Quality Assurance for Data Centers

The Micro-Channel Liquid Cooling Plate (MLCP) technology, through its micron-scale channel design and advanced integration, has significantly enhanced heat dissipation capacity. ​

The CT system ZEISS METROTOM features a large measurement range and high penetrability. It enables high-resolution, non-destructive analysis of liquid-cooled plates, accurately identifies defect locations, and performs virtual slicing.

Quick Disconnects (UQDs) are key interfaces for connecting cold plates, server trays, and manifolds. These connectors must ensure non-spillage, high reliability, and support simple, rapid plug-in and pull-out operations. 

The ZEISS METROTOM, with its high power and high penetrability, enables efficient, non-destructive analysis of Quick Disconnect fittings made for composite materials.

In the liquid cooling system of a data center, the liquid cooling manifold acts as the "distribution hub" for the coolant. It precisely distributes coolant to each liquid cold plate and server rack, while also collecting the returned coolant and directing it to the heat exchanger.​​

ZEISS CMM: Perform micron-level precision measurements of geometric dimensions of liquid cooling manifolds (e.g., interface flatness, hole diameter, hole spacing) and get real-time feedback on processing errors.​​

ZEISS ScanBox: Rapidly scan the manifold’s overall shape and complex flow channel structure, get a 3D model to compare it with the design drawing, and intuitively identify issues like deformation and dimensional deviation​s. 

High-speed transmission is advancing towards 224G-448G, driving an urgent need for high-speed connectors. Currently, the 224G high-speed backplane connector is one of the most sought-after products that connector manufacturers are striving to develop and compete over. A key measurement challenge is the precise control of pin dimensions to ensure the reliability and stability of the connector.​​

The ZEISS METROTOM delivers a clear, smooth surface without noise, featuring a large field of view (FOV) and high resolution. Additionally, its advanced AMMAR and BHC technologies enable artifact-free imaging of multiple material components with exceptional clarity. 

The AI server revolution requires ultra-high PCB quality, making high-resolution, non-destructive inspection essential for identifying microscopic internal flaws, such as poor back-drilling or layer misalignment, which can impact signal integrity in boards with more than 20 layers. ​

The X-ray microscope ZEISS VersaXRM leverages unique magnification technology to non-destructively measure back-drill stubs and detect hidden inner-layer defects. 

Capacitors must provide high capacitance density with ultra-low ESR in compact footprints to stabilize GPU power delivery.

The ZEISS Sigma SEM offers exceptional imaging performance, enabling clear observation of structural features in MLCC cross-sections and ceramic crystal interfaces. Additionally, for magnetic bead samples, it directly resolves thin-film layer structures without requiring special preparation.

The power density per rack is a critical factor in data center design, capacity planning, cooling and power provisioning. Factors such as cooling, weight, and other considerations become key elements for high-density design.​​

The measurement challenges include standard or customized rack requirements, making rapid and accurate measurement of rack size an urgent need for quality control.​​

The ZEISS solution, the Coordinate Measuring Machine (CMM), can assist with both tactile and optical measurements, and its auto-focus system permits measurements that are perpendicular to the camera plane.