![]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/solution-lab-wallpaper-1.jpg/_jcr_content/renditions/original.image_file.100.33.file/solution-lab-wallpaper-1.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/solution-lab-wallpaper-1.jpg/_jcr_content/renditions/original.image_file.360.120.file/solution-lab-wallpaper-1.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/solution-lab-wallpaper-1.jpg/_jcr_content/renditions/original.image_file.768.256.file/solution-lab-wallpaper-1.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/solution-lab-wallpaper-1.jpg/_jcr_content/renditions/original.image_file.1024.341.file/solution-lab-wallpaper-1.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/solution-lab-wallpaper-1.jpg/_jcr_content/renditions/original.image_file.1280.427.file/solution-lab-wallpaper-1.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/solution-lab-wallpaper-1.jpg/_jcr_content/renditions/original.image_file.1440.480.file/solution-lab-wallpaper-1.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/solution-lab-wallpaper-1.jpg/_jcr_content/renditions/original./solution-lab-wallpaper-1.jpg"})
软件
蔡司Solutions Lab
快速开发应用程序
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用于X射线显微镜的蔡司相位衬度增强器
来自金属零件生产Solutions Lab
通过明确对伪影进行建模，然后在整个体积中以3D形式对其进行去卷积，消除相位伪影。
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蔡司增材制造粉末分析系统
来自金属零件生产Solutions Lab
单击即可获取从原始数据到完整分析结果的全部3D体积。
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用于X射线重构的蔡司DeepRecon
来自处理效率提高10倍的Solutions Lab
用于重复性工作流的蔡司Xradia X射线显微镜。
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蔡司球面研磨工作流
来自涂层、膜和表面Solutions Lab
确定膜和表面的耐磨性。
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用于薄层测量的蔡司全干涉相衬（TIC）
来自涂层、薄膜和粗糙度Solutions Lab
使用光学显微镜进行非接触式高度测量。
![用于X射线显微镜的蔡司相位衬度增强器]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ppcf_rawdata.jpg/_jcr_content/renditions/original.image_file.100.56.0,139,662,511.file/ppcf_rawdata.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ppcf_rawdata.jpg/_jcr_content/renditions/original.image_file.360.203.0,139,662,511.file/ppcf_rawdata.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ppcf_rawdata.jpg/_jcr_content/renditions/original.image_file.662.372.0,139,662,511.file/ppcf_rawdata.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ppcf_rawdata.jpg/_jcr_content/renditions/original.image_file.662.372.0,139,662,511.file/ppcf_rawdata.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ppcf_rawdata.jpg/_jcr_content/renditions/original.image_file.662.372.0,139,662,511.file/ppcf_rawdata.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ppcf_rawdata.jpg/_jcr_content/renditions/original.image_file.662.372.0,139,662,511.file/ppcf_rawdata.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ppcf_rawdata.jpg/_jcr_content/renditions/original.image_file.662.372.0,139,662,511.file/ppcf_rawdata.jpg"} "用于X射线显微镜的蔡司相位衬度增强器")
![蔡司增材制造粉末分析系统]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ampa_1.jpg/_jcr_content/renditions/original.image_file.100.56.36,0,1885,1040.file/ampa_1.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ampa_1.jpg/_jcr_content/renditions/original.image_file.360.203.36,0,1885,1040.file/ampa_1.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ampa_1.jpg/_jcr_content/renditions/original.image_file.768.432.36,0,1885,1040.file/ampa_1.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ampa_1.jpg/_jcr_content/renditions/original.image_file.1024.576.36,0,1885,1040.file/ampa_1.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ampa_1.jpg/_jcr_content/renditions/original.image_file.1280.720.36,0,1885,1040.file/ampa_1.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ampa_1.jpg/_jcr_content/renditions/original.image_file.1440.810.36,0,1885,1040.file/ampa_1.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/ampa_1.jpg/_jcr_content/renditions/original.image_file.1849.1040.36,0,1885,1040.file/ampa_1.jpg"} "蔡司增材制造粉末分析系统")
![用于X射线重构的蔡司DeepRecon]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/deep-recon_fdk-v-deeplearning.png/_jcr_content/renditions/original.image_file.100.56.162,0,1223,597.file/deep-recon_fdk-v-deeplearning.png","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/deep-recon_fdk-v-deeplearning.png/_jcr_content/renditions/original.image_file.360.203.162,0,1223,597.file/deep-recon_fdk-v-deeplearning.png","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/deep-recon_fdk-v-deeplearning.png/_jcr_content/renditions/original.image_file.768.432.162,0,1223,597.file/deep-recon_fdk-v-deeplearning.png","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/deep-recon_fdk-v-deeplearning.png/_jcr_content/renditions/original.image_file.1024.576.162,0,1223,597.file/deep-recon_fdk-v-deeplearning.png","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/deep-recon_fdk-v-deeplearning.png/_jcr_content/renditions/original.image_file.1061.597.162,0,1223,597.file/deep-recon_fdk-v-deeplearning.png","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/deep-recon_fdk-v-deeplearning.png/_jcr_content/renditions/original.image_file.1061.597.162,0,1223,597.file/deep-recon_fdk-v-deeplearning.png","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/deep-recon_fdk-v-deeplearning.png/_jcr_content/renditions/original.image_file.1061.597.162,0,1223,597.file/deep-recon_fdk-v-deeplearning.png"} "用于X射线重构的蔡司DeepRecon")
