Use Case

Advanced Packaging

Unveil the secrets of advanced semiconductor packaging in our latest exploration.

Discover how 3D integration and novel material use are reshaping electronics, enhancing performance and miniaturization.


Electronics Research

Unveiling Advanced Packaging Potential

  • Advanced Packaging
  • Advanced Packaging
  • Advanced Packaging
  • Advanced Packaging
  • Advanced Packaging
  • Advanced Packaging

Unpacking the Future of Semiconductor Tech

Advanced packaging technologies have revolutionized semiconductor performance, enabling enhanced functionality and miniaturization beyond traditional transistor scaling. This article delves into the cutting-edge 3D heterogeneous integration, spotlighting through-silicon vias (TSVs) and chiplets that facilitate complex system-in-package (SiP) designs. With high-density interconnects and multi-die configurations, advanced packaging addresses the escalating demands for faster and more efficient electronics. We explore how ZEISS's non-destructive 3D X-ray microscopy plays a pivotal role in the characterization and failure analysis of these sophisticated technologies. The integration of artificial intelligence in imaging provides unprecedented insights into defect analysis, improving yield and reliability. The use of femtosecond laser in FIB-SEM enables rapid access to deeply buried features, enhancing the accuracy of defect identification and resolution. Through comprehensive analysis, the article illuminates how these technologies contribute to extending Moore's Law, facilitating faster process development and integration while optimizing yield in semiconductor manufacturing. This narrative not only highlights the technological advancements but also underscores the critical role of innovative microscopy techniques in maintaining the pace of advancements in the semiconductor industry.




Complete your lab

with our new solution bundles

You can enhance your Advanced Packaging Research with the following solutions

High End Microscopy

with the ZEISS Xradia 630 Versa


Discover More with Non-destructive 3D X-ray Imaging at Submicron Resolution

Extremely versatile ZEISS Xradia Versa 3D X-ray microscopes (XRM) provide superior 3D image quality and data for a wide range of materials and working environments. Xradia Versa XRM feature dual-stage magnification based on synchrotron-caliber optics and revolutionary RaaD™ (Resolution at a Distance) technology for high resolution even at large working distances, a vast improvement over traditional micro-computed tomography. Non-destructive imaging preserves and extends the use of your valuable sample, enabling 4D and in situ studies.

Electronics Research Articles