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ZEISS METROTOM 800 320 kV​

ZEISS METROTOM 800
320 kV

Speed meets precision for high-density components

ZEISS METROTOM 800 320 kV is designed for high-precision inspection and metrology of dense materials like Inconel, Cobalt Chromium (CoCr), and additively manufactured metal parts or multi material assemblies. With 320 kV and advanced imaging technology, it delivers faster scans and unmatched accuracy, even for large or intricate components. The high-performance CT system opens new application fields in aerospace, automotive, and medical industries – providing the speed, flexibility, and reliability you need.​

  • High-resolution scans for complex parts with high density​
  • Fast scanning with tight metrology specifications
  • Versatile system for small and large parts​
  • All-in-one software solution ZEISS INSPECT X-Ray
ZEISS METROTOM 800 320 kV
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Advanced CT scanning for demanding applications​

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The efficient allrounder for dense parts​

ZEISS METROTOM 800 320 kV penetrates parts of dense materials and delivers reliable results with exceptional scan quality thanks to its high-kV micro focus tube. With an output power of up to 500 W and a minimum spot size of just a few microns, it strikes the perfect balance between speed and resolution, making it ideal for both detailed imaging and fast, metrologically approved scans. The software ZEISS INSPECT X-Ray ensures a smooth, intuitive workflow, from scan acquisition to final analysis.​

Multipurpose CT for small and large parts​

Multipurpose CT for small and large parts​

ZEISS METROTOM 800 320 kV offers maximum flexibility, handling everything from intricate turbine blades or medical implants to large connectors and bigger multi-material electronic parts. With its high-kV X-Ray source and adaptable scan settings, the system provides optimal penetration and accuracy for precise results across various part sizes and materials. This makes it the ideal solution for both inspection and metrology in a wide range of industrial applications.​

High-precision metrology for dense materials​

High-precision metrology for dense materials

With tight metrology specifications at high-kV, ZEISS METROTOM 800 320 kV is ideal for demanding applications such as aerospace turbine blades, medical implants, and steel components. It meets VDI/VDE 2630 1.3 standards, ensuring the highest measurement accuracy for both quality control and critical inspections on complex geometries.

Reliable long-term scanning ​

Reliable long-term scanning

The X-ray tube in our system operates at high-kV continuously, requiring no cooldown phase. This ensures maximum uptime, allowing back-to-back scans without delays. Be it long-duration inspections or handling high-throughput at-line environments, ZEISS METROTOM 800 320 kV delivers consistent performance and productivity.

Quick scans with outstanding image quality​

Quick scans with outstanding image quality​

A short source-to-detector distance enables scans up to four times faster than other ZEISS METROTOM systems to reduce scanning times even further for high-throughput applications. Additionally, ZEISS scatterControl minimizes scatter artifacts, ensuring sharp, high-contrast images even for dense materials – an ideal combination of speed and image quality for demanding industrial inspections.

ZEISS scatterControl​ ​
ZEISS METROTOM scatterControl

ZEISS scatterControl​

Exceptional CT image quality​

The hardware solution ZEISS scatterControl significantly improves the image quality by reducing scatter artifacts of CT scans to a minimum. This facilitates subsequent data handling and evaluation steps, resulting in even more accurate surface determination and defect analysis. ​

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Applications​

  • ZEISS Aerospace application

    Aerospace

    • Internal structures of small Inconel blades ​
    • Complex additively manufactured metal parts (e.g. injection nozzles)
  • ZEISS Medical application

    Medical​

    • Cobalt Chromium implants (e.g. femoral knee, tibial knee)​
    • Titanium implants (e.g. bone plates and screws)​
    • Additively manufactured & dense casted parts requiring high accuracy​
  • ZEISS New Energy Vehicle application

    New energy vehicles​

    • Battery cells housed in steel ​
    • Large connectors ​
    • Smaller modules ​
    • Battery stacks
  • ZEISS Electronics application

