ZEISS Crossbeam 750 FIB-SEM

ZEISS Crossbeam 750 introduces a new Gemini 4 field-free objective lens that enhances imaging performance and stability during milling. This enables precise control for demanding workflows such as sub-20 nm TEM lamella preparation, deterministic 3D tomography, and advanced semiconductor analysis. Using high dynamic range (HDR) Mill + SEM, it delivers live, high-resolution imaging during milling, making it ideal for workflows requiring endpoint precision and protection of critical device structures.

The integration of the Gemini 4 objective lens with HDR Mill + SEM technology provides continuous, high-resolution SEM imaging during milling. This allows users to monitor buried features and delicate interfaces in real time, adjust milling planes without stopping, and confidently control endpoints for sub-20 nm lamella preparation.

Continuous imaging is critical for precise alignment and real-time adjustments during lamella preparation. It reduces the need for rework, improves yield, and ensures consistent results for ultra-thin lamellae, especially in complex device architectures like transistor stacks, vias, and gate structures.

Crossbeam 750 utilizes the Ion-sculptor FIB column down to 500 V FIB energy finishing, reducing amorphization and preserving fine structural details. This ensures reliable preparation of delicate samples, including beam-sensitive materials like thin films, polymers, and advanced semiconductor layers.

Yes, Crossbeam 750 is optimized for beam-sensitive materials. The combination of low-kV SEM imaging and low-energy FIB milling minimizes damage and preserves nanoscale features, making it suitable for delicate samples such as thin films, biological tissues, and semiconductor interfaces.

Crossbeam 750 delivers precise endpoint control and sub-20 nm lamella preparation, enabling advanced node TEM analysis and failure diagnostics. Low-kV polishing protects sensitive device layers and interfaces while providing metrology-grade surfaces for accurate characterization of transistor stacks, vias, and interconnects.

Crossbeam 750 enables clean cross-sectioning, precise thinning, and low-damage finishing for high-resolution TEM imaging of complex micro- and nanometer-scale structures. It is ideal for materials such as metals, ceramics, and polymers, preserving nanoscale features for reliable 3D characterization and analysis.

Yes. Crossbeam 750 supports SEM-guided milling for biological samples, enabling targeted preparation of membranes, tissues, and biomaterial interfaces. Low-energy thinning performed under cryogenic conditions minimizes damage and preserves lamella quality, allowing researchers to capture true ultrastructure with low-kV imaging.

ZEISS ZEN core EM software tightly integrates acquisition, control, and analysis for Crossbeam 750 workflows. ZEN core supports recipe-based automation, batch processing, and synchronized SEM/FIB operations, ensuring consistent results across users and samples. Additionally, the ZEISS arivis ecosystem enables scalable, AI-driven analysis of large datasets, supporting efficient interpretation, documentation, and downstream workflows.