Quality Assurance for Printed Circuit Boards

Challenges​

• Monitor surface roughness of copper foil to ensure it provides the necessary low transmission loss and high binding force​
• Analyze surface morphology of copper foil and resin, which affects the binding force between them​

Your benefits with ZEISS​

• Scanning electron microscope ZEISS EVO for surface morphology analysis of copper and resin plates​
• Confocal microscope ZEISS LSM 900 for rapid analysis of surface roughness

Challenges​

• During PCB pattern manufacturing, dry film adhesion affects precision of line etching​
• Rapid 3D size measurement of conductor and connecting hole is needed to reduce sample preparation requirements and improve detection efficiency​
• Surface finish process affects subsequent weldability, rapid measurement of element content, and process quality control​

Your benefits with ZEISS​

• High-resolution metallographic section analysis using optical microscope ZEISS Axioscope​
• Rapid check of line width and spacing with digital microscope ZEISS Smartzoom 5​
• Confocal microscope ZEISS LSM 900 for determining size of blind hole and through hole, plus roughness​ detection​
• Swift examination and analysis of dry film adhesion, desmear, and nickel corrosion with scanning electron microscope ZEISS EVO
  

Challenges​

• Daily high production requires quick dimensional measurement and surface defect inspection of the welded foot
• The quality of the solder joint will affect the integrity of the circuit, so it is necessary to find out the relevant reasons to improve the welding process
  

Your benefits with ZEISS​

• Digital microscope ZEISS Smartzoom 5 welding quality for quick inspection Optical imaging instrument ZEISS O-DETECT, welding size detection
• Scanning electron microscopy ZEISS EVO rapid detection of IMC-layer thickness high resolution X-ray microscope ZEISS Xradia Versa