ZEISS Crossbeam 550 FIB-SEM microscope for high-resolution imaging and advanced sample preparation.

ZEISS Crossbeam 550 FIB-SEM

High-resolution FIB-SEM for advanced sample preparation & analytics

ZEISS Crossbeam 550 combines the Gemini 2 SEM imaging with ZEISS Ion-sculptor FIB milling to deliver fast material removal and exceptional surface detail. Built for demanding imaging and analytical applications, it supports complex workflows in a reproducible and easy-to-use way across advanced applications such as 3D tomography, nanofabrication, and TEM lamella preparation.

  • Gemini 2 electron optics deliver high-throughput, high-resolution SEM imaging, while the Ion-sculptor FIB enables fast milling and low-energy finishing.

    Enables rapid material removal while preserving surface and subsurface integrity.

  • Recipe-driven lamella prep for user-independent reproducibility

    Delivers consistent, repeatable results across users and workflows.

  • Advanced FIB processing for nanofabrication and deterministic 3D tomography

    Enables structural and compositional analysis in demanding applications.

  • Excellent performance on diverse materials, including beam-sensitive samples
ZEISS Crossbeam 550 FIB-SEM microscope designed for high-resolution imaging and advanced materials analysis workflows.

What’s different with Crossbeam 550

Crossbeam 550 delivers imaging, processing, and analytics performance where precision matters most. Low-energy FIB finishing ensures cleaner cross-sections, particularly for thin films, while protecting delicate device layers. The optional integration of a femtosecond laser enables rapid material removal, allowing users to access deeply buried structures faster and more efficiently. Expanded ZEN core EM automation extends recipe-based lamella preparation across users and labs, delivering excellent sample quality, greater consistency, and higher confidence in outcomes. The result is reliable, repeatable workflows for advanced research and production environments.

Illustration of focused ion beam milling used to prepare thin TEM lamellae for analysis with the ZEISS Crossbeam 550 FIB-SEM.

Key specifications

  • Gemini 2 electron optics with FIB column for high-resolution imaging and precise milling.
  • Low-kV SEM imaging with exceptional clarity for surface-sensitive features across diverse samples.
  • Repeatability with automated recipes and batch execution ensure consistent results.
  • Broadest desired flexibility: Supports materials and life sciences samples, including metals, polymers, ceramics, biomaterials, cells, tissues, and semiconductor specimens.
SEM image of focused ion beam trenching used for TEM lamella preparation with ZEISS Crossbeam 550 FIB-SEM.

Integrated TEM lamella preparation & imaging workflows

Crossbeam 550 supports every step of lamella creation — such as chunking, thinning, lift-out, and on-grid attachment — guided by ZEN core EM workflows with live SEM monitoring. Low-energy FIB finishing enables controlled refinement, accurate endpointing, and reduced ion damage, ensuring high-quality lamellae for advanced applications.

ZEISS microscopy software interface supporting automated FIB-SEM workflows and data analysis.

Integrated software for efficient, repeatable Crossbeam 550 workflows

ZEISS software solutions streamline Crossbeam 550 workflows from acquisition to analysis. ZEN core EM enables automated recipes, batch execution, and integrated SEM/FIB operation for efficient, repeatable results. For advanced imaging analysis, the ZEISS arivis suite extends capabilities within scalable, AI-driven image analysis. arivis Pro enables flexible multi-dimensional visualization and segmentation pipelines; arivis Hub accelerates and batches high-volume processing; and arivis Cloud provides cloud-based AI model training to automate and scale advanced analysis without coding. Together, these tools enhance nanofabrication, large-area imaging, and correlative workflows with reproducible, top-quality results.

Related applications

SEM micrograph of nanofluidic channels fabricated by focused ion beam milling for micro- and nanofluidics research.

Materials Research

  • Low-kV imaging for 2D and 3D material characterization, revealing fine surface details
  • High-accuracy cross-sections of any sample, e.g., multiphase materials and complex structures
  • 3D nanofabrication
SEM image of thermal interface material after laser milling with ZEISS Crossbeam LaserFIB, showing the surface without ion beam polishing.

Electronics & Semiconductors

  • Correlative workflows and repeatable lamella preparation for advanced packaging
  • Reveal buried nodes and interfaces without over-thinning
  • Analyze contacts, interconnects, and failure sites with precision
3D FIB-SEM reconstruction of the nematode C. elegans showing internal anatomy at nanometer resolution.

