Low-kV Scanning Electron Microscopy

Beyond Sample Topography
JUN 19, 2020 · 44 watch
  • Materials Sciences
  • Manufacturing and Assembly
  • Industrial R&D
  • Scanning Electron Microscopy

Iwona Jóźwik, Ph.D.

Łukasiewicz Institute of Electronic Materials Technology


Low-kV Scanning Electron Microscopy: Beyond Sample Topography

FIB-SEM allow to obtain morphological, compositional and analytical information from the surface, and cut cross-sections to image beneath the sample surface at the highest resolution. Moreover, this is the perfect tools to prepare specimens for other microscopic techniques such as TEM or STEM.

Share this article

Contact for Insights Hub

Further Questions?

Please feel free to contact our experts.

If you want to have more information on data processing at ZEISS please refer to our data privacy notice.