Smartphone housing with integrated micro sensor and x-ray view of internal component defects

ZEISS ELECTRONICS INDUSTRY SOLUTIONS

Quality Assurance for Structural Components

Name: Quality assurance for structural components
Brand: ZEISS

Precision-machined smartphone back housing with internal mounts and triple camera cutouts

Quality at every stage of production

ZEISS solutions for structural components

Structural components used in the electronics industry, such as the housing of a smartphone or laptop, form the frame of the entire device. Not only do they bring together almost all of the small parts featured in these products, they can even serve as antennas for communication.

Given how crucial structural components are to the correct functioning of modern electronics, it is essential for them to undergo detailed quality assurance using the dedicated ZEISS portfolio. Proper detection of faults at an early stage is key to reducing rejects and waste while safeguarding the high quality of the overall device.

ZEISS Electronics solutions at every manufacturing step

Blue Line for structural component development and production

Quality control workflow by a blue process line

Quality gate 1
Research and development

Challenges

GD&T and internal dimension measurement for assembly process control
Quick deformation inspection in order to adjust production process and shorten development cycle
Cosmetic and coating thickness inspection to improve product performance

Your benefits with ZEISS

Reliably detecting flaws by capturing and measuring defects beneath the surface by Industrial computed tomography ZEISS METROTOM

ZEISS Industrial Microscopy Solutions

ZEISS Microscopy Software
Quality gate 2
Mass production (offline)

Challenges

Highly efficient dimension measurement for process control to ensure stability of production line
Perform sample inspection before shipment so that products meet customer design requirements

Your benefits with ZEISS

Wide range of optical and tactile scanning sensors for measuring parts with varying geometries and surfaces with Coordinate Measurement Machine ZEISS SPECTRUM

ZEISS CMMs

ZEISS CALYPSO Software
Quality gate 3
Mass production (atline/inline)

Challenges

Full inspection for key dimensions, keep tracking the quality status of the entire production line, avoid waste to achieve the cost down and efficiency improvement

Your benefits with ZEISS

Wide range of optical and tactile scanning sensors for measuring parts with varying geometries and surfaces with Coordinate Measurement Machine ZEISS SPECTRUM

ZEISS Industrial CT and X-Ray Solutions

ZEISS INSPECT Software
Quality gate 4
Failure analysis

Challenges

Identify location of failure to improve manufacturing process
Perform qualitative and quantitative analysis of failure in order to boost product quality

Your benefits with ZEISS

3D X-Ray imaging at submicron resolution with ZEISS Versa X-Ray Microscopes

ZEISS Industrial Microscopy Solutions

ZEISS Microscopy Software

Quality assurance for smartphone

During the technological iteration cycle, the core application support has reached a critical point of technological maturity: The continuous iteration of the two core technologies, namely the hinge and the vapor chamber, combined with a strict quality inspection system, enhances the competitiveness of the electronics product.

Vapor chamber

To resolve the conflict between the high heat dissipation demands of technological innovations and the requirement for slim, lightweight designs, Vapor Chamber (VC) has emerged as the mainstream heat dissipation solution for high-end mobile devices .The flatness and dimension measurement become a critical component of quality inspection.

Hinge

The more precise crease control, the thinner and lighter body design, and the more stable and durable performance of the folding screen phone. This is related to the breakthrough in hinge technology: This drives a new round of upgrade in the precision of hinge parts and the strength of materials.
The quality and inspection requirement are: Hinge reverse engineering, Dimensional reconstruction of nested mechanical structures, Fast iterative design verification, Non-destructive analysis of assembly defects, The ability to capture minute features, Retention of sample integrity.