Name: ZEISS VersaXRM 5 Insight
Brand: ZEISS

    
          MicroCT flexibility meets X-ray microscopy detail.​
        
    Detailed, multi-scale 3D imaging for a wide range of sample types​

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Seamless multi-scale imaging in one connected workflow. The only hybrid 3D X-ray microscope built for performance, engineered for value.

ZEISS VersaXRM 5 Insight for industry

Stay in the flow from overview to insight

A person inspecting a component inside a ZEISS VersaXRM 5 Insight X-ray microscope

ZEISS VersaXRM 5 Insight is a hybrid 3D X-ray microscope that lets you stay in the flow from overview to insight. Go from the big picture to the smallest detail in one seamless workflow, revealing hidden structures and defects inside complex components – non-destructively and across multiple length scales.

Software showing ZEISS X-ray microscopy (XRM) imaging with X-ray cross-sections and a 3D reconstruction of an inspected component

Flexibility: Move from overview to detail

Hybrid XRM and CT capabilities let you start with the full sample, identify regions of interest, and seamlessly transition to targeted high-resolution imaging. Analyze small-to-large samples across multiple length scales while maintaining the context of the complete sample.

ZEN navx with Volume Scout workflow enables accurate ROI selection across the full insulin pump sample using different projection views, colored ROI overlays, and 3D visualization.

Two persons reviewing X-ray microscopy results on a ZEISS VersaXRM workstation

Non-destructive 3D X-ray analysis across multiple scales

ZEISS VersaXRM 5 combines overview imaging and detailed 3D characterization in one seamless workflow. It enables efficient, non-destructive quality analysis across multiple length scales and provides an accessible entry point into industrial X-ray microscopy.

A person positioning a printed circuit board component inside a ZEISS VersaXRM 5 Insight X-ray microscope for inspection.

See what’s hidden. Across industries.

ZEISS VersaXRM Insights 5 enables non-destructive 3D inspection of complex components and materials across multiple industries. From electronics and batteries to automotive and advanced materials, it helps identify hidden defects, analyze root causes, and optimize processes.

Productivity: consistent results, more efficiently

Guided workflows and intelligent automation help users of all experience levels reduce manual steps, minimize operator variability, and reach reliable results faster.

ZEISS ZEN navx^® guides users through parameter selection, navigation, and data acquisition. FAST Mode enables rapid overview imaging and targeted identification of relevant analysis areas, while AI-supported reconstruction with ZEISS DeepRecon Pro accelerates the processing of complex 3D datasets and helps reveal hidden structures for efficient industrial inspection and analysis.

Bring proven VersaXRM performance to routine and advanced industrial applications with high image quality, Resolution at a Distance™ (RaaD™), and workflow flexibility. Start with essential capabilities today and expand your system as your inspection needs evolve.

Value: Proven performance. Ready to evolve.

ZEISS VersaXRM combines signature image quality, flexible multi-scale XRM and microCT imaging, and intelligent ZEN navx and FAST Mode workflows for reliable and efficient results.

Flexibility

The hybrid XRM and microCT system enables seamless multi-scale imaging in one connected workflow — from large samples to high-resolution imaging and everything in between.

Engineered for value

Experience ZEISS signature image quality on the proven VersaXRM platform, combined with lower cost of ownership and increased reliability.

Productivity

Intelligent ZEN navx makes imaging easier and more efficient, while FAST mode gets you to reliable results faster.

From insight to action

Explore how advanced 3D imaging supports critical workflows across development, quality, and failure analysis — helping you make faster, more informed decisions at every stage of the product lifecycle.

Failure analysis
Locate hidden defects and understand root causes faster

3D analysis of microbump and via structures in a smartphone RF package — captured at 0.95 µm/voxel in just 10 minutes.
Quality assurance
Inspect components and assemblies comprehensively and non-destructively

3D analysis of a pacemaker, from a rapid 10-minute overview to targeted high-resolution imaging at 3.5 µm.
Materials development
Visualize microstructures and understand material properties

3D analysis of a cylindrical 21700 battery, combining a full-cell overview at 70 µm with high-resolution imaging at 3.5 µm to reveal its internal layered structure.
Research & development
Accelerate materials & device development with multi-scale imaging

3D rendering of an aluminum block with multi-scale slice overlays, demonstrating rapid ROI identification: full-field FAST scan at 34.6 μm (9 min) → medium-ROI scan (58 min) → high-resolution 3.5 μm zoom scan with 4× objective (3.5 h) for non-destructive internal analysis.