    Electronics​

    • Small sensors housed in steel ​
    • Bigger electronic multi material parts  ​
    • Smaller motors with magnets and copper coils​
  • ZEISS INSPECT X-Ray Comprehensive CT data analysis in 3D

    ZEISS INSPECT X-Ray​

    Comprehensive CT data analysis in 3D​

    The easy-to-use analysis software ZEISS INSPECT X-Ray allows complete CT data analysis in 3D – automated or customized and suitable even for beginners. Geometries, shrinkage holes or internal structures and assemblies can be analyzed precisely. Even small defects become visible through individual sectional images. You can also load volume data of several components into a project, perform a trend analysis, and compare the results to CAD data – in just one software.​

  • ZEISS Automated Defect Detection (ZADD)​

    ZEISS Automated Defect Detection (ZADD)​

    Artificial intelligence in computed tomography​

    The ZADD add-on in ZEISS INSPECT X-Ray detects even small and fuzzy defects reliably, quickly, and automatically. ZADD detects, localizes, and classifies these defects or anomalies while analyzing them in detail by reading CT scans. The software add-on is specially developed for applications such as castings, injection-molded parts, and printed components.​

  • ZEISS PiWeb Transform quality data into meaningful results​

    ZEISS PiWeb​

    Transform quality data into meaningful results​

    The ZEISS PiWeb reporting and quality data management software helps to connect metrology results from different measuring technologies to shop floor decisions – for efficient tracking of your production quality and immediate results. Use ZEISS PiWeb to perform GR&R studies, control quality data management, work with manual data, create powerful statistics and profit from various ready-to-use standard report templates.​

Software features for image acquisition​

Software solutions for efficient CT scans​
  • Multi Material Artifact Reduction

    Multi Material Artifact Reduction

    See more details in your parts at the transition from metal to plastic: Multi Material Artifact Correction significantly reduces artifacts that occur when scanning workpieces with different materials and thicknesses, especially in connector-like parts with metal and plastic.

  • Horizontal field-of-view extension

    Horizontal field-of-view extension

    Measure workpieces that are wider than the detector: The horizontal field of view extension increases the possible volume diameter of your captures by up to 80%. It allows scanning parts that are significantly wider than the detector or allows to scan smaller parts with smaller voxel sizes and thus higher resolutions.

  • Vertical field-of-view extension​

    Vertical field-of-view extension​

    The high-precision positioning system, which leverages our tactile measurement expertise, has increased the size of components that can be reconstructed in the system to 520 mm in height. This means that large components can be completely captured in a single automated process, eliminating the need for time-consuming repositioning and alignment by the user.

  • Semi-Circle Scan​

    Semi-Circle scan​

    Semi-Circle is a scan mode in which a part only needs to make slightly more than half a rotation instead of a full rotation. This allows you to scan specific regions in parts with higher resolution that would otherwise be geometrically limited by a full rotation.​

  • Automatic separation of multiple components

    Separation​​

    Automatic separation increases productivity by scanning multiple components at once and automatically evaluating them separately, significantly reducing scanning time and operator interaction.​

ZEISS METROTOM Family​

Technical details​

ZEISS METROTOM 800 320 kV​

X-ray tube​

320 kV micro focus, max. 500 W​

FPD​

3072 x 3072 px @ 139 μm​

Dimensions (width x length x height) in mm​

1820 x 3200 x 2100

Part weight​

Up to 50 kg​

MPE (according to VDI/VDE 2630 1.3) (VAST) in μm​

SD (TS) 4.5+L/50​
PS (TS) 3​
PF (TS) 4​
E (TS) 9+L/50

Max. reconstruction volume (d x h)​

325 mm x 250 mm​
325 mm x 520 mm (vertical FoV extension )​
500 mm x 470 mm (vertical and horizontal FoV extension)

Downloads

Contact us​

Interested in exploring our products or services further? We're excited to offer you more details or a live demo, either remotely or in person.​

ZEISS Metrology Shop

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ZEISS Academy Metrology

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Do you need more information?

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