ZEISS Xradia 510 Versa – Your 3D Submicron Imaging System with Breakthrough Flexibility

Versatility even at large working distances - mm to inches from source

Achieve new levels of discovery with ZEISS Xradia 510 Versa 3D X-ray microscopes (XRM), the industry’s premier in situ / 4D solution. Our unique RaaD (resolution at a distance) capability breaks the one micron resolution barrier for samples from mm to cm. Use the instrument's powerful combination of world-leading resolution and contrast with flexible working distances to extend the power of non-destructive imaging in your lab.


True Submicron Spatial Resolution at Millimeters to Inches from Source

Maximize the power of X-ray microscopy (XRM) with Xradia 510 Versa for flexible 3D imaging in a wide range of research environments. Xradia 510 Versa achieves better than 0.7 μm true spatial resolution with minimum achievable voxel size below 70 nm. Experience increased versatility for soft or low Z materials with advanced absorption contrast along with innovative phase contrast to overcome the limitations of traditional computed tomography.


Achieve performance beyond micro-CT and extend scientific research past the limits of flat-panel systems. Where traditional tomography relies on a single stage of geometric magnification, Xradia Versa instruments feature a unique two-stage process based on synchrotron-caliber optics with a detection system optimized for resolution, contrast and high resolution at large working distances. With breakthrough ZEISS Resolution at a Distance (RaaD), you can accomplish unprecedented lab-based exploration for a diverse array of applications and sample types.


Non-destructive X-ray and flexible multilength scale capabilities enable you to image the same sample across a wide range of magnifications. As the industry's premier 4D / in situ solution, with Xradia Versa you can uniquely characterize the microstructure of materials in their native environments as well as to study the evolution of properties over time. The optional Versa In Situ Kit allows you to optimize set-up, makes operation easy and provides a faster time to results, organizing the facilities that support in situ rigs (such as wiring and plumbing) to enable maximum imaging performance and ease of use.

Additionally, the Scout-and-Scan control system enables an efficient workflow environment with recipe-based set-up that makes Xradia 510 Versa easy for users with a wide variety of experience levels.


Xradia Versa architecture uses a two-stage magnification technique to enable you to uniquely achieve resolution at a distance (RaaD). In the first stage, enlarge sample images through geometric magnification as with conventional micro-CT. In the second stage, a scintillator converts X-rays to visible light, which is then optically magnified. Reducing dependence upon geometric magnification enables Xradia Versa instruments to maintain submicron resolution at large working distances. This enables you to study the widest range of sample sizes effectively, including within in situ chambers. Additionally, a variety of optional features extend the benefits achieved by the system’s core architecture.


  • Preserve and extend the use of valuable samples with non-destructive 3D imaging
  • Achieve the highest resolution at the largest working distance from the source, a prerequisite for in situ and large sample imaging, with the unique Versa microscope design
  • Multi-length scale imaging of the same sample across a wide range of magnifications, <0.7 µm true spatial resolution and below 70 nm voxel size
  • Industry-leading 4D and in situ capabilities, supporting a wide variety of in situ rigs for submicron imaging of practical sized samples (mm to inches) with weight capability up to 25kg and sample size up to 300mm
  • Unique architecture with dual stage magnification enables easy navigation through multiple magnification detector system, continuous operation through automated multiple point tomography and repetitive scanning, and high speed reconstruction
  • Advanced absorption and phase contrast for low Z materials and soft tissue
  • Scout-and-Scan™ control system for easy-to-use workflow set-up ideal in multi-user environments
  • Minimal need for sample preparation
  • Optional Versa In Situ Kit organizes the facilities that support environmental chambers (such as wiring and plumbing) to enable maximum imaging performance and ease set-up 
  • Autoloader option enables you to program and run up to 14 samples at a time to maximize productivity, automate workflows for high volume scanning



ZEISS OptiRecon for the Versa X-ray microscope

Results 4X faster in 4 easy steps

ZEISS OptiRecon for the Versa X-ray microscope
ZEISS OptiRecon for the Versa X-ray microscope
Achieve the same image quality with about one quarter of the data acquisition time for many samples

ZEISS OptiRecon is an implementation of iterative reconstruction, allowing the user the optimal selection of speed or image quality, for the Versa X-ray microscope (XRM). It allows you to achieve the same image quality with about one quarter of the data acquisition time for many samples typically found in the oil and gas, mining and metals industries. Similarly, for many applications where it is currently difficult to achieve good image quality in a familiar data acquisition time, ZEISS OptiRecon can greatly improve results.

