![3D Workstation of ZEISS SMT The 3D Workstation of ZEISS SMT visible as whole machine]({"xsmall":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg/_jcr_content/renditions/original.image_file.100.56.0,131,1500,975.file/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg","small":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg/_jcr_content/renditions/original.image_file.360.203.0,131,1500,975.file/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg","medium":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg/_jcr_content/renditions/original.image_file.768.432.0,131,1500,975.file/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg","large":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg/_jcr_content/renditions/original.image_file.1024.576.0,131,1500,975.file/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg","xlarge":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg/_jcr_content/renditions/original.image_file.1280.720.0,131,1500,975.file/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg","xxlarge":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg/_jcr_content/renditions/original.image_file.1440.810.0,131,1500,975.file/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg","max":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg/_jcr_content/renditions/original.image_file.1500.844.0,131,1500,975.file/3d-metrologie-workstation-zeiss-smt-pcs-version.jpg"})
Making complex structures intelligently visible Future-proof microchip development
Unique in the world
The scalpel for complex semiconductor structures
![3D Tomo of ZEISS SMT An employee of ZEISS SMT works on the 3D Tomo Workstation]({"xsmall":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/zeiss-smt-3d-tomo-metrologie.jpg/_jcr_content/renditions/original.image_file.100.75.67,0,1134,800.file/zeiss-smt-3d-tomo-metrologie.jpg","small":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/zeiss-smt-3d-tomo-metrologie.jpg/_jcr_content/renditions/original.image_file.360.270.67,0,1134,800.file/zeiss-smt-3d-tomo-metrologie.jpg","medium":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/zeiss-smt-3d-tomo-metrologie.jpg/_jcr_content/renditions/original.image_file.768.576.67,0,1134,800.file/zeiss-smt-3d-tomo-metrologie.jpg","large":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/zeiss-smt-3d-tomo-metrologie.jpg/_jcr_content/renditions/original.image_file.1024.768.67,0,1134,800.file/zeiss-smt-3d-tomo-metrologie.jpg","xlarge":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/zeiss-smt-3d-tomo-metrologie.jpg/_jcr_content/renditions/original.image_file.1067.800.67,0,1134,800.file/zeiss-smt-3d-tomo-metrologie.jpg","xxlarge":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/zeiss-smt-3d-tomo-metrologie.jpg/_jcr_content/renditions/original.image_file.1067.800.67,0,1134,800.file/zeiss-smt-3d-tomo-metrologie.jpg","max":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/zeiss-smt-3d-tomo-metrologie.jpg/_jcr_content/renditions/original.image_file.1067.800.67,0,1134,800.file/zeiss-smt-3d-tomo-metrologie.jpg"})
The 3D Metrology Workstation from ZEISS
The 3D Metrology Workstation allows the volume of microchips to be sampled, analyzed and validated with nanometer accuracy using FIB tomography. ZEISS relies on a high-resolution 3D imaging process in combination with an intelligent analysis platform.
Product Highlights
![FIB-SEM combination by ZEISS SMT A graphic of FIB-SEM combination]({"xsmall":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/fib-sem-kombination-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.100.100.59,0,542,483.file/fib-sem-kombination-zeiss-smt-pcs.jpg","small":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/fib-sem-kombination-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.360.360.59,0,542,483.file/fib-sem-kombination-zeiss-smt-pcs.jpg","medium":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/fib-sem-kombination-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.483.483.59,0,542,483.file/fib-sem-kombination-zeiss-smt-pcs.jpg","large":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/fib-sem-kombination-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.483.483.59,0,542,483.file/fib-sem-kombination-zeiss-smt-pcs.jpg","xlarge":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/fib-sem-kombination-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.483.483.59,0,542,483.file/fib-sem-kombination-zeiss-smt-pcs.jpg","xxlarge":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/fib-sem-kombination-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.483.483.59,0,542,483.file/fib-sem-kombination-zeiss-smt-pcs.jpg","max":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/fib-sem-kombination-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.483.483.59,0,542,483.file/fib-sem-kombination-zeiss-smt-pcs.jpg"})
FIB-SEM combination
Randomly exposed wafers are removed from chip production. The Focused Ion Beam (FIB) microscope is the heart – the "scalpel" – of the 3D Metrology Workstation. This focused ion beam cuts out random samples at various points on the wafer, whose three-dimensional nanostructures are then precisely examined using a scanning electron microscope (FIB-SEM).
High resolution 3D display
![3D display of ZEISS SMT A graphic 3D of high resolution of 3D display]({"xsmall":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-darstellung-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.100.100.280,0,1000,720.file/3d-darstellung-zeiss-smt-pcs.jpg","small":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-darstellung-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.360.360.280,0,1000,720.file/3d-darstellung-zeiss-smt-pcs.jpg","medium":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-darstellung-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.720.720.280,0,1000,720.file/3d-darstellung-zeiss-smt-pcs.jpg","large":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-darstellung-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.720.720.280,0,1000,720.file/3d-darstellung-zeiss-smt-pcs.jpg","xlarge":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-darstellung-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.720.720.280,0,1000,720.file/3d-darstellung-zeiss-smt-pcs.jpg","xxlarge":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-darstellung-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.720.720.280,0,1000,720.file/3d-darstellung-zeiss-smt-pcs.jpg","max":"https://www.zeiss.com/content/dam/smt/products/pcs/3d-tomo/3d-darstellung-zeiss-smt-pcs.jpg/_jcr_content/renditions/original.image_file.720.720.280,0,1000,720.file/3d-darstellung-zeiss-smt-pcs.jpg"})
Overcoming complex process challenges
The highest slicing sharpness in its class for a maximum voxel count (3D resolution). With fully automated volume acquisition, in an extremely wide-angle field of view, and intuitive workflow, the workstation provides valuable insights for metrology and defect detection in the manufacturing of 3D memory chips.