Microchip and conductor tracks

SEMICON Taiwan 2025

ZEISS Semiconductor Tech Forum
Location: 6F, GRAND HILAI TAIPEI (Adress: No. 168, Jingmao 1st Rd., Nangang Dist. Taipei City)
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SEMICON Taiwan 2025

ZEISS Program Highlights

The ZEISS portfolio for Semiconductor Solutions is growing fast.
From Lithography, to photomask solutions, process control and failure analysis: ZEISS is offering pioneering solutions. 

Join us at the Semiconductor Tech Forum during Semicon Taiwan 2025 to learn more about these remarkable advancements to the industry and start the dialog with industry experts. 

The program has been structured into two segments. Please choose and register one event segment, which caters to your specific interest.

We are looking forward to discuss the future with you.

Part 1: ZEISS Solutions for Lithography, Photomasks and Process Control ​

Part 2: ZEISS Solutions for Advanced Packaging and Failure Analysis

Part I | ZEISS Solutions for Lithography, Photomasks and Process Control

12:30 – 13:00

Registration

Pre-registration required

13:00 – 13:05

Opening Remarks

Dr. Thomas Stammler

13:05 – 13:20

SMT Product and Technology Update

Dr. Heiko Feldmann

13:20 – 13:40

Mask Solutions for Advanced Patterning

Dr. Hans Stiepan

13:40 – 13:55

Advancing Process Control in 3D Semiconductor Scaling and Integration: Novel 3D Metrology and Buried Defect Review Techniques

Dr. Eugen Foca

13:55 – 14:10

Multi-Beam SEM / High-Speed Defect Inspection

Noriyuki Kawashima (Guest Speaker from Hitachi High-Tech)
Dr. Dirk Zeidler

14:10 – 15:00

Networking & Session Change

All

Part II | ZEISS Solutions for Advanced Packaging and Failure Analysis

14:45 – 15:00

Registration

Pre-registration required

15:00 – 15:05

Opening Remarks

Dr. Thomas Stammler

15:05 – 15:20

SMT Product and Technology Update

Dr. Heiko Feldmann

15:20 – 15:40

Sneak Peak | Novel solutions from ZEISS supporting Advanced Packaging technology needs

Martin Dietzel

15:40 – 16:00

Advanced packaging FA with 3D X-ray to laser FIB correlative workflow

Charles Lin

16:00 – 16:30

Closing & Networking

All

Picture of Dr. Thomas Stammler
Speaker Dr. Thomas Stammler ZEISS Semiconductor Manufacturing Technology

"Opening Remarks"

Picture of Dr. Heiko Feldmann
Speaker Dr. Heiko Feldmann ZEISS Semiconductor Manufacturing Technology

"SMT Product and Technology Update"

Picture of Dr. Hans Stiepan
Speaker Dr. Hans Stiepan ZEISS Semiconductor Mask Solutions

"Mask Solutions for Advanced Patterning"

Picture of Noriyuki Kawashima
Speaker Noriyuki Kawashima Hitachi High-Tech Corporation

"Multi-Beam SEM / High-Speed Defect Inspection"

Portrait Dr. Eugen Foca
Speaker Dr. Eugen Foca ZEISS Semiconductor Manufacturing Technology

"Advancing Process Control in 3D Semiconductor Scaling and Integration: Novel 3D Metrology and Buried Defect Review Techniques"

Picture of Charles Lin
Speaker Charles Lin ZEISS Research Microscopy Solutions

"Advanced packaging FA with 3D X-ray to laser FIB correlative workflow"

Picture of Dr. Dirk Zeidler
Speaker Dr. Dirk Zeidler ZEISS Semiconductor Manufacturing Technology

"Multi-Beam SEM / High-Speed Defect Inspection"

Picture of Martin Dietzel
Speaker Martin Dietzel ZEISS Semiconductor Manufacturing Technology

"Sneak Peak | Novel solutions from ZEISS supporting Advanced Packaging technology needs"

ZEISS Semiconductor Tech Forum

Registration

When: September 11, 2025 | Where: Grand Hilai Taipei

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Please note, that limited seats are available.

If you want to have more information on data processing at ZEISS, please refer to our data protection notice.

Banner SEMICON Taiwan

Want to get in touch?

Visit our Booth: #J2352 at 1F, TaiNEX 1

We look forward to seeing you!

ZEISS at SEMICON Taiwan 2025

ZEISS is pleased to support SEMICON TAIWAN by sponsoring the following Forums:

IC Forum - Advanced Chip Technology and Manufacturing

Don´t miss the ZEISS presentation on EUV Optics from Heiko Feldmann at 15:10-15:30!

  • AI-Driven Technologies: Powering the Next-Gen Semiconductor Era

CEO Summit

The CEO Summit gathers industry leaders and global partners to explore and redefine the future of the semiconductor supply chain through a unique and insightful lens.

  • Leading with Collaboration. Innovating the World

Strategic Materials Conference Taiwan

SEMICON Taiwan 2025 unites global experts to explore materials innovations driving next-gen semiconductor technologies and applications like AI, HPC, and quantum computing.

  • The Future of Semiconductors: Breakthroughs in Materials Solutions

Images from ZEISS SMT

  • ZEISS Semiconductor Mask Solutions

    Development and manufacturing of high-end photomask solutions

    1 MB
  • ZEISS AIMS® EUV

    AIMS® evaluates defects on masks regarding their impact on the subsequent production process.

    5 MB
  • High-NA-EUV lithography

    The high-precision mirrors from ZEISS for the High-NA-EUV technology are measured in gigantic vacuum chambers with a diameter of five meters.

    5 MB
  • ZEISS mirror for High-NA-EUV lithography

    The world's most precise mirror from ZEISS is installed in the optical system for High-NA-EUV technology.

    6 MB
  • ZEISS EUV illumination system

    ZEISS EUV illumination system made of 15,000 individual parts and weighing 1.5 tons

    3 MB
  • ZEISS sites

    Idyll meets innovation: The SMT headquarters in Oberkochen, Germany

    1 MB
  • ZEISS logo

    1 MB


Jeannine Rapp
Press Contact for ZEISS SMT Jeannine Rapp Head of Communication & Implementation of Group Initiatives