
SEMICON Taiwan 2025
ZEISS Semiconductor Tech Forum- 00 years
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ZEISS Program Highlights
The ZEISS portfolio for Semiconductor Solutions is growing fast.
From Lithography, to photomask solutions, process control and failure analysis: ZEISS is offering pioneering solutions.Â
Join us at the Semiconductor Tech Forum during Semicon Taiwan 2025 to learn more about these remarkable advancements to the industry and start the dialog with industry experts.Â
The program has been structured into two segments. Please choose and register one event segment, which caters to your specific interest.
We are looking forward to discuss the future with you.
Part 1: ZEISS Solutions for Lithography, Photomasks and Process Control ​
Date and Time
Part 2: ZEISS Solutions for Advanced Packaging and Failure Analysis
Date and Time
Part I | ZEISS Solutions for Lithography, Photomasks and Process Control
12:30 – 13:00 |
Registration |
Pre-registration required |
13:00 – 13:05 |
Opening Remarks |
Dr. Thomas Stammler |
13:05 – 13:20 |
SMT Product and Technology Update |
Dr. Heiko Feldmann |
13:20 – 13:40 |
Mask Solutions for Advanced Patterning |
Dr. Hans Stiepan |
13:40 – 13:55 |
Advancing Process Control in 3D Semiconductor Scaling and Integration: Novel 3D Metrology and Buried Defect Review Techniques |
Dr. Eugen Foca |
13:55 – 14:10 |
Multi-Beam SEM / High-Speed Defect Inspection |
Noriyuki Kawashima (Guest Speaker from Hitachi High-Tech) |
14:10 – 15:00 |
Networking & Session Change |
All |
Part II | ZEISS Solutions for Advanced Packaging and Failure Analysis
14:45 – 15:00 |
Registration |
Pre-registration required |
15:00 – 15:05 |
Opening Remarks |
Dr. Thomas Stammler |
15:05 – 15:20 |
SMT Product and Technology Update |
Dr. Heiko Feldmann |
15:20 – 15:40 |
Sneak Peak | Novel solutions from ZEISS supporting Advanced Packaging technology needs |
Martin Dietzel |
15:40 – 16:00 |
Advanced packaging FA with 3D X-ray to laser FIB correlative workflow |
Charles Lin |
16:00 – 16:30 |
Closing & Networking |
All |

"Opening Remarks"

"SMT Product and Technology Update"

"Mask Solutions for Advanced Patterning"

"Multi-Beam SEM / High-Speed Defect Inspection"

"Advancing Process Control in 3D Semiconductor Scaling and Integration: Novel 3D Metrology and Buried Defect Review Techniques"

"Advanced packaging FA with 3D X-ray to laser FIB correlative workflow"

"Multi-Beam SEM / High-Speed Defect Inspection"

"Sneak Peak | Novel solutions from ZEISS supporting Advanced Packaging technology needs"
ZEISS Semiconductor Tech Forum

Want to get in touch?
Visit our Booth: #J2352 at 1F, TaiNEX 1We look forward to seeing you!
ZEISS at SEMICON Taiwan 2025
ZEISS is pleased to support SEMICON TAIWAN by sponsoring the following Forums:
IC Forum - Advanced Chip Technology and Manufacturing
Don´t miss the ZEISS presentation on EUV Optics from Heiko Feldmann at 15:10-15:30!
AI-Driven Technologies: Powering the Next-Gen Semiconductor Era
CEO Summit
The CEO Summit gathers industry leaders and global partners to explore and redefine the future of the semiconductor supply chain through a unique and insightful lens.
Leading with Collaboration. Innovating the World
Strategic Materials Conference Taiwan
SEMICON Taiwan 2025 unites global experts to explore materials innovations driving next-gen semiconductor technologies and applications like AI, HPC, and quantum computing.
The Future of Semiconductors: Breakthroughs in Materials Solutions
Images from ZEISS SMT