![蔡司球面研磨工作流]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/calotte_grinding.png/_jcr_content/renditions/original.image_file.100.56.32,0,1396,767.file/calotte_grinding.png","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/calotte_grinding.png/_jcr_content/renditions/original.image_file.360.203.32,0,1396,767.file/calotte_grinding.png","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/calotte_grinding.png/_jcr_content/renditions/original.image_file.768.432.32,0,1396,767.file/calotte_grinding.png","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/calotte_grinding.png/_jcr_content/renditions/original.image_file.1024.576.32,0,1396,767.file/calotte_grinding.png","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/calotte_grinding.png/_jcr_content/renditions/original.image_file.1280.720.32,0,1396,767.file/calotte_grinding.png","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/calotte_grinding.png/_jcr_content/renditions/original.image_file.1364.767.32,0,1396,767.file/calotte_grinding.png","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/calotte_grinding.png/_jcr_content/renditions/original.image_file.1364.767.32,0,1396,767.file/calotte_grinding.png"} "蔡司球面研磨工作流")
![用于薄层测量的蔡司全干涉相衬（TIC）]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/tic-crosssection.jpg/_jcr_content/renditions/original.image_file.100.56.0,3,2456,1385.file/tic-crosssection.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/tic-crosssection.jpg/_jcr_content/renditions/original.image_file.360.203.0,3,2456,1385.file/tic-crosssection.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/tic-crosssection.jpg/_jcr_content/renditions/original.image_file.768.432.0,3,2456,1385.file/tic-crosssection.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/tic-crosssection.jpg/_jcr_content/renditions/original.image_file.1024.576.0,3,2456,1385.file/tic-crosssection.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/tic-crosssection.jpg/_jcr_content/renditions/original.image_file.1280.720.0,3,2456,1385.file/tic-crosssection.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/tic-crosssection.jpg/_jcr_content/renditions/original.image_file.1440.810.0,3,2456,1385.file/tic-crosssection.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/tic-crosssection.jpg/_jcr_content/renditions/original.image_file.1920.1080.0,3,2456,1385.file/tic-crosssection.jpg"} "用于薄层测量的蔡司全干涉相衬（TIC）")
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用于X射线显微镜的蔡司相位衬度增强器
来自金属零件生产Solutions Lab
通过明确对伪影进行建模，然后在整个体积中以3D形式对其进行去卷积，消除相位伪影。
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蔡司增材制造粉末分析系统
来自金属零件生产Solutions Lab
单击即可获取从原始数据到完整分析结果的全部3D体积。
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蔡司球面研磨工作流
来自涂层、膜和表面Solutions Lab
确定膜和表面的耐磨性。
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用于薄层测量的蔡司全干涉相衬（TIC）
来自涂层、薄膜和粗糙度Solutions Lab
使用光学显微镜进行非接触式高度测量。
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蔡司枝晶臂间距工作流
来自使用光学显微镜测量枝晶臂的Solutions Lab
通过图像处理和手动微调实现联合自动化。
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蔡司点数工作流
来自光学显微镜Solutions Lab
确定样品中特定成分或感兴趣物相的估计体积率。
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蔡司显微硬度工作流
来自金属Solutions Lab
显微硬度工作流可进行冶金测试，以确定金属硬度。
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蔡司球面研磨工作流
来自涂层、膜和表面Solutions Lab
确定膜和表面的耐磨性。
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蔡司伪3D显微图工作流
来自根据2D图像创建3D结构图的Solutions Lab
来自根据2D图像创建3D结构图的Solutions Lab
![蔡司枝晶臂间距工作流]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/dendrites-in-failed-autogenous-alloy.jpg/_jcr_content/renditions/original.image_file.100.56.0,130,1388,911.file/dendrites-in-failed-autogenous-alloy.jpg","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/dendrites-in-failed-autogenous-alloy.jpg/_jcr_content/renditions/original.image_file.360.203.0,130,1388,911.file/dendrites-in-failed-autogenous-alloy.jpg","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/dendrites-in-failed-autogenous-alloy.jpg/_jcr_content/renditions/original.image_file.768.432.0,130,1388,911.file/dendrites-in-failed-autogenous-alloy.jpg","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/dendrites-in-failed-autogenous-alloy.jpg/_jcr_content/renditions/original.image_file.1024.576.0,130,1388,911.file/dendrites-in-failed-autogenous-alloy.jpg","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/dendrites-in-failed-autogenous-alloy.jpg/_jcr_content/renditions/original.image_file.1280.720.0,130,1388,911.file/dendrites-in-failed-autogenous-alloy.jpg","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/dendrites-in-failed-autogenous-alloy.jpg/_jcr_content/renditions/original.image_file.1388.781.0,130,1388,911.file/dendrites-in-failed-autogenous-alloy.jpg","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/dendrites-in-failed-autogenous-alloy.jpg/_jcr_content/renditions/original.image_file.1388.781.0,130,1388,911.file/dendrites-in-failed-autogenous-alloy.jpg"} "蔡司枝晶臂间距工作流")
