
Advancing Correlative Studies in Nanomaterials and Nanoelectronics
Transform Your Sample Prep and Site-specific Analysis
with Efficient Workflows
Micro- and nanomaterials for electronic circuits and packages are critical to improve performance and reduce energy consumption. Continued miniaturization puts forward new requirements for packaging and moves into the nanometer range.
Parallel advances in FIB-SEM and 3D X-ray microscopy have radically changed sample preparation and analysis. This opens new capabilities for semiconductor research, development and failure analysis.
On this page explore:
- Correlative microscopy for micro- and nanoanalysis
- Gain new insights for materials characterization & failure analysis
- Expand your analytical opportunities
Let's get started...
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Identify
Identify your Region of Interest (ROI), Leaving your Sample Intact
Achieve high-res imaging of intact samples.
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Access
Expose the ROI in Your Sample
Go from macro to nano in femtoseconds using a FIB-SEM with integrated fs-laser. Learn how to rapidly access buried interconnects in 3D packages with maximum speed and minimal artifacts.
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Prepare
Prepare Superior Quality Structures Using the GaFIB Column ZEISS Ion-Sculptor
Minimize sample damage, maximize sample quality, prepare for experiments faster. Remove cubic millimeters of material using fs-laser ablation and prepare your sample for the next step.
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Analyze
Fast Time to Result with Efficient Analysis
Analyze and characterize prepared samples using a wide range of analytical techniques including EDS, EBSD, ToF-SIMS, STEM, or in situ kits.
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Explore ↓
Discover the Workflow and Learn How to Find the Needle in the Haystack
Explore correlative microscopy in a brief introduction below and learn more about the various areas of application.
Solve the Multi-Scale Challenge

The Workflow in One Video
Finding the needle in the haystack explained in this video. Enjoy a brief introduction to lastest possibilities with correlative microscopy

Applications in Electronics & Semiconductor
Optimize your material for further production in the electronics area.

Thin Films
Recent developments of nanotechnology have pushed the development of FE-SEMs and FIB-SEMs.
Caption: Co nanoparticles embedded in esoporous silica, STEM-EDS analysis, measured at 30 kV. High resolution EDS mapping of individual Co nanoparticles with approx. 10 nm size are resolved.

Photonics
Discover how an FE-SEM enables research on gold platelets used in sensors and how to prepare TEM samples easily with a FIB-SEM.