Low-kV Scanning Electron Microscopy

Beyond Sample Topography

19 June 2020 · 44 min watch
  • Manufacturing and Assembly
  • Scanning Electron Microscopy
  • Industrial R&D
  • Materials Sciences
Author Iwona Jóźwik, Ph.D. Łukasiewicz Institute of Electronic Materials Technology

Low-kV Scanning Electron Microscopy: Beyond Sample Topography

FIB-SEM allow to obtain morphological, compositional and analytical information from the surface, and cut cross-sections to image beneath the sample surface at the highest resolution. Moreover, this is the perfect tools to prepare specimens for other microscopic techniques such as TEM or STEM.

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