Life Sciences & Biological Research

  • Capture fine ultrastructural detail with Gemini 2 low-kV clarity
  • Mill delicate biological material using Ion-sculptor low-energy thinning
  • Achieve high-resolution 3D reconstructions of tissues, organelles, and biomaterials
  • Use recipe-driven workflows for consistent lamella creation across users

Customer testimonial

This work is the first to use 3D cryoEM and EDS in a quantitative way to show the distribution and dynamics of intracellular ion pools. This was enabled due to the combination of the new cryoFIB-SEM model of the Crossbeam FIB-SEM with EDS. Only with the ability to simultaneously generate 3D structural data of the cryo preserved samples and the EDS analysis were we able to get these results.

Dr. Asaf GalWeizmann Institute of Science, Israel

Services & support

Expertise for higher-throughput, more demanding workflows

With Crossbeam 550, ZEISS provides hands-on service and application support designed for higher-throughput, more complex workflows. From system optimization and workflow tuning to preventative maintenance and rapid response service, ZEISS helps labs stay productive and consistent. Training and consulting services ensure teams can fully leverage advanced FIB-SEM tomography capabilities over time.

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FAQ

  • ZEISS Crossbeam 550 is commonly selected by advanced research labs and facilities that run frequent analytical workflows and need higher throughput and repeatability than an entry-level system provides.

  • Crossbeam 550 with Gemini 2 electron optics is designed for more demanding analytical workflows, offering higher throughput, improved imaging stability, and better suitability for large datasets, 3D tomography, and advanced SEM analytics.

  • The Gemini 2 optics with a double-condenser design enable efficient signal generation and stable imaging conditions, supporting faster acquisition for SEM analytics, large-area imaging, and FIB-SEM tomography.

  • Yes. Crossbeam 550 allows live, synchronized imaging during milling, enabling users to monitor structures as material is removed and improve endpoint control without interrupting the workflow, but the high dynamic range (HDR) Mill + SEM is optional.

  • Crossbeam 550 supports all steps of lamella creation — chunking, thinning, lift-out, and on-grid attachment, guided by ZEN core EM workflows, it delivers live SEM monitoring and low-energy FIB finishing for accurate endpointing and reduced ion damage.

  • Yes, Crossbeam 550 can handle beam-sensitive materials like thin films, polymers, and biological specimens. Low-kV imaging and low-energy FIB milling minimize damage and preserve fine structural details.

  • Crossbeam 550 is ideal for advanced workflows with high demand of analytics combined with daily flexibility in materials science, electronics, semiconductors such as advanced packaging, and life sciences. Applications include TEM lamella preparation, 3D tomography, nanofabrication, and structural analysis of delicate samples.

  • ZEISS software integrates acquisition, control, and analysis for efficient workflows. ZEN core EM enables automated recipes, batch processing, and synchronized SEM/FIB operation, while ZEISS arivis supports scalable image analysis for large datasets, ensuring consistent, high-quality results.

  • The femtosecond laser is an optional feature for ZEISS Crossbeam systems that enables rapid material removal through ultrafast laser ablation. It is particularly useful when rapid access to large, deeply buried areas is required. The ZEISS Crossbeam laser provides with very high milling rates in the order of 10^6 µm³/s for rapid and precise ablation, significantly reducing preparation time compared to traditional FIB milling. The laser preserves fine structural details by minimizing thermal and mechanical damage, ensuring high-quality surfaces for subsequent SEM imaging and analysis.

  • The femtosecond laser is ideal for workflows requiring fast access to buried features, such as advanced semiconductor analysis or materials research involving large, complex samples. It is especially beneficial for applications where traditional FIB milling would be too slow or inefficient.

  • While FIB milling offers precise control for small-scale material removal, the femtosecond laser excels at high-speed ablation of larger volumes. The laser complements FIB workflows by enabling faster initial material removal, followed by fine milling and finishing with the Ion-sculptor FIB column.

  • No. The femtosecond laser minimizes thermal and mechanical damage by using ultrafast pulses that vaporize material without introducing heat-affected zones (a-thermal ablation). This ensures that delicate features and interfaces remain intact for high-quality imaging and analysis.

  • The femtosecond laser is compatible with a wide range of materials, including metals, ceramics, polymers, and semiconductor samples. However, its suitability depends on the specific application and sample composition. ZEISS experts can help determine the best configuration and parameters for your workflows.

  • The femtosecond laser seamlessly integrates with Crossbeam 550 workflows, working alongside the Gemini 2 optics and Ion-sculptor FIB column. It accelerates material removal during the initial stages of preparation in a separate chamber with automated sample transfer, while recipe-driven automation ensures consistent results across samples and operators.