chromatic aberration thanks to of a reduction of primary energy width by 30%.

ZEISS Crossbeam 550 Objective with Tandem decel

Tandem decel optional sample biasing up to 5 kV further improves the excellent imaging capabilities at low voltages.

Tandem decel, now introduced to ZEISS Crossbeam 350/550, can be used in two different modes:

Tandem decel, a two-step deceleration mode, combines the beam booster technology with a high negative bias voltage that is applied to the sample: the electrons of the primary electron beam are decelerated, thus the landing energy is effectively reduced
Apply a variable negative bias voltage between 50 V and 100 V. One application mode enhances the contrast of your images
Apply a negative bias voltage between 1 kV and 5 kV and improve the low kV resolution of your images

FIB-SEM Technology

Discover a new way of FIB processing

The Ion-sculptor FIB column speeds up your FIB work without compromising machining precision and lets you benefit of its low voltage performance for any sample.

ZEISS Crossbeam 550 with a Gemini II column incl. double condenser and two Inlens detectors and a FIB-column arranged at an inclination angle of 54°.

The ZEISS Crossbeam Family carries the next-generation focused ion beam column, Ion-sculptor, featuring high currents for high throughput and excellent low voltage performance for high sample quality.

Maximize sample quality by using the low voltage capabilities of the Ion-sculptor FIB column
Minimize amorphization of your specimens and get the best results after thinning
Get precise and reproducible results with maximum stability
Accelerate your FIB applications with fast probe current exchanges
Perform high throughput experiments thanks to beam currents of up to 100 nA
Achieve exceptional FIB resolution of less than 3 nm
The Crossbeam family comes with automatic FIB emission recovery for long-term experiment

ZEISS Crossbeam Family

Within ZEISS Crossbeam Family you have the choice between Crossbeam 350 or Crossbeam 550. Exploit the variable pressure capabilities of Crossbeam 350 (optional). Or use Crossbeam 550 for your most demanding characterizations and choose the chamber size, standard or large, that best suits your samples.

	ZEISS Crossbeam 350	ZEISS Crossbeam 550
SEM	Gemini I optics VP option Tandem decel option	Gemini II optics - Tandem decel option
Chamber Size and Ports	Standard with 18 configurable ports	Standard with 18 configurable ports or large with 22 configurable ports
Stage	100 mm travel range in x/y	Standard with 100 mm or large 153 mm travel range in x/y
Charge Control	Flood Gun Local Charge Compensation Variable Pressure	Flood Gun Local Charge Compensation -
Exemplified Options	Inlens SE and Inlens EsB* for simultaneous imaging SE/EsB* imaging VPSE detector	Inlens SE and Inlens EsB* for simultaneous imaging SE/EsB* imaging large airlock for 8 inch wafersconfigure three pneumatically driven accessories simultaneously on the large chamber, e.g. STEM, 4-Quadrant-Backscatter detector, and local charge compensation
Advantages	Maximum sample variety due to optional variable pressure mode, wide range of in situ experiments, sequential Inlens SE / EsB* imaging possible.	High throughput in analytics and imaging, high resolution under all conditions, simultaneous Inlens SE and Inlens EsB* imaging
		_{* SE secondary electron, EsB energy selective backscatter}

ZEISS Crossbeam 350 standard chamber

ZEISS Crossbeam 550: large chamber

Applications

Images

Alumina spheres imaged with Tandem decel on Crossbeam 550

Comparison of milling strategies on Crossbeam 550

TEM lamella in Ag-Ni-Cu multi-layer system

Batch of 35 TEM lamellae

STEM image and EDS elemental map of Cr depletion in steel

Silicon in <110> orientation, STEM image of a FIB lamella

Nanopatterning

Overview: Nanofluidic channels, master stamp

Detail: Nanofluidic channels, meander-shaped channels

Detail: Nanofluidic channels, funnel-shaped inlets and outlets

LaserFIB

Deep laser cut in electronics sample to gain access to buried ROI in 860 µm depth.

200 µm wide cross section in a ceramic sample with 200 µm clearance on each side cut by fs-laser in less than 30 s.

Surface detail of a cross section in a metal alloy sample depicting the quality of the cut after polishing only with the laser.

Videos

Live imaging of FIB-milling a spiral in silicon. Imaged with the SEM using an Inlens detector.

3D tomogram of a solid oxide fuel cell. The SOFC’s anode is made of a heat resistant composite material: Nickel Samaria-doped Ceria.

Investigation of a lead free solder containing Cu and Ag particles in an Sn matrix

Video on 3D tomography of a lead free solder with ZEISS Crossbeam.

Video on EDS Analytics in 3D with ZEISS Crossbeam

FIB-Tomography in Life Sciences

Cell Biology – Algae. 3D reconstruction of a vitrified Emiliania huxleyi coccolithophore obtained from a cryo-FIB-SEM image series. The 3D reconstruction shows the immature coccolith (in yellowish), a coccolith in statu nascendi (blue) and lipid bodies (red). Courtesy: L. Bertinetti, Max-Planck Institute of Colloids and Interfaces, Potsdam, DE and A. Scheffel, Max-Planck Institute Plant Physiology, Potsdam, DE.

Neuroscience – Brain Sections. Large area milling and imaging of a brain section with the 3D module of ZEISS Atlas 5. High current allows fast milling and imaging of large fields of view up to 150 μm in width. The depicted brain image has a field of view of 75 μm in width and the sample was milled with a beam current of 20 nA. Courtesy: C. Genoud, FMI Basel, CH.

Accessories

Dragonfly

Visualization and Analysis Software

ZEISS recommends Dragonfly Pro from Object Research Systems (ORS)
An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, SEM and helium ion microscopy.

Formerly Visual SI Advanced, Dragonfly Pro delivers high-definition visualization techniques and industry-leading graphics. Dragonfly Pro supports customization through easy to use Python scripting. Users now have total control of their 3D data post-processing environment and workflows.

Introducing ToF-SIMS enables High Throughput in 3D Analysis

Add the ToF-SIMS (time of flight secondary ion mass spectrometry) spectrometer to your Crossbeam 350 or Crossbeam 550 and analyze trace elements, light elements (e.g. lithium), and isotopes. Profit from sensitive and comprehensive analyses in 3D. Perform elemental mapping and depth profiling. Benefit from parallel detection of atomic and molecular ions down to the ppm level, achieve resolutions better than 35 nm in lateral direction and 20 nm in depth. Retrieve any signal from the ROI post-mortem.