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12 October 2026
ZEISS strengthens advanced packaging portfolio with solutions for inline X-ray inspection and wafer warpage correction
Press release -
3 min read
2 September 2026
ZEISS at SEMICON Taiwan 2026
Press release -
4 min read
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![ZEISS NLX-100 system for non-destructive inspection of internal structures in modern chip packages.]({"xsmall":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.100.56.24,0,1896,1053.file/zeiss-nlx_prev.jpg","small":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.360.203.24,0,1896,1053.file/zeiss-nlx_prev.jpg","medium":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.768.432.24,0,1896,1053.file/zeiss-nlx_prev.jpg","large":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.1024.576.24,0,1896,1053.file/zeiss-nlx_prev.jpg","xlarge":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.1280.720.24,0,1896,1053.file/zeiss-nlx_prev.jpg","xxlarge":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.1440.810.24,0,1896,1053.file/zeiss-nlx_prev.jpg","max":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss-nlx_prev.jpg/_jcr_content/renditions/original.image_file.1872.1053.24,0,1896,1053.file/zeiss-nlx_prev.jpg"})
![ZEISS DUNE 100 for measuring and correcting wafer deformations in semiconductor manufacturing.]({"xsmall":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.100.56.219,74,1706,911.file/zeiss_dune_prev.jpg","small":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.360.203.219,74,1706,911.file/zeiss_dune_prev.jpg","medium":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.768.432.219,74,1706,911.file/zeiss_dune_prev.jpg","large":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.1024.576.219,74,1706,911.file/zeiss_dune_prev.jpg","xlarge":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.1280.720.219,74,1706,911.file/zeiss_dune_prev.jpg","xxlarge":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.1440.810.219,74,1706,911.file/zeiss_dune_prev.jpg","max":"https://www.zeiss.com/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/zeiss_dune_prev.jpg/_jcr_content/renditions/original.image_file.1487.836.219,74,1706,911.file/zeiss_dune_prev.jpg"})