ZEISS Dynamics Profiler
ZEISS Software Solutions

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ZEISS@Semicon Europa

Messe München, Halle B0, Am Messesee 2, 81829 München

Enabling new processes for the digital age

Discover ZEISS software solutions

Digital technology is used everywhere in our modern economy. Higher performance and reliability from consumers’ interconnected devices drive the need for semiconductors with greater efficiency and miniaturization. Demand for high-performance, defect-free chips in multiple industries and consumer markets drives accelerated product development to supply a wide range of semiconductor and electronic products. Manufacturers must execute design-to-production cycles of highly complex devices with increasing speed. Intelligent workflows leveraging advanced microscopy solutions and software are required to rapidly resolve issues that critically affect manufacturing yield and device performance. 
Register for a free trade show ticket and visit ZEISS at Semicon Europe 2023 in Hall B0 Booth 708. Semicon will be held in parallel to Productronica, the ticket is valid for both events.


Please note:

  • Online registration in advance is required.
  • The online voucher link can only be redeemed once and is valid for one person at a time.
  • The tickets are only valid during the trade fair times.
  • Print out the ticket or show it mobile.

Comprehensive Portfolio and Intelligent Workflows

Microscopy Systems

FIB-SEM tomography of a 3D NAND sample acquired using ZEISS Crossbeam 550 and Atlas-3D. Sample was depackaged and mechanically polished down to the topmost word line. Shown is a virtual sub-volume of 2 x 1.5 x 0.7 µm3 size, extracted from the dataset at the transition region of upper to lower deck. Reconstructed voxel size 4 x 4 x 4 nm3.

The resulting reconstruction allows for looking at multiple planes of section across the device from any virtual section.

Virtual Reality

Immerse yourself to explore uncharted territories

Visit us and join ZEISS Virtual Reality Experience! Discover Resolution at a Distance with Non-destructive 3D X-ray Imaging and dive into the 3D world of the new ZEISS Xradia 620 Versa with Dual Scan Contrast Visualizer. Xradia 620 Versa unlocks new degrees of versatility for your research and achieves faster time to results for varied sample sizes without compromising resolution. Let Virtual Reality transport you into the heart of the action of ZEISS Crossbeam with combined imaging and analytical performance of a high-resolution field emission scanning electron microscope (FE-SEM) with the processing ability of a next-generation focused ion beam (FIB). Immerse Yourself to explore uncharted territories and step into our Virtual Reality Experience at Semicon 2023!

Semiconductor Industry

Individual software solutions

With our software engineering, we optimise and modernise infrastructures and environmental architectures in the cleanroom. We connect entire production chains, eliminate ineffective isolated solutions and anchor the possibility for cross-location platform architectures on a cloud basis. You benefit from higher quality, production reliability and more efficient use of resources.