![蔡司点数工作流]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/point-counting.png/_jcr_content/renditions/original.image_file.100.56.30,0,1402,772.file/point-counting.png","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/point-counting.png/_jcr_content/renditions/original.image_file.360.203.30,0,1402,772.file/point-counting.png","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/point-counting.png/_jcr_content/renditions/original.image_file.768.432.30,0,1402,772.file/point-counting.png","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/point-counting.png/_jcr_content/renditions/original.image_file.1024.576.30,0,1402,772.file/point-counting.png","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/point-counting.png/_jcr_content/renditions/original.image_file.1280.720.30,0,1402,772.file/point-counting.png","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/point-counting.png/_jcr_content/renditions/original.image_file.1372.772.30,0,1402,772.file/point-counting.png","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/point-counting.png/_jcr_content/renditions/original.image_file.1372.772.30,0,1402,772.file/point-counting.png"} "蔡司点数工作流")
![蔡司显微硬度工作流]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/microhardness.png/_jcr_content/renditions/original.image_file.100.56.0,31,1428,834.file/microhardness.png","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/microhardness.png/_jcr_content/renditions/original.image_file.360.203.0,31,1428,834.file/microhardness.png","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/microhardness.png/_jcr_content/renditions/original.image_file.768.432.0,31,1428,834.file/microhardness.png","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/microhardness.png/_jcr_content/renditions/original.image_file.1024.576.0,31,1428,834.file/microhardness.png","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/microhardness.png/_jcr_content/renditions/original.image_file.1280.720.0,31,1428,834.file/microhardness.png","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/microhardness.png/_jcr_content/renditions/original.image_file.1428.803.0,31,1428,834.file/microhardness.png","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/microhardness.png/_jcr_content/renditions/original.image_file.1428.803.0,31,1428,834.file/microhardness.png"} "蔡司显微硬度工作流")
![蔡司伪3D显微图工作流]({"xsmall":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/pseudo-3d_micrograph-1.png/_jcr_content/renditions/original.image_file.100.56.0,60,640,420.file/pseudo-3d_micrograph-1.png","small":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/pseudo-3d_micrograph-1.png/_jcr_content/renditions/original.image_file.360.203.0,60,640,420.file/pseudo-3d_micrograph-1.png","medium":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/pseudo-3d_micrograph-1.png/_jcr_content/renditions/original.image_file.640.360.0,60,640,420.file/pseudo-3d_micrograph-1.png","large":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/pseudo-3d_micrograph-1.png/_jcr_content/renditions/original.image_file.640.360.0,60,640,420.file/pseudo-3d_micrograph-1.png","xlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/pseudo-3d_micrograph-1.png/_jcr_content/renditions/original.image_file.640.360.0,60,640,420.file/pseudo-3d_micrograph-1.png","xxlarge":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/pseudo-3d_micrograph-1.png/_jcr_content/renditions/original.image_file.640.360.0,60,640,420.file/pseudo-3d_micrograph-1.png","max":"https://www.zeiss.com/content/dam/rms/reference-master/products/software/zeiss-solutionslab/pseudo-3d_micrograph-1.png/_jcr_content/renditions/original.image_file.640.360.0,60,640,420.file/pseudo-3d_micrograph-1.png"} "蔡司伪3D显微图工作流")
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蔡司解离和表面曝光分析系统
来自采矿业3D表面曝光分析Solutions Lab
用于采矿业，对3D解离和表面区域逐个进行颗粒自动化分析。
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蔡司点数工作流
来自光学显微镜Solutions Lab
确定样品中特定成分或感兴趣物相的估计体积率。
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蔡司晶粒尺寸彩色图工作流
来自晶粒尺寸分布成像Solutions Lab
来自晶粒尺寸分布成像Solutions Lab。
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蔡司伪3D显微图工作流
来自根据2D图像创建3D结构图的Solutions Lab
来自根据2D图像创建3D结构图的Solutions Lab
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用于X射线重构的蔡司DeepRecon
来自处理效率提高10倍的Solutions Lab
用于重复性工作流的蔡司Xradia X射线显微镜。
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蔡司最大双折射投影仪
来自使用光学显微镜的矿物学Solutions Lab
基于自动化岩相光学显微镜的矿物分类工作流。
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