ZEISS Xradia 510 Versa

Your 3D Submicron Imaging System with Breakthrough Flexibility

Break the one micron resolution barrier with this X-ray microscope for 3D imaging and in situ / 4D investigations.

Use the combination of resolution and contrast with flexible working distances to extend the power of non-destructive imaging in your lab.

Benefit from its architecture that uses a two-stage magnification technique to achieve submicron resolution at a distance (RaaD). Reducing dependence upon geometric magnification maintains submicron resolution even at large working distances.

Highlights

Enjoy versatility even at large working distances from the source - from millimeters to centimeters.

Perform 3D Imaging for soft or low-Z materials with advanced absorption and innovative phase contrast

Achieve world-leading resolution at flexible working distances beyond the limits of projection-based micro-CT

Resolve submicrometer-scaled features for diverse sample sizes

Extend non-destructive imaging in your lab with an in situ / 4D solution

Investigate materials in native-like environments over time
Throughput with image quality

Polymer with urethane backbone. Imaging after in situ experiments. Simulation of fluid flow demonstrates permeability.

Application Examples

ZEISS Xradia 510 Versa

Materials Research

Typical tasks and applications

Visualizing cracks in soft composite materials or measuring porosity in steel
Perform in situ studies by imaging under varying conditions such as tensile, compression, gas, oxidation, wetting and temperature variations
Image materials that are incompatible with vacuum and charged particle beams
View into deeply buried microstructures that may be unobservable with 2D surface imaging such as optical microscopy, SEM, and AFM
Maintain resolution at a distance for in situ imaging experiments, allowing you to study a wide variety of sample sizes and shapes using various in situ apparatus
Understand the impact of these varying conditions over time with the non-destructive nature of X-rays

Very soft porous polymer with urethane backbone. High contrast imaging of low Z materials in situ with varying temperatures and compression. Simulation of fluid flow demonstrates absolutely the permeability of the sample.

Application Video

Sintered Powder Steel

Non-destructive 3D imaging is crucial for additive manufacturing development. A powder stainless steel sample was laser-sintered and imaged by ZEISS Xradia 520 Versa. From the 3D dataset, the non-sintered solid phase was virtually segmented and volume quantified. XRM also provides ability to do interior tomography and look at virtual cross-sections without damage to the sample. Sample courtesy of NIST.

Life Sciences

Typical tasks and applications

Perform histologies virtually and visualize cellular and subcellular features

Expand your views in developmental biology with high resolution, high contrast images of cellular and subcellular structures

Image large intact samples such as brains or large bones

Achieve high resolution and high contrast for unstained and stained tissue

Investigate hard and soft tissues and biological microstructures

Mite on Spider in Amber

Raw Materials

Typical tasks and applications

Characterize heterogeneity at core plug scale and quantify pore structures

Measure fluid flow, analyze texture, and understand dimensional classification

Study carbon sequestration efforts

Advance mining processes: analyze tailings to maximize mining efforts; conduct thermodynamic leaching studies; perform QA/QC analysis of mining products such as iron ore pellets

Benefit from getting the most accurate 3D submicron support for digital rock simulations, in situ multiphase fluid flow studies, 3D mineralogy, and laboratory-based diffraction contrast tomography (LabDCT)

Perform multi-scale imaging, characterization and modeling of large (4" core) samples at high throughput

Shale with Pore Connectivity

Electronics

Typical tasks and applications

Optimize your process development and analyze failures by using non-destructive submicron imaging of intact packages for defect localization and characterization

Measure buried features in three dimensions or study package reliability

Benefit from high resolution and non-destructive imaging for 3D submicron imaging that complements or replaces physical cross sectioning methods

Work efficiently in a single tool workflow with high throughput macro-scanning of an intact device

Non-destructively scout-and-zoom from module to package to interconnect for submicron imaging of defect re-localization and characterization with a fast time to results that complements or replaces physical cross-sectioning

Package-on-Package Assembly

Accessories

ZEISS Advanced Reconstruction Toolbox

Better image quality, higher throughput

The Advanced Reconstruction Toolbox is an innovative platform on your ZEISS Xradia 3D X-ray microscope for accessing advanced reconstruction technologies. Unique modules leverage deep understanding of both X-ray physics and customer applications to solve some of the hardest imaging challenges in new and innovative ways.

With the Advanced Reconstruction Toolbox, you are able to:

Improve data collection and analysis for accurate and faster decision-making
Greatly enhance image quality
Achieve superior interior tomography or throughput on a broad class of samples
Reveal subtle difference through improved contrast-to-noise
Increase speed at an order of magnitude for sample classes requiring repetitive workflow

Mobile phone camera module demonstrating 4X throughput improvement with comparable image quality

These optional modules are workstation-based solutions for easy access and usability.

ZEISS OptiRecon

Similar results, 4x faster

ZEISS OptiRecon is an implementation of iterative reconstruction that greatly increases acquisition throughput, while optimizing image quality.
ZEISS OptiRecon allows you to achieve good image quality with about one quarter of the data acquisition time for many samples typically found in the academic and industrial energy, engineering, natural resources, biological, semiconductor, manufacturing, and electronics research fields.

OptiRecon 4X Throughput for Battery Research

ZEISS DeepRecon

Imaging throughput up to 10X faster for repetitive samples

ZEISS DeepRecon for ZEISS Xradia XRM is the first commercially available deep learning reconstruction technology. It enables you to increase throughput by an order of magnitude (up to 10X), without sacrificing novel XRM resolution-at-a-distance, for repetitive workflow applications. DeepRecon uniquely harvests the hidden opportunities in big data generated by your XRM and provides significant AI-driven speed or image quality improvement.

DeepRecon for Repetitive Workflows – 9X Throughput for Geo Science Exploration

Autoloader

Increase your sample handling efficiency

Autoloader option enables you to program up to 70 samples at a time to run sequentially.

Maximize your instrument's utilization with the optional Autoloader, available for all instruments in the ZEISS Xradia Versa series. Reduce the frequency of user interaction and increase productivity by queueing multiple jobs. Load up to 14 sample stations, which can support up to 70 samples, and set to run overnight, or across multiple days. Unprecedented mechanical stability enables high volume quantitative repetitive scanning of like samples.

Wide Field Mode

Flexibly image larger samples

Image large samples with Wide Field Mode such as this 6” stereo speaker.

Wide Field Mode (WFM) can be used to image across an extended lateral field of view. The wide lateral field of view can provide 3x larger 3D volume for large samples, or give a higher voxel density for a standard field of view. All Xradia Versa systems are capable of WFM with the 0.4x objective. The Xradia 620 Versa system also features WFM with the 4x objective. In combination with Vertical Stitching, WFM enables you to image larger samples at exceptional resolution.

Software

Create Efficient Workflows by Using The Simple Control System

Easily scout a region of interest and specify scanning parameters within the Scout-and-Scan Control System. Take advantage of the easy-to-use system in your central lab where users may have a variety of experience levels.

Benefit from:

Internal camera for sample viewing
Recipe control (set, save, recall)
Multiple energies
Multiple samples with Autoloader option
Micropositioning capability with a simple mouse click

Scout-and-Scan Control System

Lithium-ion Battery

Visualization and Analysis Software

ZEISS recommends Dragonfly Pro from Object Research Systems (ORS)
An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, SEM and helium ion microscopy.
Available exclusively through ZEISS, ORS Dragonfly Pro offers an intuitive, complete, and customizable toolkit for visualization and analysis of large 3D grayscale data. Dragonfly Pro allows for navigation, annotation, creation of media files, including video production, of your 3D data. Perform image processing, segmentation, and object analysis to quantify your results.

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