Making complex structures intelligently visible
Future-proof microchip development
Unique in the world
SEM resolution at the coincidence point at 15 kiloelectron volts (keV)
SEM resolution at the coincidence point at 1 kiloelectron volts (keV)
1 nA - 100 pA
SEM beam current
Sample size of the wafers
The scalpel for complex semiconductor structures
The 3D Metrology Workstation from ZEISS
The 3D Metrology Workstation allows the volume of microchips to be sampled, analyzed and validated with nanometer accuracy using FIB tomography. ZEISS relies on a high-resolution 3D imaging process in combination with an intelligent analysis platform.
Randomly exposed wafers are removed from chip production. The Focused Ion Beam (FIB) microscope is the heart – the "scalpel" – of the 3D Metrology Workstation. This focused ion beam cuts out random samples at various points on the wafer, whose three-dimensional nanostructures are then precisely examined using a scanning electron microscope (FIB-SEM).
High resolution 3D display
Overcoming complex process challenges
The highest slicing sharpness in its class for a maximum voxel count (3D resolution). With fully automated volume acquisition, in an extremely wide-angle field of view, and intuitive workflow, the workstation provides valuable insights for metrology and defect detection in the manufacturing of 3D memory chips.