ZEISS OptiRecon features a proprietary, efficient implementation that allows you to reconstruct a standard dataset of 1024 x 1024 x 1024 voxels in about three minutes, substantially faster than typical. Normally, iterative reconstruction requires a skilled user and the expertise to fine-tune processing parameters for each dataset. ZEISS OptiRecon has a workflow-based user interface with easy to use parameter tuning that does not require specific expertise in tomographic reconstruction.

Typical new users find they are able to set-up full reconstructions of a standard dataset in fewer than 10 minutes.

Use ZEISS OptiRecon for your digital rock or mineral liberation analyses based on your priority of speed or image quality. ZEISS OptiRecon opens new opportunities for dynamic in situ experimentation at a previously inaccessible temporal resolution.  


Materials Research
Expand your materials research capabilities, whether visualizing cracks in soft composite materials or measuring porosity in steel, all with a single system. Perform in situ studies by imaging under varying conditions such as tensile, compression, gas, oxidation, wetting and temperature variations. You can also image materials that are incompatible with vacuum and charged particle beams.

Xradia 510 Versa offers the ability to view into deeply buried microstructures that may be unobservable with 2D surface imaging such as optical microscopy, SEM, and AFM. You have the ability to maintain resolution at a distance for in situ imaging experiments, allowing you to study a wide variety of sample sizes and shapes using various in situ apparatus. Understand the impact of these varying conditions over time with the non-destructive nature of X-ray.


Raw Materials
Characterize and quantify pore structure and connectivity, understand porosity and permeability, analyze mineral liberation efforts, and study carbon sequestration effectiveness. Perform in situ multiphase fluid flow studies. Experience the most accurate 3D, submicron characterization of microstructural evolution by studying the effects on materials under varying conditions and in 4D (time).


Optimize your processes and analyze failures. Use non-destructive submicron imaging of intact packages for defect localization and characterization. Measure buried features in three dimensions. Xradia Versa offer the industry’s highest resolution, non-destructive solution for 3D submicron imaging that complements or replaces physical cross sectioning methods.

Application Video

Sintered Powder Steel



Use Our Super Simple Control System to Create Efficient Workflows

All of the features on the Xradia 510 Versa are seamlessly integrated within the Scout-and-Scan Control System, an efficient workflow environment that allows you to easily scout a region of interest and specify scanning parameters. The easy-to-use system is ideal for a central lab-type setting where your users may have a wide variety of experience levels. The interface maintains the flexibility for which Xradia Versa systems are known, enabling you to set-up scans even more easily. Scout-and-Scan software also offers recipe-based repeatability, which is especially useful for your in situ and 4D research, and enables you to have greater control and efficiency for future work.


New on Version 11:

  • Automated Vertical Stitching capability sets a new industry standard for imaging tall samples at the push of a button. Combine Wide Field Mode with Vertical Stitching to join separate tomographies into a large seamless image, significantly expanding your field of view for samples that are both wider and taller.
  • New Auto Reference provides you with the ability to move in the Z+ or Z- directions as well as the existing X and Y directions, ideal for imaging high aspect ratio samples such as PC boards.
  • Adaptive Motion Compensation is a new method to compensate for sample drift that may during the course of a tomography, such as with soft samples.
  • The new Reconstructor Scout-and-Scan application pairs with the versatile Automatic Reconstructor to provide added flexibility for data reconstruction.
  • The new Enhanced Histogram capability allows you to incorporate color palette and log scaling for better data visualization .

Visualization and Analysis Software

Visualization and Analysis Software

ZEISS recommends Dragonfly Pro from Object Research Systems (ORS)

An advanced analysis and visualization software solution for your 3D data acquired by a variety of technologies including X-ray, FIB-SEM, SEM and helium ion microscopy.
Formerly Visual SI Advanced, Dragonfly Pro delivers high-definition visualization techniques and industry-leading graphics. Dragonfly Pro supports customization through easy to use Python scripting. Users now have total control of their 3D data post-processing environment and workflows.




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